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Physical vapor deposition dual coating process

Assignee: Hauzer Industries BV
•
Filing: 1988-08-25
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Granted: 1993-08-10
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Expires: 2008-08-25
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Abstract

Abstract A machine for covering a substrate (FIG. 14, 540) by means of both cathodic arc plasma deposition (CAPD) (FIG. 2) and magnetron sputtering (FIG. 1) without breaking vacuum in a single chamber (FIG. 14, 421). A computer system monitors (FIG. 3, 403, 405) and controls all coating process parameters to coat in any sequence multiple thin film layers using either the CAPD or magnetron sputtering process. A rotating substrate table (FIG. 14, 470) used in conjunction with internal and external targets coats both sides of the substrate simultaneously.

Inventors

  • 👤 Harbhajan S. Randhawa
  • 👤 Jeffrey M. Buske

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-11-08 12:07
CPC Classifications
C; C23; C23C; C23C14/00; C23C14/22; C23C14/24; C23C14/50; C23C14/505; C23C14/32; C23C14/325; C23C14/34; C23C14/35

Claims Analysis

Total Claims: 7
Claim 1
Independent Claim 102 words
A method for sequentially depositing discrete first and second thin film coatings on a substrate, comprising the steps of: a) placing the substrate in a chamber; b) evacuating the chamber; c) activating a CAPD target/cathode in the chamber; d) depositing one of said thin film coatings by CAPD on the substrate; e) deactivating said CAPD target/cathode; f) injecting a process gas into the chamber; g) activating a magnetron sputtering target/cathode in the chamber after said CAPD target/cathode is deactivated; h) creating a plasma discharge in the chamber; and i) depositing one of said thin film coatings by magnetron sputtering on the substrate.
Claim 2
Independent Claim 102 words
A method for sequentially depositing discrete first and second thin film coatings on a substrate, comprising the steps of: a) placing the substrate in a chamber; b) evacuating the chamber; c) activating a CAPD target/cathode in the chamber; d) depositing one of said thin film coatings by CAPD on the substrate; e) deactivating said CAPD target/cathode; f) injecting a process gas into the chamber; g) activating a magnetron sputtering target/cathode in the chamber after said CAPD target/cathode is deactivated; h) creating a plasma discharge in the chamber; and i) depositing one of said thin film coatings by magnetron sputtering on the substrate.
Claim 3
Dependent Claim 36 words
The method for depositing multiple thin film coatings on a substrate in claim 1, further comprising the steps of: (i) cooling the chamber; (j) controlling all the foregoing process steps by means of a computer system.
Claim 4
Dependent Claim 27 words
The method for depositing multiple thin film coatings on a substrate in claim 1, further comprising the steps of: (k) shielding the CAPD droplets from the substrate.
Claim 5
Dependent Claim 35 words
The method for depositing multiple thin film coatings on a substrate in claim 1, further comprising the steps of: (l) controlling the thin CAPD film to be substantially the same luster and color as gold.
Claim 6
Dependent Claim 34 words
The method for depositing multiple thin film coatings on a substrate in claim 1, further comprising the steps of: (m) controlling the thin sputtering film to be firmly adhered to the thin CAPD film.
Claim 7
Dependent Claim 36 words
The method for depositing multiple thin film coatings on a substrate in claim 1, wherein the chamber vacuum is not broken between the CAPD deposition and the sputtering deposition except by injecting of the process gas.

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1996-08-09 1997-02-08 1997-08-10 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 2000-08-09 2001-02-08 2001-08-10 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 2004-08-09 2005-02-08 2005-08-10 $7700.00 Window Closed / Lapsed

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