High power chip cooling device and method of manufacturing same

Claim 3

The method as claimed in claim 1, wherein said step of coating the non-mating planar surfaces of said composite strip with a solder comprises precoating said non-mating planar surfaces of both strips with a solder layer prior to lamination of said strips together to form said composite strip.

Claim 4

The method as claimed in claim 1, further comprising the step of mechanically interlocking said solderable supports such that said supports have limited movement towards and away from each other such that subsequent to the step of removing the adhesive by solvation, the interleaved fins may slide on each other limited to the extent of interlocking between said solderable supports.

Claim 5

The method as claimed in claim 3, further comprising the step of subjecting said solderable supports to a biasing force during the step of removing the adhesive by solvation such that the supports are forced to more away from each other upon destruction of the adhesive bond between the strips forming said composite strip.

Claim 6

The method as claimed in claim 1, further comprising the step of precoating said solderable supports on their opposed faces with solder to facilitate soldering of said folded composite strip at said ridges to said opposed faces of said supports upon heating of the assembled composite strip and supports on opposite sides thereof.

Claim 7

A leaf-type cooling device for semiconductor chip packages manufactured in accordance with the method comprising the steps of: removably laminating two strips of a heat transfer metal together back-to-back with a solvent soluble adhesive to form a composite strip; coating the non-mating exposed planar surfaces of said composite strip with a solder; folding said composite strip in accordion pleated fashion with compacted folds in abutment with one another and forming ridges at the fold lines thereof; positioning said folded composite strip between solderable supports having opposed faces of said supports in contact with respective opposed ridges of said folded composite; heating said composite strip to solder said ridges to respective ones of said supports and to solder adjacent folds of the same strip to each other; and removing said adhesive by solvation in a solvent to form interleaved fins between said supports; thereby producing a low cost, low impedance heat transport device of a minimal number of components which may be subject to standard stamping and forming operations.

Claim 8

A leaf-type cooling device for semiconductor chip packages manufactured in accordance with the method comprising the steps of: removably laminating two strips of a heat transfer metal together back-to-back with a solvent soluble adhesive to form a composite strip; coating the non-mating exposed planar surfaces of said composite strip with a solder; folding said composite strip in accordion pleated fashion with compacted folds in abutment with one another and forming ridges at the fold lines thereof; positioning said folded composite strip between solderable supports having opposed faces of said supports in contact with respective opposed ridges of said folded composite; heating said composite strip to solder said ridges to respective ones of said supports and to solder adjacent folds of the same strip to each other; and removing said adhesive by solvation in a solvent to form interleaved fins between said supports; thereby producing a low cost, low impedance heat transport device of a minimal number of components which may be subject to standard stamping and forming operations.

Claim 9

The cooling device as claimed in claim 6, wherein the step of coating the non-mating planar surfaces of said composite strip assembly with a solder comprises precoating said non-mating planar surfaces of both strips with a solder layer prior to lamination of said strips together to form said composite strip.

Claim 10

The cooling device as claimed in claim 7, further comprising the step of mechanically interlocking said solderable supports to the extent that said supports have limited movement towards and away from each other and applying spring biasing forces tending to move said solderable supports away from each other prior to the step of removing the adhesive by solvation; whereby, at the time the adhesive is dissolved and the bond between the strips is terminated, the interleaved fins slide on each other limited to the extent of interlocking between said solderable supports.