Patent US3301730A successfully refreshed from Google Patents.
US3301730A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method of making a printed circuit
Assignee: Rogers Corp
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Filing: 1961-04-03
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Granted: 1967-01-31
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Expires: 1981-04-03
Abstract
No abstract record available.
Inventors
- 👤 Spiwak Lazarus
- 👤 George R Traut
- 👤 Paul L Anderson
- 👤 John A Zagusta
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-26 15:48
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/02; H05K3/04; H05K3/041; H05K1/00; H05K1/02; H05K1/03; H05K1/0393; H05K2203/00; H05K2203/01; H05K2203/0104; H05K2203/0108; H05K2203/13; H05K2203/1305; H05K2203/1327; H05K3/38; H05K3/386; Y; Y10; Y10T; Y10T156/00; Y10T156/10; Y10T156/1052; Y10T156/108; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/49155
Claims Analysis
Total Claims: 2
Claim 1
Independent Claim
166 words
THE METHOD OF PRODUCING A PRINTED CIRCUIT ASSEMBLY WHICH COMPRISES THE STEPS OF APPLYING A THIN CONDUCTIVE METAL DIE-CUT FOIL ON A RELATIVELY THIN, TOUGH AND FLEXIBLE RESIN-COATED SHEET OF INSULATING MATERIAL, PLACING THE FOIL AND FLEXIBLE SHEET ASSEMBLY ON A RESILIENT BASE MEMBER, DIE-STAMPING THE FOIL WITH A DIE TO PROVIDE A PREDETERMINED METAL FOIL CIRCUIT PATTERN ON THE INSULATING SHEET, SAID DIE HAVING A RAISED FACE THEREON SHAPED IN THE FORM OF SAID CIRCUIT PATTERN, AND SAID INSULATING SHEET AND RESILIENT BASE MEMBER IN THE REGION IMMEDIATELY BENEATH SAID RAISED DIE FACE YIELDING SUFFICIENTLY DURING THE DIESTAMPING TO PERMIT THE EDGE OF SAID RAISED DIE FACE TO CUT SAID CIRCUIT PATTERN FROM THE FOIL SHEET WITHOUT INTERRUPTING THE CONTINUOUS SURFACE OF THE INSULATING SHEET, REMOVING THE UNWANTED FOIL DISPOSED ABOUT SAID CUT METAL FOIL CIRCUIT PATTERN FROM THE INSULATING SHEET, REMOVING THE SHEET OF INSULATING MATERIAL FROM SAID RESILIENT BASE MEMBER, AND PERMANENTLY BONDING SAID CUT METAL FOIL CIRCUIT PATTERN TO SAID INSULATING SHEET.
Claim 2
Independent Claim
166 words
THE METHOD OF PRODUCING A PRINTED CIRCUIT ASSEMBLY WHICH COMPRISES THE STEPS OF APPLYING A THIN CONDUCTIVE METAL DIE-CUT FOIL ON A RELATIVELY THIN, TOUGH AND FLEXIBLE RESIN-COATED SHEET OF INSULATING MATERIAL, PLACING THE FOIL AND FLEXIBLE SHEET ASSEMBLY ON A RESILIENT BASE MEMBER, DIE-STAMPING THE FOIL WITH A DIE TO PROVIDE A PREDETERMINED METAL FOIL CIRCUIT PATTERN ON THE INSULATING SHEET, SAID DIE HAVING A RAISED FACE THEREON SHAPED IN THE FORM OF SAID CIRCUIT PATTERN, AND SAID INSULATING SHEET AND RESILIENT BASE MEMBER IN THE REGION IMMEDIATELY BENEATH SAID RAISED DIE FACE YIELDING SUFFICIENTLY DURING THE DIESTAMPING TO PERMIT THE EDGE OF SAID RAISED DIE FACE TO CUT SAID CIRCUIT PATTERN FROM THE FOIL SHEET WITHOUT INTERRUPTING THE CONTINUOUS SURFACE OF THE INSULATING SHEET, REMOVING THE UNWANTED FOIL DISPOSED ABOUT SAID CUT METAL FOIL CIRCUIT PATTERN FROM THE INSULATING SHEET, REMOVING THE SHEET OF INSULATING MATERIAL FROM SAID RESILIENT BASE MEMBER, AND PERMANENTLY BONDING SAID CUT METAL FOIL CIRCUIT PATTERN TO SAID INSULATING SHEET.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1970-01-30 | 1970-08-01 | 1971-01-31 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1974-01-30 | 1974-08-01 | 1975-01-31 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1978-01-30 | 1978-08-01 | 1979-01-31 | $7700.00 | Window Closed / Lapsed |