US4500408A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Apparatus for and method of controlling sputter coating
Assignee: Novellus Systems Inc
•
Filing: 1983-12-27
•
Granted: 1985-02-19
•
Expires: 2003-12-27
Abstract
Abstract The magnetic field of a magnetron sputter coating apparatus is controlled in response to measurements of plasma parameters to control deposition parameters, such as sputter deposition rate and material deposition thickness profile. From time to time the apparatus is standardized to change preset values for parameters of the plasma to manage the deposition parameters.
Inventors
- 👤 Donald R. Boys
- 👤 Robert M. Smith
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-24 19:31
CPC Classifications
C; C23; C23C; C23C14/00; C23C14/22; C23C14/54; C23C14/542; H; H01; H01J; H01J37/00; H01J37/32; H01J37/34; H01J37/3402; H01J37/3405
Claims Analysis
Total Claims: 76
Claim 1
Independent Claim
94 words
A method of controlling a sputter coating depositing apparatus including a target cathode, an anode and a plasma, ionizing electrons for the plasma having a tendency to be confined in proximity to an emitting surface of the target by a magnetic field having lines of flux adjacent the emitting surface of the target, the confining magnetic field intersecting electric field lines extending between the anode and cathode, the methode comprising controlling the electric impedance of the plasma by controlling the magnetic field intensity in response to a plasma parameter having a tendency to vary.
Claim 2
Independent Claim
94 words
A method of controlling a sputter coating depositing apparatus including a target cathode, an anode and a plasma, ionizing electrons for the plasma having a tendency to be confined in proximity to an emitting surface of the target by a magnetic field having lines of flux adjacent the emitting surface of the target, the confining magnetic field intersecting electric field lines extending between the anode and cathode, the methode comprising controlling the electric impedance of the plasma by controlling the magnetic field intensity in response to a plasma parameter having a tendency to vary.
Claim 3
Dependent Claim
45 words
The method of claim 1 wherein the target is a magnetic material and the magnetic field intensity is sufficient to saturate the magnetic material and establish a magnetic fringing field in proximity to the emitting surface, the magnetic fringing field being the confining magnetic field.
Claim 4
Dependent Claim
14 words
The method of claim 1 wherein the parameter is a function of plasma power.
Claim 5
Dependent Claim
65 words
The method of claim 1 wherein the parameter is a function of plasma power, in turn a function of plasma current and voltage, comparing one of said functions of plasma power with a desired value therefor to control said one function of plasma power, and comparing the value of the one controlled plasma parameter with a desired value therefor to control the magnetic field intensity.
Claim 6
Dependent Claim
137 words
The method of claim 1 wherein the parameter is a function of plasma power, in turn a function of plasma current and voltage, comparing one of said functions of plasma power with a desired value therefor to derive a first error signal having a magnitude indicative of the deviation between actual plasma power and desired value for plasma power, controlling the magnitude of said one function of plasma power in response to the magnitude of the first error signal, comparing the value of the one controlled plasma parameter with a desired value therefor to derive a second error signal having a magnitude indicative of the deviation between the actual value of the one controlled plasma parameter and the desired value therefore, and controlling the magnetic field intensity in response to the magnitude of the second error signal.
Claim 7
Dependent Claim
92 words
A controller for a sputter coating depositing apparatus including a target cathode, an anode and a plasma, ionizing electrons for the plasma having a tendency to be confined in proximity to an emitting surface of the target by a magnetic field having lines of flux adjacent the emitting surface of the target, the confining magnetic field intersecting electric field lines extending between the anode and cathode, the controller including means for monitoring parameters of the plasma, and means responsive to the monitored plasma parameters for controlling the intensity of the magnetic field.
Claim 8
Dependent Claim
92 words
A controller for a sputter coating depositing apparatus including a target cathode, an anode and a plasma, ionizing electrons for the plasma having a tendency to be confined in proximity to an emitting surface of the target by a magnetic field having lines of flux adjacent the emitting surface of the target, the confining magnetic field intersecting electric field lines extending between the anode and cathode, the controller including means for monitoring parameters of the plasma, and means responsive to the monitored plasma parameters for controlling the intensity of the magnetic field.
Claim 9
Dependent Claim
19 words
The controller of claim 6 wherein the means for monitoring includes means for monitoring the power of the plasma.
Claim 10
Dependent Claim
19 words
The controller of claim 6 wherein the means for monitoring includes means for monitoring the pressure of the plasma.
Claim 11
Dependent Claim
24 words
The controller of claim 6 wherein the means for monitoring includes means for monitoring a function of the power and pressure of the plasma.
Claim 12
Dependent Claim
22 words
The controller of claim 6 wherein the means for monitoring includes means for monitoring the voltage, current and pressure of the plasma.
Claim 13
Dependent Claim
25 words
The controller of claim 6 wherein the means for monitoring includes means for monitoring the magnetic field for electrons that ionize atoms of the plasma.
Claim 14
Dependent Claim
34 words
The controller of claim 6 wherein the means for monitoring includes means for monitoring the magnetic field for electrons that ionize atoms of the plasma, as well as a function of the plasma power.
Claim 15
Dependent Claim
37 words
The controller of claim 6 wherein the means for monitoring includes means for monitoring the magnetic field for electrons that ionize atoms of the plasma, as well as a function of the plasma power and plasma pressure.
Claim 16
Dependent Claim
33 words
The controller of claim 6 wherein the means for monitoring includes means for monitoring the magnetic field for electrons that ionize atoms of the plasma as well as the plasma current and voltage.
Claim 17
Independent Claim
107 words
A method of coating substrates with a sputter coating apparatus which during operation establishes a magnetic field and a plasma, the apparatus including a target cathode with an atom emitting surface, atoms from the emitting surface being deposited on a substrate, the target eroding as it is used during deposition, a distribution pattern of the atoms on the substrate having a tendency to change as the target erodes, the method comprising from time to time standardizing certain parameters of the apparatus, determining a response of the apparatus while the apparatus is in the standardized condition, and comparing the response with predetermined values thereof to determine target erosion.
Claim 18
Independent Claim
107 words
A method of coating substrates with a sputter coating apparatus which during operation establishes a magnetic field and a plasma, the apparatus including a target cathode with an atom emitting surface, atoms from the emitting surface being deposited on a substrate, the target eroding as it is used during deposition, a distribution pattern of the atoms on the substrate having a tendency to change as the target erodes, the method comprising from time to time standardizing certain parameters of the apparatus, determining a response of the apparatus while the apparatus is in the standardized condition, and comparing the response with predetermined values thereof to determine target erosion.
Claim 19
Independent Claim
170 words
A method of controlling a sputter coating depositing apparatus including a target cathode, an anode and a plasma, ionizing electrons for the plasma having a tendency to be confined in proximity to an emitting surface of the target by a magnetic field having lines of flux adjacent the emitting surface, the confining magnetic field intersecting electric field lines extending between the anode and cathode, atoms from the emitting surface being deposited on a substrate, the target eroding as it is used during deposition, a distribution pattern of the atoms on the substrate having a tendency to change as the target erodes, the method comprising the step of changing the electric impedance of the plasma as the target erodes by changing the magnetic field in such a manner as to substantially overcome the tendency of the distribution pattern to change with target erosion, the electric impedance being changed in response to measurements indicative thereof and programmed values that change as a function of the amount of material sputtered from the target.
Claim 20
Independent Claim
170 words
A method of controlling a sputter coating depositing apparatus including a target cathode, an anode and a plasma, ionizing electrons for the plasma having a tendency to be confined in proximity to an emitting surface of the target by a magnetic field having lines of flux adjacent the emitting surface, the confining magnetic field intersecting electric field lines extending between the anode and cathode, atoms from the emitting surface being deposited on a substrate, the target eroding as it is used during deposition, a distribution pattern of the atoms on the substrate having a tendency to change as the target erodes, the method comprising the step of changing the electric impedance of the plasma as the target erodes by changing the magnetic field in such a manner as to substantially overcome the tendency of the distribution pattern to change with target erosion, the electric impedance being changed in response to measurements indicative thereof and programmed values that change as a function of the amount of material sputtered from the target.
Claim 21
Independent Claim
190 words
A method of controlling a sputter coating depositing apparatus including a target cathode, an anode and a plasma, ionizing electrons for the plasma having a tendency to be confined in proximity to an emitting surface of the target by a magnetic field having lines of flux adjacent the emitting surface, the confining magnetic field intersecting electric field lines extending between the anode and cathode, atoms from the emitting surface being deposited on a substrate, the target eroding as it is used during deposition, a distribution pattern of the atoms on the substrate having a tendency to change as the target erodes, the method comprising the steps of changing the electric impedance of the plasma as the target erodes by changing the magnetic field in such a manner as to substantially overcome the tendency of the distribution pattern to change with target erosion, from time to time deriving an indication of the target erosion while certain parameters of the apparatus are at a standardized condition, determining a response of the apparatus while the apparatus is in the standardized condition, and comparing the response with predetermined values thereof to determine target erosion.
Claim 22
Independent Claim
190 words
A method of controlling a sputter coating depositing apparatus including a target cathode, an anode and a plasma, ionizing electrons for the plasma having a tendency to be confined in proximity to an emitting surface of the target by a magnetic field having lines of flux adjacent the emitting surface, the confining magnetic field intersecting electric field lines extending between the anode and cathode, atoms from the emitting surface being deposited on a substrate, the target eroding as it is used during deposition, a distribution pattern of the atoms on the substrate having a tendency to change as the target erodes, the method comprising the steps of changing the electric impedance of the plasma as the target erodes by changing the magnetic field in such a manner as to substantially overcome the tendency of the distribution pattern to change with target erosion, from time to time deriving an indication of the target erosion while certain parameters of the apparatus are at a standardized condition, determining a response of the apparatus while the apparatus is in the standardized condition, and comparing the response with predetermined values thereof to determine target erosion.
Claim 23
Dependent Claim
52 words
The method of claim 17 further including responding to the determined target erosion to establish set point values for the apparatus, the established set point values being such that when the plasma is controlled in response to it the tendency of the distribution pattern to change with target erosion is substantially overcome.
Claim 24
Dependent Claim
54 words
The method of claim 17 wherein the target is magnetic and a predetermined magnetic field sufficient to saturate the target is supplied to the target in the standardized condition, and sensing the amplitude of a fringing field in the vicinity of the target resulting from the predetermined field to establish the set point value.
Claim 25
Dependent Claim
26 words
The method of claim 19 wherein the standardized condition is established without the plasma being ignited and while the cathode is at a stabilized, predetermined temperature.
Claim 26
Dependent Claim
19 words
The method of claim 19 further including controlling the magnetic field substantially at a set point value for it.
Claim 27
Dependent Claim
45 words
The method of claim 17 wherein the target is non-magnetic and the standardized condition is established with the plasma ignited and a predetermined pressure subsisting therein, and sensing an indication of the plasma while the standardized condition is established to determine the target erosion indication.
Claim 28
Dependent Claim
36 words
The method of claim 22 further including controlling the magnetic field so it is maintained substantially at the set point value, the amount of control for the magnetic field being an indication of the target erosion.
Claim 29
Independent Claim
142 words
A method of controlling a sputter coating depositing apparatus including a magnetic target cathode, an anode and a plasma, ionizing electrons for the plasma having a tendency to be confined in proximity to an emitting surface of the target by a magnetic field having lines of flux adjacent the emitting surface, the confining magnetic field intersecting electric field lines extending between the anode and cathode, atoms from the emitting surface being deposited on a substrate, the method comprising applying a magnetic field to the target, the magnetic field having an intensity sufficient to saturate magnetic material of the target and establish a magnetic material of the target and establish a magnetic fringing field in proximity to the emitting surface, the magnetic fringing field being the confining magnetic field, and controlling the magnetic field in response to an indication of the plasma impedance.
Claim 30
Independent Claim
142 words
A method of controlling a sputter coating depositing apparatus including a magnetic target cathode, an anode and a plasma, ionizing electrons for the plasma having a tendency to be confined in proximity to an emitting surface of the target by a magnetic field having lines of flux adjacent the emitting surface, the confining magnetic field intersecting electric field lines extending between the anode and cathode, atoms from the emitting surface being deposited on a substrate, the method comprising applying a magnetic field to the target, the magnetic field having an intensity sufficient to saturate magnetic material of the target and establish a magnetic material of the target and establish a magnetic fringing field in proximity to the emitting surface, the magnetic fringing field being the confining magnetic field, and controlling the magnetic field in response to an indication of the plasma impedance.
Claim 31
Dependent Claim
41 words
The method of claim 24 wherein the target has a tendency to change temperature during operation, and changing the amplitude of the magnetic field so that the fringing field configuration has a tendency to be constant on a short term basis.
Claim 32
Dependent Claim
72 words
The method of claim 25 wherein the target erodes as it is used during deposition, a distribution pattern of the atoms on the substrate having a tendency to change as the target erodes, and changing the amplitude of the magnetic field so that on a long term basis the fringing field configuration changes in such a manner as to substantially overcome the tendency of the distribution pattern to change with target erosion.
Claim 33
Independent Claim
140 words
A method of controlling a sputter coating depositing apparatus including a target cathode, an anode and a plasma, ionizing electrons for the plasma having a tendency to be confined in proximity to an emitting surface of the target by a magnetic field having lines of flux adjacent the emitting surface, the confining magnetic field intersecting electric field lines extending between the anode and cathode, atoms from the emitting surface being deposited on a substrate, the target eroding as it is used during deposition, a distribution pattern of the atoms on the substrate having a tendency to change as the target erodes, the method comprising from time to time standardizing certain parameters of the apparatus, determining a response of the apparatus while the apparatus is in the standardized condition, and comparing the response with predetermined values thereof to determine target erosion.
Claim 34
Independent Claim
140 words
A method of controlling a sputter coating depositing apparatus including a target cathode, an anode and a plasma, ionizing electrons for the plasma having a tendency to be confined in proximity to an emitting surface of the target by a magnetic field having lines of flux adjacent the emitting surface, the confining magnetic field intersecting electric field lines extending between the anode and cathode, atoms from the emitting surface being deposited on a substrate, the target eroding as it is used during deposition, a distribution pattern of the atoms on the substrate having a tendency to change as the target erodes, the method comprising from time to time standardizing certain parameters of the apparatus, determining a response of the apparatus while the apparatus is in the standardized condition, and comparing the response with predetermined values thereof to determine target erosion.
Claim 35
Dependent Claim
52 words
The method of claim 27 further including responding to the determined target erosion to establish set point values for the apparatus, the established set point values being such that when the plasma is controlled in response to it the tendency of the distribution pattern to change with target erosion is substantially overcome.
Claim 36
Dependent Claim
54 words
The method of claim 28 wherein the target is magnetic and a predetermined magnetic field sufficient to saturate the target is supplied to the target in the standardized condition, and sensing the amplitude of a fringing field in the vicinity of the target resulting from the predetermined field to establish the set point values.
Claim 37
Dependent Claim
26 words
The method of claim 29 wherein the standardized condition is established without the plasma being ignited and while the cathode is at a stabilized predetermined temperature.
Claim 38
Dependent Claim
45 words
The method of claim 28 wherein the target is non-magnetic and the standardized condition is established with the plasma ignited and a predetermined pressure subsisting therein, and sensing an indication of the plasma while the standardized condition is established to establish the set point values.
Claim 39
Dependent Claim
45 words
The method of claim 27 wherein the target is non-magnetic and the standardized condition is established with the plasma ignited and a predetermined pressure subsisting therein, and sensing an indication of the plasma while the standardized condition is established to determine the target erosion indication.
Claim 40
Dependent Claim
54 words
The method of claim 27 wherein the target is magnetic and a predetermined magnetic field sufficient to saturate the target is supplied to the target in the standardized condition, and sensing the amplitude of a fringing field in the vicinity of the target resulting from the predetermined field to determine the target erosion indication.
Claim 41
Dependent Claim
83 words
In combination, a sputter coating depositing apparatus including a target cathode, an anode and a plasma, ionizing electrons for the plasma having a tendency to be confined in proximity to an emitting surface of the target by a magnetic field having lines of flux adjacent the emitting surface of the target, the confining magnetic field intersecting electric field lines extending between the anode and cathode, and means for controlling the magnetic field intensity in response to plasma parameters having a tendency to vary.
Claim 42
Dependent Claim
83 words
In combination, a sputter coating depositing apparatus including a target cathode, an anode and a plasma, ionizing electrons for the plasma having a tendency to be confined in proximity to an emitting surface of the target by a magnetic field having lines of flux adjacent the emitting surface of the target, the confining magnetic field intersecting electric field lines extending between the anode and cathode, and means for controlling the magnetic field intensity in response to plasma parameters having a tendency to vary.
Claim 43
Dependent Claim
122 words
In combination, a sputter coating depositing apparatus including means for mounting a target cathode, an anode and a plasma, ionizing electrons for the plasma having a tendency to be confined in proximity to an emitting surface of a target on the means for mounting, the electrons having a tendency to be confined by a magnetic field having lines of flux adjacent the emitting surface of the target, the confining magnetic field intersecting with electric field lines extending between the anode and cathode, a magnetic field sensor positioned in proximity to the cathode for sensing a fringing field of the cathode, and means for controlling a function of the plasma impedance in response to the magnetic field sensed by the magnetic field sensor.
Claim 44
Dependent Claim
122 words
In combination, a sputter coating depositing apparatus including means for mounting a target cathode, an anode and a plasma, ionizing electrons for the plasma having a tendency to be confined in proximity to an emitting surface of a target on the means for mounting, the electrons having a tendency to be confined by a magnetic field having lines of flux adjacent the emitting surface of the target, the confining magnetic field intersecting with electric field lines extending between the anode and cathode, a magnetic field sensor positioned in proximity to the cathode for sensing a fringing field of the cathode, and means for controlling a function of the plasma impedance in response to the magnetic field sensed by the magnetic field sensor.
Claim 45
Dependent Claim
102 words
Apparatus for controlling a sputter coating depositing device including a target cathode, an anode and a plasma, ionizing electrons for the plasma having a tendency to be confined in proximity to an emitting surface of the target by a magnetic field having lines of flux adjacent the emitting surface of the target, the confining magnetic field intersecting electric field lines extending between the anode and cathode, the apparatus comprising means for monitoring plasma parameters having a tendency to vary, and means for controlling the electric impedance of the plasma by controlling the magnetic field intensity in response to the means for monitoring
Claim 46
Dependent Claim
102 words
Apparatus for controlling a sputter coating depositing device including a target cathode, an anode and a plasma, ionizing electrons for the plasma having a tendency to be confined in proximity to an emitting surface of the target by a magnetic field having lines of flux adjacent the emitting surface of the target, the confining magnetic field intersecting electric field lines extending between the anode and cathode, the apparatus comprising means for monitoring plasma parameters having a tendency to vary, and means for controlling the electric impedance of the plasma by controlling the magnetic field intensity in response to the means for monitoring
Claim 47
Dependent Claim
14 words
The apparatus of claim 36 wherein the parameter is a function of plasma power.
Claim 48
Dependent Claim
74 words
The apparatus of claim 36 wherein the parameter is a function of plasma power, in turn a function of plasma current and voltage, means for comparing a function of plasma power with a desired value therefor to control one of said functions of plasma power, and means responsive to a comparison of the value of the other of said functions of plasma power with a desired value therefor for controlling the magnetic field intensity.
Claim 49
Dependent Claim
150 words
The apparatus of claim 36 wherein the parameter is a function of plasma power, in turn a function of plasma current and voltage, means for comparing a function of plasma power with a desired value therefor to derive a first error signal having a magnitude indicative of a function of the deviation between actual plasma power and of a desired value for plasma power, means for controlling the magnitude of one of said functions of plasma power in response to the magnitude of the first error signal, means for comparing the value of the other of said functions of plasma power with a desired value therefor to derive a second error signal having a mangitude indicative of the deviation between the actual value of the other function of plasma power and the desired value therefore, and means for controlling the magnetic field intensity in response to the second error signal.
Claim 50
Dependent Claim
182 words
Apparatus for controlling a sputter coating depositing apparatus including a target cathode, an anode and a plasma, ionizing electrons for the plasma having a tendency to be confined in proximity to an emitting surface of the target by a magnetic field having lines of flux adjacent the emitting surface, the confining magnetic field intersecting electric field lines extending between the anode and cathode, atoms from the emitting surface being deposited on a substrate, the target eroding as it is used during deposition, a distribution pattern of the atoms on the substrate having a tendency to change as the target erodes, the control apparatus comprising means for controlling the electric impedance of the plasma as the target erodes by changing the magnetic field in such a manner as to substantially overcome the tendency of the distribution pattern to change with target erosion, means for measuring parameters controlled by the electric impedance, means for storing programmed values that change as a function of the amount of material sputtered from the target, the controlling means being responsive to the measured parameters and the programmed values.
Claim 51
Dependent Claim
182 words
Apparatus for controlling a sputter coating depositing apparatus including a target cathode, an anode and a plasma, ionizing electrons for the plasma having a tendency to be confined in proximity to an emitting surface of the target by a magnetic field having lines of flux adjacent the emitting surface, the confining magnetic field intersecting electric field lines extending between the anode and cathode, atoms from the emitting surface being deposited on a substrate, the target eroding as it is used during deposition, a distribution pattern of the atoms on the substrate having a tendency to change as the target erodes, the control apparatus comprising means for controlling the electric impedance of the plasma as the target erodes by changing the magnetic field in such a manner as to substantially overcome the tendency of the distribution pattern to change with target erosion, means for measuring parameters controlled by the electric impedance, means for storing programmed values that change as a function of the amount of material sputtered from the target, the controlling means being responsive to the measured parameters and the programmed values.
Claim 52
Dependent Claim
197 words
Apparatus for controlling a sputter coating depositing apparatus including a target cathode, an anode and a plasma, ionizing electrons for the plasma having a tendency to be confined in proximity to an emitting surface of the target by a magnetic field having lines of flux adjacent the emitting surface, the confining magnetic field intersecting electric field lines extending between the anode and cathode, atoms from the emitting surface being deposited on a substrate, the target eroding as it is used during deposition, a distribution pattern of the atoms on the substrate having a tendency to change as the target erodes, the control apparatus comprising means for controlling the electric impedance of the plasma as the target erodes by changing the magnetic field in such a manner as to substantially overcome the tendency of the distribution pattern to change with target erosion, means for from time to time deriving an indication of the target erosion while certain parameters of the apparatus are at a standardized condition, means for determining a response of the depositing apparatus while the apparatus is in the standardized condition, and means for comparing the response with a predetermined value thereof to determine target erosion.
Claim 53
Dependent Claim
197 words
Apparatus for controlling a sputter coating depositing apparatus including a target cathode, an anode and a plasma, ionizing electrons for the plasma having a tendency to be confined in proximity to an emitting surface of the target by a magnetic field having lines of flux adjacent the emitting surface, the confining magnetic field intersecting electric field lines extending between the anode and cathode, atoms from the emitting surface being deposited on a substrate, the target eroding as it is used during deposition, a distribution pattern of the atoms on the substrate having a tendency to change as the target erodes, the control apparatus comprising means for controlling the electric impedance of the plasma as the target erodes by changing the magnetic field in such a manner as to substantially overcome the tendency of the distribution pattern to change with target erosion, means for from time to time deriving an indication of the target erosion while certain parameters of the apparatus are at a standardized condition, means for determining a response of the depositing apparatus while the apparatus is in the standardized condition, and means for comparing the response with a predetermined value thereof to determine target erosion.
Claim 54
Dependent Claim
55 words
The apparatus of claim 41 further including means responsive to the determined target erosion to establish set point values for the sputter coating apparatus, the established set point values being such that when the plasma is controlled in response to it the tendency of the distribution pattern to change with target erosion is substantially overcome.
Claim 55
Dependent Claim
28 words
The apparatus of claim 41 further including means for sensing the amplitude of a fringing field in the vicinity of the target to establish the set point value.
Claim 56
Dependent Claim
28 words
The apparatus of claim 41 further including means for establishing the standardized condition without the plasma being ignited and while the cathode is at a stabilized, predetermined temperature.
Claim 57
Dependent Claim
45 words
The apparatus of claim 41 further including means for establishing the standardized condition with the plasma ignited and a predetermined pressure subsisting therein, and means for sensing an indication of the plasma impedance while the standarized condition is established to determine the target erosion indication.
Claim 58
Dependent Claim
146 words
In an apparatus for controlling a sputter coating depositing apparatus including a target cathode, an anode and a plasma, ionizing electrons for the plasma having a tendency to be confined in proximity to an emitting surface of the target by a magnetic field having lines of flux adjacent the emitting surface, the confining magnetic field intersecting electric field lines extending between the anode and cathode, atoms from the emitting surface being deposited on a substrate, the target eroding as it is used during deposition, a distribution pattern of the atoms on the substrate having a tendency to change as the target erodes, means for from time to time standardizing certain parameters of the apparatus, means for determining a response of the depositing apparatus while the apparatus is in the standardized condition, and means for comparing the response with a predetermined value thereof to determine target erosion.
Claim 59
Dependent Claim
146 words
In an apparatus for controlling a sputter coating depositing apparatus including a target cathode, an anode and a plasma, ionizing electrons for the plasma having a tendency to be confined in proximity to an emitting surface of the target by a magnetic field having lines of flux adjacent the emitting surface, the confining magnetic field intersecting electric field lines extending between the anode and cathode, atoms from the emitting surface being deposited on a substrate, the target eroding as it is used during deposition, a distribution pattern of the atoms on the substrate having a tendency to change as the target erodes, means for from time to time standardizing certain parameters of the apparatus, means for determining a response of the depositing apparatus while the apparatus is in the standardized condition, and means for comparing the response with a predetermined value thereof to determine target erosion.
Claim 60
Dependent Claim
26 words
The apparatus of claim 46 wherein the response determining means includes means for sensing the amplitude of a fringing field in the vicinity of the target.
Claim 61
Dependent Claim
22 words
The apparatus of claim 46 wherein the response determining means includes means for sensing the amplitude of a function of plasma power.
Claim 62
Independent Claim
49 words
A method of coating substrates with a sputter coating apparatus which during operation establishes a magnetic field and a plasma, the method comprising controlling during sputtering the electric impedance of the plasma by controlling the magnetic field intensity in response to a plasma parameter having a tendency to vary.
Claim 63
Independent Claim
49 words
A method of coating substrates with a sputter coating apparatus which during operation establishes a magnetic field and a plasma, the method comprising controlling during sputtering the electric impedance of the plasma by controlling the magnetic field intensity in response to a plasma parameter having a tendency to vary.
Claim 64
Dependent Claim
14 words
The method of claim 49 wherein the parameter is a function of plasma power.
Claim 65
Dependent Claim
65 words
The method of claim 49 wherein the parameter is a function of plasma power, in turn a function of plasma current and voltage, comparing one of said functions of plasma power with a desired value therefor to control said one function of plasma power, and comparing the value of the one controlled plasma parameter with a desired value therefor to control the magnetic field intensity.
Claim 66
Dependent Claim
137 words
The method of claim 49 wherein the parameter is a function of plasma power, in turn a function of plasma current and voltage, comparing one of said functions of plasma power with a desired value therefor to derive a first error signal having a magnitude indicative of the deviation between actual plasma power and desired value for plasma power, controlling the magnitude of said one function of plasma power in response to the magnitude of the first error signal, comparing the value of the one controlled plasma parameter with a desired value therefor to derive a second error signal having a magnitude indicative of the deviation between the actual value of the one controlled plasma parameter and the desired value therefore, and controlling the magnetic field intensity in response to the magnitude of the second error signal.
Claim 67
Independent Claim
136 words
A method of coating substrates with a sputter coating apparatus which during operation establishes a magnetic field and a plasma, the apparatus including a target cathode with an atom emitting surface, atoms from the emitting surface being deposited on substrates, the target eroding as it is used during deposition, a distribution pattern of the atoms on the substrates having a tendency to change as the target erodes, the method comprising the steps of changing the electric impedance of the plasma as the target erodes by changing the magnetic field in such a manner as to substantially overcome the tendency of the distribution pattern to change with target erosion, the electric impedance being changed in response to measurements indicative thereof and programmed values that change as a function of the amount of material sputtered from the target.
Claim 68
Independent Claim
136 words
A method of coating substrates with a sputter coating apparatus which during operation establishes a magnetic field and a plasma, the apparatus including a target cathode with an atom emitting surface, atoms from the emitting surface being deposited on substrates, the target eroding as it is used during deposition, a distribution pattern of the atoms on the substrates having a tendency to change as the target erodes, the method comprising the steps of changing the electric impedance of the plasma as the target erodes by changing the magnetic field in such a manner as to substantially overcome the tendency of the distribution pattern to change with target erosion, the electric impedance being changed in response to measurements indicative thereof and programmed values that change as a function of the amount of material sputtered from the target.
Claim 69
Independent Claim
156 words
A method of coating substrates with a sputter coating apparatus which during operation establishes a magnetic field and a plasma, the apparatus including a target cathode with an atom emitting surface, atoms from the emitting surface being deposited on substrates, the target eroding as it is used during deposition, a distribution pattern of the atoms on the substrates having a tendency to change as the target erodes, the method comprising the steps of changing the electric impedance of the plasma as the target erodes by changing the magnetic field in such a manner as to substantially overcome the tendency of the distribution pattern to change with target erosion, from time to time deriving an indication of the target erosion while certain parameters of the apparatus are at a standardized condition, determining a response of the apparatus while the apparatus is in the standardized condition, and comparing the response with predetermined values thereof to determine target erosion.
Claim 70
Independent Claim
156 words
A method of coating substrates with a sputter coating apparatus which during operation establishes a magnetic field and a plasma, the apparatus including a target cathode with an atom emitting surface, atoms from the emitting surface being deposited on substrates, the target eroding as it is used during deposition, a distribution pattern of the atoms on the substrates having a tendency to change as the target erodes, the method comprising the steps of changing the electric impedance of the plasma as the target erodes by changing the magnetic field in such a manner as to substantially overcome the tendency of the distribution pattern to change with target erosion, from time to time deriving an indication of the target erosion while certain parameters of the apparatus are at a standardized condition, determining a response of the apparatus while the apparatus is in the standardized condition, and comparing the response with predetermined values thereof to determine target erosion.
Claim 71
Independent Claim
109 words
A method of controlling a process for sputter coating substrates with an apparatus including a target cathode, an anode and a plasma, ionizing electrons for the plasma having a tendency to be confined in proximity to an emitting surface of the target by a magnetic field having lines of flux adjacent the emitting surface of the target, the confining magnetic field intersecting with electric field lines extending between the anode and cathode, the improvement comprising sensing a magnetic field in proximity to the target cathode to sense a fringing field of the target cathode, and controlling a function of the plasma impedance in response to the sensed magnetic field.
Claim 72
Independent Claim
109 words
A method of controlling a process for sputter coating substrates with an apparatus including a target cathode, an anode and a plasma, ionizing electrons for the plasma having a tendency to be confined in proximity to an emitting surface of the target by a magnetic field having lines of flux adjacent the emitting surface of the target, the confining magnetic field intersecting with electric field lines extending between the anode and cathode, the improvement comprising sensing a magnetic field in proximity to the target cathode to sense a fringing field of the target cathode, and controlling a function of the plasma impedance in response to the sensed magnetic field.
Claim 73
Dependent Claim
14 words
The combination of claim 35 wherein the magnetic field sensor comprises a Hall probe.
Claim 74
Dependent Claim
72 words
A magnetically enhanced sputter coating source comprising anode means, cathode means, magnetic means for forming a magnetic field in proximity to said cathode means, means for measuring magnetic field strengths, said measuring means being mounted in a position to provide a measurement of said magnetic field during operation of said source, said magnetic field forming means being adjustable to control said magnetic field in response to a measurement by said measuring means.
Claim 75
Dependent Claim
72 words
A magnetically enhanced sputter coating source comprising anode means, cathode means, magnetic means for forming a magnetic field in proximity to said cathode means, means for measuring magnetic field strengths, said measuring means being mounted in a position to provide a measurement of said magnetic field during operation of said source, said magnetic field forming means being adjustable to control said magnetic field in response to a measurement by said measuring means.
Claim 76
Dependent Claim
34 words
The controller of claim 6 wherein the means for monitoring includes means for monitoring the magnetic field for electrons that ionize atoms of the plasma as well as the plasma current, voltage and pressure.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1988-02-19 | 1988-08-20 | 1989-02-19 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1992-02-19 | 1992-08-20 | 1993-02-19 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1996-02-19 | 1996-08-20 | 1997-02-19 | $7700.00 | Window Closed / Lapsed |