US5203075A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method of bonding flexible circuit to cicuitized substrate to provide electrical connection therebetween using different solders
Assignee: International Business Machines Corp
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Filing: 1991-08-12
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Granted: 1993-04-20
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Expires: 2011-08-12
Abstract
Abstract A method of bonding a flexible circuitized substrate to a circuitized substrate (e.g., printed circuit board) to interconnect selected circuitry of both substrates using solder. Solder paste is applied over conductive pads on the circuitized substrate and organic dewetting material (e.g., epoxy coating) adjacent thereto. The flexible substrate, having conductors located within and/or traversing an aperture in the flexible substrate's dielectric, is positioned above the solder paste and heat is applied (e.g., in an oven). The paste, dewetting from the organic material, "balls up" and substantially surrounds a solder member (ball) attached to a bridging portion of the flexible substrate's conductor, thereby connecting both substrates. A frame member may be used to align the flexible substrate, both during solder member attachment thereto, as well as for aligning the flexible substrate having solder members attached, to the respective solder paste locations on the lower substrate.
Inventors
- 👤 Christopher G. Angulas
- 👤 Patrick T. Flynn
- 👤 Joseph Funari
- 👤 Thomas E. Kindl
- 👤 Randy L. Orr
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-29 23:37
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/60; H10W70/67; H10W70/688; H01; H01R; H01R12/00; H01R12/50; H01R12/51; H01R12/52; H05; H05K; H05K3/00; H05K3/36; H05K3/361; H05K3/363; H10W90/00; H10W90/701; H05K1/00; H05K1/02; H05K1/14; H05K1/141; H05K2201/00; H05K2201/03; H05K2201/0332; H05K2201/0388; H05K2201/0394; H05K2201/10; H05K2201/10431; H05K2201/10439; H05K2201/10477; H05K2201/10613; H05K2201/10621; H05K2201/10666; H05K2201/10681; H05K2201/10734; H05K2201/10954; H05K2201/10984; H05K2201/10992; H05K2203/00; H05K2203/04; H05K2203/041; H05K3/30; H05K3/32; H05K3/34; H05K3/3452; H10W72/00; H10W72/071; H10W72/072; H10W72/07251; H10W72/20; H10W72/241; H10W72/242; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/49126; Y10T29/49128; Y10T29/4913; Y10T29/49144
Claims Analysis
Total Claims: 10
Claim 1
Independent Claim
221 words
A method of bonding first and second circuitized substrates to provide electrical interconnection therebetween, said method comprising: providing at least one conductive pad on a first substrate comprised of an organic dielectric material; providing a quantity of organic dewetting material of a predetermined configuration substantially adjacent said conductive pad; applying a quantity of solder paste holding a first melting point over said conductive paid and at least part of said organic dewetting material; providing a second substrate including a dielectric material having an aperture therein and at least one conductor located within and/or bridging said aperture, said second substrate being flexible in nature; securing a solder member having a second melting point greater than said first melting point to said conductor; stretching said second substrate across a frame and thereafter aligning said second substrate having said solder member secured to said conductor substantially parallel to said first substrate such that said solder member engages said solder paste; heating said first and second substrates to a temperature substantially equal to or above said first melting point but less than said second melting point sufficient to cause said solder paste to dewet from said organic dewetting material and form substantially about said solder member; and thereafter cooling said formed solder to form an electrical interconnection and bond between said first and second substrates.
Claim 2
Independent Claim
221 words
A method of bonding first and second circuitized substrates to provide electrical interconnection therebetween, said method comprising: providing at least one conductive pad on a first substrate comprised of an organic dielectric material; providing a quantity of organic dewetting material of a predetermined configuration substantially adjacent said conductive pad; applying a quantity of solder paste holding a first melting point over said conductive paid and at least part of said organic dewetting material; providing a second substrate including a dielectric material having an aperture therein and at least one conductor located within and/or bridging said aperture, said second substrate being flexible in nature; securing a solder member having a second melting point greater than said first melting point to said conductor; stretching said second substrate across a frame and thereafter aligning said second substrate having said solder member secured to said conductor substantially parallel to said first substrate such that said solder member engages said solder paste; heating said first and second substrates to a temperature substantially equal to or above said first melting point but less than said second melting point sufficient to cause said solder paste to dewet from said organic dewetting material and form substantially about said solder member; and thereafter cooling said formed solder to form an electrical interconnection and bond between said first and second substrates.
Claim 3
Dependent Claim
27 words
The method according to claim 1 wherein said solder paste is applied over said conductive pad and part of said organic dewetting material using a screening process.
Claim 4
Dependent Claim
45 words
The method according to claim 1 further including the step of positioning said solder member within a container prior to securing said member to said conductor and thereafter aligning said solder member relative to said conductor to cause said solder member to engage said conductor.
Claim 5
Dependent Claim
26 words
The method according to claim 3 further including the step of heating said solder member to a predetermined temperature to effect said securement to said conductor.
Claim 6
Dependent Claim
25 words
The method according to claim 4 wherein said predetermined temperature is within the range of from about 300 degrees C. to about 350 degrees C.
Claim 7
Dependent Claim
45 words
The method according to claim 1 wherein said first and second substrates are heated to a temperature within the range of from about 170 degrees C. to about 225 degrees C. to cause said solder paste to dewet and form substantially about said solder member.
Claim 8
Dependent Claim
26 words
The method according to claim 6 wherein said substrates are heated to said temperature for a period of from about 1.5 minutes to about 5 minutes.
Claim 9
Dependent Claim
26 words
The method according to claim 6 further including the step of placing said first and second substrates within an oven, said heating occurring within said oven.
Claim 10
Dependent Claim
24 words
The method according to claim 1 further including the step of attaching said frame having said second substrate stretched thereacross to said first substrate.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1996-04-19 | 1996-10-19 | 1997-04-20 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2000-04-19 | 2000-10-19 | 2001-04-20 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2004-04-19 | 2004-10-19 | 2005-04-20 | $7700.00 | Window Closed / Lapsed |