Air cooled multi-chip module having a heat conductive piston spring loaded against the chips

Claim 1

A module having a plurality of chips mounted face down to a substrate comprising; a module cap connected at the edges thereof to said substrate; one or more cylinders formed in said module cap, each centered over the middle chip of a group of chips; cooling fins extending from each of said cylinders; a heat conductive piston located in each of said cylinders forming a small interface between said piston and said cylinders and said piston and said middle chip; a spring member forcing said heat conductive piston against said middle chip; a heat conductive conformal surface flange extending radially from the outer end of each of said pistons so as to have the bottom surface thereof, contacting the exposed surface of said adjacent chips in said group of chips thereby providing parallel conduction cooling from said adjacent chips to said central heat conductive piston; slots located between said adjacent chips in said group of chips extending into said flange from the outer edge thereof forming a flexible contact member in said conformal surface flange for making good surface contact with said adjacent chips regardless of any tilt thereof; and heat conductive spring means connected between said module cap and said contact elements of said flange for providing a seating force against said contact element and providing an additional heat transfer path from the chip.