US4605153A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Shaped solder pad for reflow soldering of surface mounting cylindrical devices on a circuit board
Assignee: Nortel Networks Ltd
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Filing: 1985-06-17
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Granted: 1986-08-12
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Expires: 2005-06-17
Abstract
Abstract A solder pad is provided at each end of a mounting position for a cylindrical electronic device on a circuit board. Each solder pad has two humps of solder spaced apart in a direction normal to the axis of the device, the humps defining a channel in which the end of a device can rest prior to being reflow soldered. The humps have a convex arcuate outer surface in plan view and when viewed in a direction parallel to the axis of the device has a profile which is of convex arcuate form. The humps are formed by depositing a thick patch of solder paste at each hump position and heating the circuit board and solder paste to melt the paste. After positioning of devices, the solder is reflowed to attach the devices.
Inventors
- 👤 Jacques Van Den Brekel
- 👤 Thomas K. Y. Ho
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-30 18:14
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/30; H05K3/32; H05K3/34; H05K3/341; H05K3/3431; H05K3/3442; H05K3/3465; H05K3/3485; H05K1/00; H05K1/02; H05K1/11; H05K1/111; H05K2201/00; H05K2201/09; H05K2201/09209; H05K2201/09654; H05K2201/09663; H05K2201/10; H05K2201/10431; H05K2201/10583; H05K2203/00; H05K2203/04; H05K2203/043; H05K2203/0465; H05K2203/048; H05K2203/05; H05K2203/0502; H05K2203/0545; Y; Y02; Y02P; Y02P70/00; Y02P70/50
Claims Analysis
Total Claims: 5
Claim 1
Independent Claim
182 words
A mounting position for mounting a cylindrical surface mounting device on a surface of a circuit board by reflow soldering, comprising two shaped solder pads spaced apart on said surface along an axis, each solder pad having two spaced humps of solder, the humps spaced apart in a direction normal to said axis and defining a channel in which an end of the device can rest prior to reflow soldering, said channel also being of solder; each pad having a straight inner edge extending normal to said axis, the humps each having a convex arcuate outer edge extending along said surface away from said inner edge in a direction parallel to said axis and each hump having a convex arcuate shape viewed in cross-section in a plane normal to said surface and to said axis; the channels being aligned on said axis, the solder pads being spaced along said axis a distance whereby the ends of the device overlie said channels, the end surfaces of the device positioned outside of an outer surface of each channel and inside said arcuate outer edges.
Claim 2
Dependent Claim
182 words
A mounting position for mounting a cylindrical surface mounting device on a surface of a circuit board by reflow soldering, comprising two shaped solder pads spaced apart on said surface along an axis, each solder pad having two spaced humps of solder, the humps spaced apart in a direction normal to said axis and defining a channel in which an end of the device can rest prior to reflow soldering, said channel also being of solder; each pad having a straight inner edge extending normal to said axis, the humps each having a convex arcuate outer edge extending along said surface away from said inner edge in a direction parallel to said axis and each hump having a convex arcuate shape viewed in cross-section in a plane normal to said surface and to said axis; the channels being aligned on said axis, the solder pads being spaced along said axis a distance whereby the ends of the device overlie said channels, the end surfaces of the device positioned outside of an outer surface of each channel and inside said arcuate outer edges.
Claim 3
Dependent Claim
34 words
A mounting position as claimed in claim 1, each hump having an outer edge of approximately parabolic shape and having a profile, viewed in a direction parallel to said axis, of substantially parabolic shape.
Claim 4
Independent Claim
185 words
A method of using a shaped solder pad mounting position for reflow soldering a cylindrical component on a circuit board, comprising: defining a circuit pattern on a surface of a circuit board; tin plating the circuit pattern; applying solder paste on said circuit pattern at mounting positions for cylindrical surface mounting devices, the solder paste being deposited in two humps at each end of said position; heating said circuit board and melting said solder paste to form two spaced solder pads, spaced apart on said surface along an axis, each solder pad having a straight inner edge extending normal to said axis and two humps of solder, the humps spaced apart in a direction normal to said axis and defining a channel in which an end of the device can be positioned prior to reflow soldering, and also forming a layer of solder at said channel; the humps each having a convex arcuate outer edge extending along said surface away from said inner edge in a direction parallel to said axis and a convex arcuate profile when viewed in a direction normal to said axis.
Claim 5
Independent Claim
185 words
A method of using a shaped solder pad mounting position for reflow soldering a cylindrical component on a circuit board, comprising: defining a circuit pattern on a surface of a circuit board; tin plating the circuit pattern; applying solder paste on said circuit pattern at mounting positions for cylindrical surface mounting devices, the solder paste being deposited in two humps at each end of said position; heating said circuit board and melting said solder paste to form two spaced solder pads, spaced apart on said surface along an axis, each solder pad having a straight inner edge extending normal to said axis and two humps of solder, the humps spaced apart in a direction normal to said axis and defining a channel in which an end of the device can be positioned prior to reflow soldering, and also forming a layer of solder at said channel; the humps each having a convex arcuate outer edge extending along said surface away from said inner edge in a direction parallel to said axis and a convex arcuate profile when viewed in a direction normal to said axis.
References Cited (Backward Citations)
US3778530A
Cited
US4376505A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1989-08-11 | 1990-02-10 | 1990-08-12 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1993-08-11 | 1994-02-10 | 1994-08-12 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1997-08-11 | 1998-02-10 | 1998-08-12 | $7700.00 | Window Closed / Lapsed |