Multilayer flexible printed circuit tape

Claim 2

A multilayer flexible printed circuit tape having conductive attachment leads terminating in a mutual plane comprising: a first flexible printed circuit top tape, said top tape comprising a first dielectric carrier having at least one device aperture for receiving a semiconductor device, a plurality of connection apertures and a plurality of indexing apertures therein, a first flexible conductive foil pattern bonded to the top of said top tape comprising a plurality of inner flexible conductive fingers extending over said device aperture and a plurality of outer flexible conductive leads extending over said connection apertures, a semiconductor device positioned in said device aperture and having a plurality of conductive lead-out pads thereon connected to said inner conductive fingers of said first conductive foil pattern, a second flexible printed circuit bottom tape, said bottom tape comprising a second dielectric carrier comprising a plurality of connection apertures and a plurality of indexing apertures therein, said apertures having the same location pattern as said aperture in said top tape, an adhesive layer bonding the top of said second dielectric carrier to the bottom of said first dielectric carrier to form a laminate therewith, a second flexible conductive foil pattern bonded to the bottom of said bottom tape comprising a plurality of intermediate flexible conductive paths thereon, and a plurality of said outer flexible leads on said top tape extending through said connection apertures of said tapes and being bonded to said individual conductive leads on said bottom tape to provide a multilayer printed circuit tape.

Claim 3

A multilayer flexible printed circuit tape as set forth in claim 1 wherein said first flexible conductive foil pattern further includes, a plurality of intermediate flexible conductive paths, and a plurality of discrete components connected to some of said intermediate flexible conductive paths to form an electronic circuit module therewith.

Claim 4

A multilayer flexible printed circuit tape as set forth in claim 1 wherein one of said flexible conductive foil patterns further includes, a plurality of intermediate flexible conductive paths, and a plurality of discrete components connected to some of said intermediate flexible conductive paths to form an electronic circuit module therewith.

Claim 5

A multilayer flexible printed circuit tape as set forth in claim 3 wherein one of said discrete components comprises a display mounted on a flexible tape which is mounted on said multilayer flexible printed circuit tape.

Claim 6

A multilayer flexible printed circuit tape as set forth in claim 3 which further includes a case for holding said module, and a frame for retaining said module in said case,

Claim 7

A multilayer flexible printed circuit as set forth in claim 5 which further includes a first polarity battery terminal connection connected to at least one of said plurality of said flexible conductive leads of said bottom tape.

Claim 8

A multilayer flexible printed circuit tape as set forth in claim 6 wherein at least one other of said plurality of said intermediate flexible conductive paths comprises a second polarity battery terminal connection.

Claim 9

A multilayer flexible printed circuit tape as set forth in claim 3 which further includes a trimmer capacitor comprising one of said conductive foil patterns bonded to one of said dielectric tapes.

Claim 12

A multilayer flexible printed circuit tape having conductive attachment leads for interconnecting a plurality of active components comprising: a first flexible printed circuit top tape, said top tape comprising a first dielectric carrier having a plurality of device apertures therein for receiving active semiconductor devices and a plurality of indexing apertures, a first flexible conductive foil pattern bonded to the top of said top tape comprising a plurality of inner flexible conductive fingers each extending over one of said device apertures and a plurality of outer flexible conductive leads, semiconductor devices positioned in said apertures and having at least one lead-out pads thereon connected to said inner conductive fingers of said first conductive foil pattern a second flexible printed circuit bottom tape, said bottom tape comprising a second dielectric carrier having a plurality of device apertures therein for receiving active semiconductor devices and a plurality of indexing apertures, said apertures in said bottom tape having the same location pattern as said apertures in said top tape, an adhesive layer bonding the top of said bottom tape to the bottom of said top tape to form a multilayer laminate therewith, a second flexible conductive foil pattern bonded to the bottom of said bottom tape comprising a plurality of intermediate flexible conductive paths thereon, and at least one terminal lead-out pad on the bottom of said semiconductor devices, said plurality of intermediate flexible conductive paths on said second flexible conductive foil pattern being bonded to said terminal lead-out pad to form an assembled circuit between said terminal lead out pad and said outer flexible conductive leads.

Claim 13

A multilayer flexible printed circuit tape having conductive attachment leads for interconnecting a plurality of active components comprising: a first flexible printed circuit top tape, said top tape comprising a first dielectric carrier having a plurality of device apertures therein for receiving active semiconductor devices and a plurality of indexing apertures, a first flexible conductive foil pattern bonded to the top of said top tape comprising a plurality of inner flexible conductive fingers each extending over one of said device apertures and a plurality of outer flexible conductive leads, semiconductor devices positioned in said apertures and having at least one lead-out pads thereon connected to said inner conductive fingers of said first conductive foil pattern a second flexible printed circuit bottom tape, said bottom tape comprising a second dielectric carrier having a plurality of device apertures therein for receiving active semiconductor devices and a plurality of indexing apertures, said apertures in said bottom tape having the same location pattern as said apertures in said top tape, an adhesive layer bonding the top of said bottom tape to the bottom of said top tape to form a multilayer laminate therewith, a second flexible conductive foil pattern bonded to the bottom of said bottom tape comprising a plurality of intermediate flexible conductive paths thereon, and at least one terminal lead-out pad on the bottom of said semiconductor devices, said plurality of intermediate flexible conductive paths on said second flexible conductive foil pattern being bonded to said terminal lead-out pad to form an assembled circuit between said terminal lead out pad and said outer flexible conductive leads.

Claim 14

A multilayer flexible printed circuit tape as set forth in claim 10 wherein said plurality of intermediate flexible conductive paths comprise continuous foil terminal pads covering the bottom of said semiconductor devices.

Claim 15

A multilayer flexible printed circuit tape as set forth in claim 10 which further comprises: a plurality of connection apertures in said top tape and said bottom tape, a plurality of outer flexible leads on said first flexible conductive foil pattern, said outer flexible leads extending through said connection apertures of said tapes and being bonded to individual ones of said intermediate flexible conductive paths on said second flexible conductive foil pattern.