Patent US5348214A successfully refreshed from Google Patents.
US5348214A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method of mounting semiconductor elements
Assignee: Sumitomo Electric Industries Ltd
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Filing: 1993-02-02
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Granted: 1994-09-20
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Expires: 2013-02-02
Abstract
Abstract A method of mounting a plurality of semiconductor elements each having bump electrodes on a wiring board by pressing the semiconductor elements to the wiring board while aligning the electrodes and heating the structure. In the mounting method, one or more heat sinks are previously joined to the backs opposite to the surfaces with the bump electrodes formed thereon of the semiconductor elements.
Inventors
- 👤 Masanori Nishiguchi
- 👤 Atsushi Miki
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 18:45
CPC Classifications
H; H10; H10W; H10W72/00; H10W72/071; H10W72/072; H10W72/07221; H10W72/07227; H10W72/07231; H10W72/07236; H10W72/07251; H10W72/20; H10W72/241; H10W72/251; H10W72/252; H10W72/851; H10W72/874; H10W72/877; H10W74/00; H10W80/00; H10W80/161; H10W80/168; H10W90/00; H10W90/701; H10W90/721; H10W90/724; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/4913; Y10T29/49146
Claims Analysis
Total Claims: 3
Claim 1
Independent Claim
119 words
A method of mounting semiconductor elements comprising the steps of: providing a plurality of semiconductor elements, each of said semiconductor elements having first and second surfaces and having bump electrodes on said first surface; forming a resist pattern on heat sinks to align said semiconductor elements with said heat sinks; joining said heat sinks to said second surfaces; pressing said semiconductor elements, with said heat sinks joined thereon to a wiring board having electrodes, while aligning said bump electrodes to correspond with the wiring board electrodes; heating said bump electrodes and said wiring board to mount said semiconductor elements on said wiring board; and applying a molding resin to said wiring board, said semiconductor elements and said heat sinks.
Claim 2
Independent Claim
119 words
A method of mounting semiconductor elements comprising the steps of: providing a plurality of semiconductor elements, each of said semiconductor elements having first and second surfaces and having bump electrodes on said first surface; forming a resist pattern on heat sinks to align said semiconductor elements with said heat sinks; joining said heat sinks to said second surfaces; pressing said semiconductor elements, with said heat sinks joined thereon to a wiring board having electrodes, while aligning said bump electrodes to correspond with the wiring board electrodes; heating said bump electrodes and said wiring board to mount said semiconductor elements on said wiring board; and applying a molding resin to said wiring board, said semiconductor elements and said heat sinks.
Claim 3
Dependent Claim
27 words
A method as in claim 1 wherein the wiring board electrodes are concavities and said pressing and electrode aligning includes pressing said bump electrodes into said concavities.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1997-09-19 | 1998-03-21 | 1998-09-20 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2001-09-19 | 2002-03-21 | 2002-09-20 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2005-09-19 | 2006-03-21 | 2006-09-20 | $7700.00 | Window Closed / Lapsed |