Cooling device of semiconductor chips

Claim 2

A cooling device for providing cooling of integrated circuit semiconductor chips by effecting transfer of heat generated in a plurality of semiconductor chips mounted on a circuit substrate to a housing so as to dissipate said heat, comprising a housing; a plurality of separate thermal conductive members each positioned with one side thereof in contact with a back planar surface of a respective semiconductor chip and having the other side thereof positioned in spaced relationship with the housing so as to provide a small clearance between the other side of each thermal conductive member and said housing, each of said thermal conductive members including a base portion having a bottom surface in contact with a back planar surface of the semiconductor chip, the area of said bottom surface being greater than the surface area of said back planar surface of the semiconductor chip, and a plurality of first fins integral with said base portion and extending in a direction perpendicular to said bottom surface; a plurality of second fins each integrally provided with said housing in fitted relation to said plurality of first fins and each of said second fins extending continuously substantially over an entire length of the housing in parallel with each other, each of said plurality of second fins fitting with said first fins of several of said thermal conductive members; and a plurality of resilient members in the form of springs, each of said springs being mounted between a respective one of said thermal conductive members and said housing, each of said springs being inserted in a gap surrounded by the first and second fins and fixedly held in a recess formed in said housing and a recess formed in the center of the base portion of said thermal conductive member; said first and second fins forming a plurality of parallel plate-like members, wherein said plurality of first fins are telescopically movable with respect to said plurality of second fins with a small clearance existing therebetween.

Claim 3

A cooling device for cooling semiconductor chips as claimed in claim 1, wherein said gap is formed by cutting away a portion of said second fins.

Claim 4

A cooling device for cooling semiconductor chips claimed in claim 1, wherein said housing comprises a ceiling member being integrally provided with said plurality of second fins, and a side frame member.

Claim 5

A cooling device for providing cooling of integrated semiconductor chips by effecting transfer of heat generated in a plurality of semiconductor chips mounted on a circuit substrate to a housing so as to dissipate said heat, comprising a housing; a plurality of separate thermal conductive members each contacting at one side thereof a back planar surface of a respective one of said plurality of semiconductor chips and having another side thereof positioned in spaced relationship with the housing so as to provide a small clearance between the other side of each thermal conductive member and said housing, each of said thermal conductive members including a base portion having a bottom surface in contact with the back planar surface of the respective semiconductor chips the area of said bottom surface being greater than the surface area of said back planar surface of the semiconductor chip, and a plurality of first fins integral with said base portion and extending in a direction perpendicular to said bottom surface; a plurality of second fins each integrally provided with said housing in fitted relation to said plurality of first fins and extending continuously substantially over an entire length of the housing and being disposed in parallel with each other, each of said plurality of second fins fitting with said first fins of several of said thermal conductive members; and a plurality of resilient members in the form of springs, each of said springs being mounted between a respective one of said thermal conductive members and said housing, each of said springs being respectively members and said housing, inserted in a gap surrounded by the first and second fins and fixedly held in a recess formed in said housing and a recess formed in the center of the base portion of said thermal conductive members; said first and second fins respectively including a plurality of parallel plate-like members of a thickness in a range of 0.2-2.6 mm, and wherein said plurality of first fins are telescopically movable with respect to said plurality of second fins with a small clearance existing therebetween.

Claim 6

A cooling device for providing cooling of integrated semiconductor chips by effecting transfer of heat generated in a plurality of semiconductor chips mounted on a circuit substrate to a housing so as to dissipate said heat, comprising a housing; a plurality of separate thermal conductive members each contacting at one side thereof a back planar surface of a respective one of said plurality of semiconductor chips and having another side thereof positioned in spaced relationship with the housing so as to provide a small clearance between the other side of each thermal conductive member and said housing, each of said thermal conductive members including a base portion having a bottom surface in contact with the back planar surface of the respective semiconductor chips the area of said bottom surface being greater than the surface area of said back planar surface of the semiconductor chip, and a plurality of first fins integral with said base portion and extending in a direction perpendicular to said bottom surface; a plurality of second fins each integrally provided with said housing in fitted relation to said plurality of first fins and extending continuously substantially over an entire length of the housing and being disposed in parallel with each other, each of said plurality of second fins fitting with said first fins of several of said thermal conductive members; and a plurality of resilient members in the form of springs, each of said springs being mounted between a respective one of said thermal conductive members and said housing, each of said springs being respectively members and said housing, inserted in a gap surrounded by the first and second fins and fixedly held in a recess formed in said housing and a recess formed in the center of the base portion of said thermal conductive members; said first and second fins respectively including a plurality of parallel plate-like members of a thickness in a range of 0.2-2.6 mm, and wherein said plurality of first fins are telescopically movable with respect to said plurality of second fins with a small clearance existing therebetween.