US5243222A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Copper alloy metallurgies for VLSI interconnection structures
Assignee: GlobalFoundries Inc
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Filing: 1992-01-08
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Granted: 1993-09-07
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Expires: 2012-01-08
Abstract
Abstract A method for providing vias, lines and other recesses in VLSI interconnection structures with copper alloys to create a thin layer of an oxide of an alloying element on the surface of the deposited alloy and on portions of the alloy which are in contact with an oxygen containing dielectric is disclosed. The present invention is also directed to VLSI interconnection structures which utilize this copper alloy and thin oxide layer in their vias, lines and other recesses. The oxide layer eliminates the need for diffusion barrier and/or adhesion layers and provides corrosion resistance for the deposited copper alloy. VLSI devices utilizing this copper alloy in the vias, lines and other recesses interconnecting semiconductor regions, devices and conductive layers on the VLSI device are significantly improved.
Inventors
- 👤 James M. E. Harper
- 👤 Karen L. Holloway
- 👤 Thomas Y. Kwok
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-30 23:51
CPC Classifications
H; H10; H10W; H10W20/00; H10W20/01; H10W20/071; H10W20/074; H10W20/076; H10W20/031; H10W20/056; H10W20/057; H10W20/064; H10W20/065; H10W20/077; H10W20/40; H10W20/41; H10W20/425; H10W20/44; H10W20/4403; H10W20/4421; H10W20/4424
Claims Analysis
Total Claims: 8
Claim 1
Independent Claim
91 words
A VLSI interconnection structure comprising: a substrate having at least one oxygen containing dielectric layer formed on one main planar surface of said substrate; and a conductive plug formed in a recess defined in said oxygen containing dielectric, said conductive plug comprising a copper alloy of copper and an alloying element of less than 2.0 atomic percent, and a thin layer of an oxide of said alloying element formed on an exposed surface of said copper alloy and on surfaces of said copper alloy in contact with said oxygen containing dielectric.
Claim 2
Dependent Claim
91 words
A VLSI interconnection structure comprising: a substrate having at least one oxygen containing dielectric layer formed on one main planar surface of said substrate; and a conductive plug formed in a recess defined in said oxygen containing dielectric, said conductive plug comprising a copper alloy of copper and an alloying element of less than 2.0 atomic percent, and a thin layer of an oxide of said alloying element formed on an exposed surface of said copper alloy and on surfaces of said copper alloy in contact with said oxygen containing dielectric.
Claim 3
Dependent Claim
24 words
The structure of claim 1, wherein said oxygen containing dielectric layer comprises a dielectric selected from the group consisting of silicon dioxide and polyimide.
Claim 4
Dependent Claim
21 words
The structure of claim 1, wherein said alloying element comprises an element selected from the group consisting of chromium and aluminum.
Claim 5
Dependent Claim
24 words
The structure of claim 1, wherein said thin oxide layer comprises an oxide selected from the group consisting of chromium oxide and aluminum oxide.
Claim 6
Dependent Claim
10 words
The structure of claim 1, wherein said substrate comprises copper.
Claim 7
Dependent Claim
66 words
The structure of claim 1, wherein said substrate further comprises: a refractory metal barrier layer formed at the bottom of the recess and in contact with a bottom surface of said plug and a portion of an upper surface of said substrate; and a metal silicide layer formed in an upper portion of said substrate and in contact with a bottom surface of said barrier layer.
Claim 8
Dependent Claim
10 words
The structure of claim 1, wherein said substrate comprises silicon.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1996-09-06 | 1997-03-08 | 1997-09-07 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2000-09-06 | 2001-03-08 | 2001-09-07 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2004-09-06 | 2005-03-08 | 2005-09-07 | $7700.00 | Window Closed / Lapsed |