US4376505A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Methods for applying solder to an article
Assignee: AT&T Inc
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Filing: 1981-01-05
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Granted: 1983-03-15
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Expires: 2001-01-05
Abstract
Abstract A thick solder blob (56) is bonded to a land area 34 on a metallized substrate (31) by (a) depositing a thick layer of solder paste on the land area; (b) confining the solder paste with a hard material; and (c) reflowing the solder paste to bond the solder blob (56) to the land area (34) while maintaining the thickness thereof.
Inventors
- 👤 Thaddeus Wojcik
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-24 12:49
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/099; H05; H05K; H05K3/00; H05K3/30; H05K3/32; H05K3/34; H05K3/3465; H05K3/3485; H05K2201/00; H05K2201/10; H05K2201/10613; H05K2201/10954; H05K2201/10977; H05K2203/00; H05K2203/04; H05K2203/043; H05K2203/0465; H05K2203/07; H05K2203/0756; H05K2203/0769
Claims Analysis
Total Claims: 6
Claim 1
Independent Claim
77 words
A method of forming a thick deposit of solder on an electrically conductive portion of a metallized substrate, the method comprising the steps of: (a) forming a thick layer of cured solder paste on the conductive portion; (b) applying a hard coating over said cured solder paste to confine the thick layer of cured solder paste; (c) reflowing the solder, while confined, to bond the solder to the conductive portion; and (d) removing the hard confining coating.
Claim 2
Independent Claim
77 words
A method of forming a thick deposit of solder on an electrically conductive portion of a metallized substrate, the method comprising the steps of: (a) forming a thick layer of cured solder paste on the conductive portion; (b) applying a hard coating over said cured solder paste to confine the thick layer of cured solder paste; (c) reflowing the solder, while confined, to bond the solder to the conductive portion; and (d) removing the hard confining coating.
Claim 3
Independent Claim
90 words
A method of forming a thick deposit of solder on an electrically conductive portion of a metallized substrate, the method comprising the steps of: (a) depositing a thick layer of solder paste on the conductive portion; (b) subjecting the thick layer of solder paste to an elevated temperature to cure said paste; (c) applying a hardenable coating to the cured solder paste; (d) hardening the coating; (e) reflowing the solder, while confined within the hardened coating, to bond the solder to the conductive portion; and (f) removing the hard coating.
Claim 4
Independent Claim
90 words
A method of forming a thick deposit of solder on an electrically conductive portion of a metallized substrate, the method comprising the steps of: (a) depositing a thick layer of solder paste on the conductive portion; (b) subjecting the thick layer of solder paste to an elevated temperature to cure said paste; (c) applying a hardenable coating to the cured solder paste; (d) hardening the coating; (e) reflowing the solder, while confined within the hardened coating, to bond the solder to the conductive portion; and (f) removing the hard coating.
Claim 5
Independent Claim
100 words
A method of bonding a thick, upstanding, solder blob on an electrically conductive land area of a metallized substrate, the method comprising the steps of: (a) depositing a thick, upstanding, solder paste blob on the land area; (b) curing the solder paste blob at an elevated temperature for a predetermined time; (c) coating the solder paste blob with a hardenable material; (d) curing the coating to harden the material; (e) reflowing the coated solder to bond the solder blob to the land area; and (f) removing the hardened coating, leaving a thick upstanding solder blob bonded to the land area.
Claim 6
Independent Claim
100 words
A method of bonding a thick, upstanding, solder blob on an electrically conductive land area of a metallized substrate, the method comprising the steps of: (a) depositing a thick, upstanding, solder paste blob on the land area; (b) curing the solder paste blob at an elevated temperature for a predetermined time; (c) coating the solder paste blob with a hardenable material; (d) curing the coating to harden the material; (e) reflowing the coated solder to bond the solder blob to the land area; and (f) removing the hardened coating, leaving a thick upstanding solder blob bonded to the land area.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1986-03-14 | 1986-09-13 | 1987-03-15 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1990-03-14 | 1990-09-13 | 1991-03-15 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1994-03-14 | 1994-09-13 | 1995-03-15 | $7700.00 | Window Closed / Lapsed |