← Back to Patent Explorer
US3301730A Expired / Lapsed US ⏱️ 0.0 years remaining

Method of making a printed circuit

Assignee: Rogers Corp
•
Filing: 1961-04-03
•
Granted: 1967-01-31
•
Expires: 1981-04-03
📄 Original PDF 🌐 Google Patents 🔄 Sync Now

Abstract

No abstract record available.

Inventors

  • 👤 Spiwak Lazarus
  • 👤 George R Traut
  • 👤 Paul L Anderson
  • 👤 John A Zagusta

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-10-24 10:41
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/02; H05K3/04; H05K3/041; H05K1/00; H05K1/02; H05K1/03; H05K1/0393; H05K2203/00; H05K2203/01; H05K2203/0104; H05K2203/0108; H05K2203/13; H05K2203/1305; H05K2203/1327; H05K3/38; H05K3/386; Y; Y10; Y10T; Y10T156/00; Y10T156/10; Y10T156/1052; Y10T156/108; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/49155

Claims Analysis

Total Claims: 2
Claim 1
Independent Claim 166 words
THE METHOD OF PRODUCING A PRINTED CIRCUIT ASSEMBLY WHICH COMPRISES THE STEPS OF APPLYING A THIN CONDUCTIVE METAL DIE-CUT FOIL ON A RELATIVELY THIN, TOUGH AND FLEXIBLE RESIN-COATED SHEET OF INSULATING MATERIAL, PLACING THE FOIL AND FLEXIBLE SHEET ASSEMBLY ON A RESILIENT BASE MEMBER, DIE-STAMPING THE FOIL WITH A DIE TO PROVIDE A PREDETERMINED METAL FOIL CIRCUIT PATTERN ON THE INSULATING SHEET, SAID DIE HAVING A RAISED FACE THEREON SHAPED IN THE FORM OF SAID CIRCUIT PATTERN, AND SAID INSULATING SHEET AND RESILIENT BASE MEMBER IN THE REGION IMMEDIATELY BENEATH SAID RAISED DIE FACE YIELDING SUFFICIENTLY DURING THE DIESTAMPING TO PERMIT THE EDGE OF SAID RAISED DIE FACE TO CUT SAID CIRCUIT PATTERN FROM THE FOIL SHEET WITHOUT INTERRUPTING THE CONTINUOUS SURFACE OF THE INSULATING SHEET, REMOVING THE UNWANTED FOIL DISPOSED ABOUT SAID CUT METAL FOIL CIRCUIT PATTERN FROM THE INSULATING SHEET, REMOVING THE SHEET OF INSULATING MATERIAL FROM SAID RESILIENT BASE MEMBER, AND PERMANENTLY BONDING SAID CUT METAL FOIL CIRCUIT PATTERN TO SAID INSULATING SHEET.
Claim 2
Independent Claim 166 words
THE METHOD OF PRODUCING A PRINTED CIRCUIT ASSEMBLY WHICH COMPRISES THE STEPS OF APPLYING A THIN CONDUCTIVE METAL DIE-CUT FOIL ON A RELATIVELY THIN, TOUGH AND FLEXIBLE RESIN-COATED SHEET OF INSULATING MATERIAL, PLACING THE FOIL AND FLEXIBLE SHEET ASSEMBLY ON A RESILIENT BASE MEMBER, DIE-STAMPING THE FOIL WITH A DIE TO PROVIDE A PREDETERMINED METAL FOIL CIRCUIT PATTERN ON THE INSULATING SHEET, SAID DIE HAVING A RAISED FACE THEREON SHAPED IN THE FORM OF SAID CIRCUIT PATTERN, AND SAID INSULATING SHEET AND RESILIENT BASE MEMBER IN THE REGION IMMEDIATELY BENEATH SAID RAISED DIE FACE YIELDING SUFFICIENTLY DURING THE DIESTAMPING TO PERMIT THE EDGE OF SAID RAISED DIE FACE TO CUT SAID CIRCUIT PATTERN FROM THE FOIL SHEET WITHOUT INTERRUPTING THE CONTINUOUS SURFACE OF THE INSULATING SHEET, REMOVING THE UNWANTED FOIL DISPOSED ABOUT SAID CUT METAL FOIL CIRCUIT PATTERN FROM THE INSULATING SHEET, REMOVING THE SHEET OF INSULATING MATERIAL FROM SAID RESILIENT BASE MEMBER, AND PERMANENTLY BONDING SAID CUT METAL FOIL CIRCUIT PATTERN TO SAID INSULATING SHEET.

References Cited (Backward Citations)

US1646613A Cited
US2431393A Cited
US2622054A Cited
US2647852A Cited
US2969300A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1970-01-30 1970-08-01 1971-01-31 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1974-01-30 1974-08-01 1975-01-31 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 1978-01-30 1978-08-01 1979-01-31 $7700.00 Window Closed / Lapsed

Assigned Categories & Tags

No categories assigned to this patent yet.

Assign Category Tag