US3739232A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Interconnected electrical circuit board assembly and method of fabrication
Assignee: Northrop Grumman Corp
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Filing: 1972-04-10
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Granted: 1973-06-12
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Expires: 1992-04-10
Abstract
Abstract An electrical circuit board assembly is formed by first depositing a conductive material on a substrate which forms both a ground and a heat sink for components subsequently mounted thereon. A cavity pattern is then formed in a dielectric material placed over the conductive layer to form an alignment plate, the pattern in the plate being designed to receive various components which are placed therein. An etched circuit board which has apertures therein corresponding to the cavities in the alignment plate and having beam leads extending into these apertures and from the edges thereof, is placed over the alignment plate in alignment therewith, with the beam leads contacting corresponding terminals on the components mounted in the cavities. With the components resting on the conductive layer in the cavities but not attached thereto, and with the beam leads contacting but not attached to the component terminals, the unit is tested both electrically and mechanically and any faulty components replaced. After all testing and replacement of faulty components has been completed, the components are bonded in their aligned positions to the conductive layer on the substrate and the beam leads are bonded to associated terminals of the components.
Inventors
- 👤 N Grossman
- 👤 K Heid
- 👤 R Pittman
- 👤 Dougall R Mac
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-24 07:44
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/60; H05; H05K; H05K1/00; H05K1/02; H05K1/0266; H05K1/0268; H05K1/18; H05K1/182; H10W40/00; H10W40/10; H10W46/00; H10W70/611; H10W72/00; H05K1/0201; H05K1/0203; H05K1/021; H05K1/0269; H05K2201/00; H05K2201/03; H05K2201/0332; H05K2201/0388; H05K2201/0397; H05K2203/00; H05K2203/16; H05K2203/166; H05K3/00; H05K3/0058; H10W46/301; H10W46/601; H10W70/67; H10W70/68; H10W70/682; H10W70/685; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49004; Y10T29/49117; Y10T29/49121; Y10T29/49124; Y10T29/49128
Claims Analysis
Total Claims: 9
Claim 1
Independent Claim
162 words
A method for fabricating an interconnected electrical circuit board assembly comprising the steps of: forming a conductive heat sink and ground layer on a dielectric substrate, forming an alignment plate over said conductive layer, said alignment plate being of a dielectric material and having cavities formed therein in a predetermined pattern for receiving components of said assembly, placing the components in said cavities in predetermined aligned positions, bonding said components to said conductive layer, forming an etched circuit board with cavities therein corresponding to the cavities in said alignment plate, said etched circuit board having beam leads extending into said cavities, placing said etched circuit board over said alignment plate with the cavities thereof aligned with the cavities of said alignment plate, bending said beam leads so that they make electrical contact with corresponding terminals of said components, testing the operation of the assembly, and bonding said beam leads to the component terminals and said etched circuit board to the alignment plate.
Claim 2
Independent Claim
162 words
A method for fabricating an interconnected electrical circuit board assembly comprising the steps of: forming a conductive heat sink and ground layer on a dielectric substrate, forming an alignment plate over said conductive layer, said alignment plate being of a dielectric material and having cavities formed therein in a predetermined pattern for receiving components of said assembly, placing the components in said cavities in predetermined aligned positions, bonding said components to said conductive layer, forming an etched circuit board with cavities therein corresponding to the cavities in said alignment plate, said etched circuit board having beam leads extending into said cavities, placing said etched circuit board over said alignment plate with the cavities thereof aligned with the cavities of said alignment plate, bending said beam leads so that they make electrical contact with corresponding terminals of said components, testing the operation of the assembly, and bonding said beam leads to the component terminals and said etched circuit board to the alignment plate.
Claim 3
Dependent Claim
39 words
The method of claim 1 and further including the step of forming alignment apertures in said alignment plate at the same time the cavities are formed therein, said alignment apertures being utilized for aligning the components in said cavities.
Claim 4
Dependent Claim
28 words
The method of claim 1 and further including the step of forming separate conductive lands in said conductive layer prior to the forming of the alignment plate thereover.
Claim 5
Dependent Claim
25 words
The method of claim 1 and further including the step of electrically and physically checking the components before they are bonded to the conductive layer.
Claim 6
Dependent Claim
34 words
The method of claim 1 and further including the step of forming beam leads which extend over the outer edges of said etched circuit board for use in making external connections to the assembly.
Claim 7
Dependent Claim
176 words
An electrical circuit board assembly comprising: a substrate plate of dielectric material, a conductive layer on said substrate plate, said conductive layer having isolated land portions formed therein, said conductive layer serving to provide heat sinks and grounds for said assembly, an alignment plate on said conductive layer, said alignment plate being Of a dielectric material and having a plurality of cavities formed therein, said alignment further having apertures formed along the sides of said cavities to provide alignment markers, components placed within said cavities in alignment with said markers, said components being bonded to the conductive layer, and an etched circuit board having cavities formed therein corresponding to the cavities in said alignment plate, said etched circuit board further having beam leads which extend into said cavities to provide interconnections between said etched circuit board and said components, said etched circuit board being bonded to said alignment plate, the cavities of said circuit board being in alignment with the corresponding cavities of said alignment plate and the beam leads thereof being connected to the components.
Claim 8
Dependent Claim
176 words
An electrical circuit board assembly comprising: a substrate plate of dielectric material, a conductive layer on said substrate plate, said conductive layer having isolated land portions formed therein, said conductive layer serving to provide heat sinks and grounds for said assembly, an alignment plate on said conductive layer, said alignment plate being Of a dielectric material and having a plurality of cavities formed therein, said alignment further having apertures formed along the sides of said cavities to provide alignment markers, components placed within said cavities in alignment with said markers, said components being bonded to the conductive layer, and an etched circuit board having cavities formed therein corresponding to the cavities in said alignment plate, said etched circuit board further having beam leads which extend into said cavities to provide interconnections between said etched circuit board and said components, said etched circuit board being bonded to said alignment plate, the cavities of said circuit board being in alignment with the corresponding cavities of said alignment plate and the beam leads thereof being connected to the components.
Claim 9
Dependent Claim
32 words
The electrical circuit board assembly of claim 6 wherein said etched circuit board further includes beam leads extending over the outer edges thereof for use in making external connections to said assembly.
References Cited (Backward Citations)
No citation records indexed.
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1976-06-11 | 1976-12-11 | 1977-06-12 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1980-06-11 | 1980-12-11 | 1981-06-12 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1984-06-11 | 1984-12-11 | 1985-06-12 | $7700.00 | Window Closed / Lapsed |