Patent US4985601A successfully refreshed from Google Patents.
US4985601A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Circuit boards with recessed traces
Assignee: Individual
•
Filing: 1989-05-02
•
Granted: 1991-01-15
•
Expires: 2009-05-02
Abstract
Abstract Circuit boards with imbedded traces, which may form grooves or trenches are provided. The traces may be at least partially filled with a reflowable conductive material such as solder. The grooves may be selectively furnished with solder while other regions may be empty or void of solder. In assembling electronic components, with or without extended leads, such as surface mount integrated circuits or chips, to the solder core circuit boards, the leads may be placed within the regions of the grooves without solder (contact regions) and then the circuit board may be heated selectively or as a whole to reflow the solder to the bonding or contacting regions to bond the traces to the leads upon cooling. Circuit boards having surface mount devices on both sides may be formed in this manner. Further, tape automated bonded or TAB mounted devices may be directly placed into and bonded to the traces or solder core circuit boards with minimum exposure of the excised TAB leads prior to assembly. In one form, the grooves are plated with copper before they are filled with solder.
Inventors
- 👤 George R. Hagner
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-25 18:50
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/02; H05K3/08; H05K1/00; H05K1/02; H05K1/11; H05K1/111; H05K1/18; H05K1/182; H05K1/183; H05K3/10; H05K3/107; H05K3/20; H05K3/30; H05K3/32; H05K3/34; H05K3/3465; H05K3/3473; H05K2201/00; H05K2201/01; H05K2201/0104; H05K2201/0129; H05K2201/03; H05K2201/0332; H05K2201/0364; H05K2201/0376; H05K2201/09; H05K2201/09009; H05K2201/09036; H05K2201/09118; H05K2201/09209; H05K2201/09372; H05K2201/09472; H05K2201/095; H05K2201/0959; H05K2201/09818; H05K2201/09845; H05K2201/09981; H05K2201/10; H05K2201/10613; H05K2201/10621; H05K2201/10636; H05K2201/10681; H05K2203/00; H05K2203/01; H05K2203/0104; H05K2203/0117; H05K2203/02; H05K2203/0278; H05K2203/04; H05K2203/042; H05K2203/07; H05K2203/0703; H05K2203/0726; H05K2203/0756; H05K2203/0769; H05K3/0094; H05K3/108; H05K3/18; H05K3/181; H05K3/182; H05K3/184; H05K3/22; H05K3/24; H05K3/244; H05K3/341; H05K3/3421; H05K3/3431; H05K3/3442; H05K3/3452; H05K3/40; H05K3/42; H05K3/425; H05K3/426; Y; Y02; Y02P; Y02P70/00; Y02P70/50
Claims Analysis
Total Claims: 40
Claim 1
Independent Claim
77 words
A reflowable material core circuit board for receiving electronic components comprising: an insulative substrate having at least one mounting surface; and a conductive material pattern positioned over the surface of the insulative substrate and at least partially within the mounting surface, the pattern comprising: a groove within the mounting surface; and a reflowable, conductive material at least partially filling the groove, where the reflowable, conductive material is present before the electronic components are received on the board.
Claim 2
Dependent Claim
77 words
A reflowable material core circuit board for receiving electronic components comprising: an insulative substrate having at least one mounting surface; and a conductive material pattern positioned over the surface of the insulative substrate and at least partially within the mounting surface, the pattern comprising: a groove within the mounting surface; and a reflowable, conductive material at least partially filling the groove, where the reflowable, conductive material is present before the electronic components are received on the board.
Claim 3
Dependent Claim
47 words
The reflowable material core circuit board of claim 1 where the insulative substrate is a thermoplastic material having a reflow point and the reflowable, conductive material has a reflow point, and the reflow point of the thermoplastic material is higher than that of the reflowable, conductive material.
Claim 4
Dependent Claim
16 words
The reflowable material core circuit board of claim 1 where the reflowable, conductive material is solder.
Claim 5
Dependent Claim
30 words
The reflowable material core board of claim 1 where the groove has a depth into the mounting surface and a width, and where the depth is greater than the width.
Claim 6
Dependent Claim
28 words
The reflowable material core circuit board of claim 1 where the conductive material pattern further comprises a series of contact regions that communicate with at least one groove.
Claim 7
Dependent Claim
24 words
The reflowable material core circuit board of claim 1 where the groove is at least partially coated with copper, beneath the reflowable conductive material.
Claim 8
Dependent Claim
24 words
The reflowable material core circuit board of claim 6 where the copper is at least partially coated with solder, beneath the reflowable, conductive material.
Claim 9
Dependent Claim
85 words
Reflowable material core circuit board for receiving electronic components comprising: an insulative substrate having at least one mounting surface; and a conductive material pattern positioned over the surface of the insulative substrate and at least partially within the mounting surface, the pattern comprising: a groove within the mounting surface; and a reflowable, conductive material at least partially filling the groove; and a series of contact regions that communicate with at least one groove where the contact regions are substantially free from the reflowable, conductive material.
Claim 10
Dependent Claim
85 words
Reflowable material core circuit board for receiving electronic components comprising: an insulative substrate having at least one mounting surface; and a conductive material pattern positioned over the surface of the insulative substrate and at least partially within the mounting surface, the pattern comprising: a groove within the mounting surface; and a reflowable, conductive material at least partially filling the groove; and a series of contact regions that communicate with at least one groove where the contact regions are substantially free from the reflowable, conductive material.
Claim 11
Dependent Claim
82 words
A reflowable material core circuit board for receiving electronic components comprising: an insulative substrate having at least one mounting surface; and a conductive material pattern positioned over the surface of the insulative substrate and at least partially within the mounting surface, the pattern comprising: a groove within the mounting surface; and a reflowable, conductive material at least partially filling the groove; and a series of recesses for at least partially receiving electronic components, where the recesses communicate with at least one groove.
Claim 12
Dependent Claim
82 words
A reflowable material core circuit board for receiving electronic components comprising: an insulative substrate having at least one mounting surface; and a conductive material pattern positioned over the surface of the insulative substrate and at least partially within the mounting surface, the pattern comprising: a groove within the mounting surface; and a reflowable, conductive material at least partially filling the groove; and a series of recesses for at least partially receiving electronic components, where the recesses communicate with at least one groove.
Claim 13
Dependent Claim
99 words
Reflowable material core circuit board for receiving electronic components comprising: an insulative substrate having a first mounting surface; a first conductive material pattern positioned over the first mounting surface of the insulative substrate and at least partially within the first mounting surface, the pattern comprising: a groove within the mounting surface; and a reflowable, conductive material at least partially filling the groove; and a second mounting surface on the insulative substrate, the second mounting surface on the opposite side of the substrate from the first mounting surface where the second mounting surface has a second conductive material pattern thereon.
Claim 14
Dependent Claim
99 words
Reflowable material core circuit board for receiving electronic components comprising: an insulative substrate having a first mounting surface; a first conductive material pattern positioned over the first mounting surface of the insulative substrate and at least partially within the first mounting surface, the pattern comprising: a groove within the mounting surface; and a reflowable, conductive material at least partially filling the groove; and a second mounting surface on the insulative substrate, the second mounting surface on the opposite side of the substrate from the first mounting surface where the second mounting surface has a second conductive material pattern thereon.
Claim 15
Dependent Claim
27 words
The reflowable material core circuit board of claim 10 where the first conductive material pattern and the second conductive material pattern are electrically connected with one another.
Claim 16
Dependent Claim
32 words
The reflowable material core circuit board of claim 11 where the connection between the first conductive material pattern and the second conductive material pattern is through a hole in the insulative substrate.
Claim 17
Dependent Claim
111 words
A reflowable material core circuit board for receiving electronic components comprising: an insulative substrate having at least one mounting surface; and a conductive material pattern positioned over the surface of the insulative substrate and at least partially within the mounting surface, the pattern comprising: a groove within the mounting surface; a reflowable, conductive material at least partially filling the groove; and at least one region within said groove which is substantially free of the reflowable, conductive material; where the insulative substrate has a reflow point and the reflowable, conductive material has a reflow point, and the reflow point of the insulative substrate is higher than that of the reflowable, conductive material.
Claim 18
Dependent Claim
111 words
A reflowable material core circuit board for receiving electronic components comprising: an insulative substrate having at least one mounting surface; and a conductive material pattern positioned over the surface of the insulative substrate and at least partially within the mounting surface, the pattern comprising: a groove within the mounting surface; a reflowable, conductive material at least partially filling the groove; and at least one region within said groove which is substantially free of the reflowable, conductive material; where the insulative substrate has a reflow point and the reflowable, conductive material has a reflow point, and the reflow point of the insulative substrate is higher than that of the reflowable, conductive material.
Claim 19
Dependent Claim
103 words
A solder core circuit board for receiving electronic components comprising: an insulative substrate having at least one mounting surface; and a conductive material pattern positioned over the surface of the insulative substrate and at least partially within the mounting surface, the pattern comprising: a groove within the mounting surface; solder at least partially filling the groove; and at least one contact region physically communicating with said groove which is substantially free of solder; where the insulative substrate has a reflow point and the solder has a reflow point, and the reflow point of the insulative substrate is higher than that of the solder.
Claim 20
Dependent Claim
103 words
A solder core circuit board for receiving electronic components comprising: an insulative substrate having at least one mounting surface; and a conductive material pattern positioned over the surface of the insulative substrate and at least partially within the mounting surface, the pattern comprising: a groove within the mounting surface; solder at least partially filling the groove; and at least one contact region physically communicating with said groove which is substantially free of solder; where the insulative substrate has a reflow point and the solder has a reflow point, and the reflow point of the insulative substrate is higher than that of the solder.
Claim 21
Dependent Claim
23 words
The solder core circuit board of claim 14 where the groove is at least partially coated with copper, beneath the reflowable conductive material.
Claim 22
Dependent Claim
92 words
A circuit board for receiving electronic components comprising: an insulative substrate having at least one mounting surface; and a conductive material pattern positioned over the surface of the insulative substrate and at least partially within the mounting surface, the pattern comprising: a groove within the mounting surface; a conductive material imbedded in the substrate at least partially filling the groove; a reflowable solder in the substrate at least partially covering the conductive material and at least partially filling the groove; and at least one contact region in physical communication with the groove.
Claim 23
Dependent Claim
92 words
A circuit board for receiving electronic components comprising: an insulative substrate having at least one mounting surface; and a conductive material pattern positioned over the surface of the insulative substrate and at least partially within the mounting surface, the pattern comprising: a groove within the mounting surface; a conductive material imbedded in the substrate at least partially filling the groove; a reflowable solder in the substrate at least partially covering the conductive material and at least partially filling the groove; and at least one contact region in physical communication with the groove.
Claim 24
Dependent Claim
12 words
The circuit board of claim 16 where the conductive material is copper.
Claim 25
Dependent Claim
30 words
The circuit board of claim 17 where the copper is at least partially coated with solder prior to the provision of the reflowable solder at least partially filling the groove.
Claim 26
Dependent Claim
94 words
A circuit board for receiving electronic components comprising: an insulative substrate having at least one mounting surface; and a conductive material pattern positioned over the surface of the insulative substrate and at least partially within the mounting surface, the pattern comprising: a groove within the mounting surface, where the groove has a depth into the mounting surface and a width, and where the depth is greater than the width; a conductive material imbedded in the substrate at least partially filling the groove; and at least one contact region in physical communication with the groove.
Claim 27
Dependent Claim
94 words
A circuit board for receiving electronic components comprising: an insulative substrate having at least one mounting surface; and a conductive material pattern positioned over the surface of the insulative substrate and at least partially within the mounting surface, the pattern comprising: a groove within the mounting surface, where the groove has a depth into the mounting surface and a width, and where the depth is greater than the width; a conductive material imbedded in the substrate at least partially filling the groove; and at least one contact region in physical communication with the groove.
Claim 28
Dependent Claim
93 words
A circuit board for receiving electronic components comprising: an insulative substrate having at least one mounting surface; and a conductive material pattern positioned over the surface of the insulative substrate and at least partially within the mounting surface, the pattern comprising: a groove within the mounting surface; a conductive material imbedded in the substrate at least partially filling the groove; and at least one contact region in physical communication with the groove; a series of recesses for at least partially receiving electronic components, where the recesses physically communicate with at least one groove.
Claim 29
Dependent Claim
93 words
A circuit board for receiving electronic components comprising: an insulative substrate having at least one mounting surface; and a conductive material pattern positioned over the surface of the insulative substrate and at least partially within the mounting surface, the pattern comprising: a groove within the mounting surface; a conductive material imbedded in the substrate at least partially filling the groove; and at least one contact region in physical communication with the groove; a series of recesses for at least partially receiving electronic components, where the recesses physically communicate with at least one groove.
Claim 30
Dependent Claim
111 words
A circuit board for receiving electronic components comprising: an insulative substrate having a first mounting surface; a first conductive material pattern positioned over the first mounting surface of the insulative substrate and at least partially within the first mounting surface, the pattern comprising: a groove within the mounting surface; a conductive material imbedded in the substrate at least partially filling the groove; and at least one contact region in physical communication with the groove; and a second mounting surface on the insulative substrate, the second mounting surface on the opposite side of the substrate from the first mounting surface where the second mounting surface has a second conductive material pattern thereon.
Claim 31
Dependent Claim
111 words
A circuit board for receiving electronic components comprising: an insulative substrate having a first mounting surface; a first conductive material pattern positioned over the first mounting surface of the insulative substrate and at least partially within the first mounting surface, the pattern comprising: a groove within the mounting surface; a conductive material imbedded in the substrate at least partially filling the groove; and at least one contact region in physical communication with the groove; and a second mounting surface on the insulative substrate, the second mounting surface on the opposite side of the substrate from the first mounting surface where the second mounting surface has a second conductive material pattern thereon.
Claim 32
Dependent Claim
24 words
The circuit board of claim 21 where the first conductive material pattern and the second conductive material pattern are electrically connected with one another.
Claim 33
Dependent Claim
29 words
The circuit board of claim 22 where the connection between the first conductive material pattern and the second conductive material pattern is through a hole in the insulative substrate.
Claim 34
Dependent Claim
95 words
An assembled electronic solder core circuit board bearing electronic components comprising: a circuit board for receiving electronic components comprising: an insulative substrate having at least one mounting surface; and a conductive material pattern positioned over the surface of the insulative substrate and at least partially within the mounting surface, the pattern comprising: a plurality of grooves within the mounting surface; and a reflowable, conductive material at least partially filling the grooves; an electronic component having leads on the circuit board where the leads are bonded to the conductive material pattern by the reflowable conductive material.
Claim 35
Dependent Claim
95 words
An assembled electronic solder core circuit board bearing electronic components comprising: a circuit board for receiving electronic components comprising: an insulative substrate having at least one mounting surface; and a conductive material pattern positioned over the surface of the insulative substrate and at least partially within the mounting surface, the pattern comprising: a plurality of grooves within the mounting surface; and a reflowable, conductive material at least partially filling the grooves; an electronic component having leads on the circuit board where the leads are bonded to the conductive material pattern by the reflowable conductive material.
Claim 36
Dependent Claim
27 words
The assembled electronic solder core circuit board of claim 24 where the grooves have a width and a depth, and the depth is greater than the width.
Claim 37
Dependent Claim
44 words
The assembled electronic solder core circuit board of claim 24 where the grooves are plated with a conductive material that exists between the groove and the reflowable, conductive material which at least partially fills the remainder of the groove not occupied by the plating.
Claim 38
Dependent Claim
17 words
The assembled electronic solder core circuit board of claim 26 where the conductive material plating is copper.
Claim 39
Dependent Claim
23 words
The assembled electronic solder core circuit board of claim 27 where the conductive material pattern has imbedded beneath it a non-reflowable conductive material.
Claim 40
Dependent Claim
17 words
The assembled electronic solder core circuit board of claim 28 where the non-reflowable conductive material is copper.
References Cited (Backward Citations)
US2600343A
Cited
US2695351A
Cited
US2692190A
Cited
US2874085A
Cited
US2848359A
Cited
US3010863A
Cited
US2981868A
Cited
US3247573A
Cited
US3528048A
Cited
US3616014A
Cited
US3729819A
Cited
US3778530A
Cited
US3835531A
Cited
US3800020A
Cited
US4024629A
Cited
US4080513A
Cited
US4363930A
Cited
US4345300A
Cited
US4402135A
Cited
US4301192A
Cited
US4374457A
Cited
US4354895A
Cited
US4606787A
Cited
US4532152A
Cited
US4604678A
Cited
US4756929A
Cited
US4775611A
Cited
US4521449A
Cited
US4630096A
Cited
US4651417A
Cited
US4614837A
Cited
US4635093A
Cited
US4766268A
Cited
EP0245713A1
Cited
USH487H
Cited
US4707394A
Cited
US4825539A
Cited
US4841099A
Cited
US4851613A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1994-01-14 | 1994-07-16 | 1995-01-15 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1998-01-14 | 1998-07-16 | 1999-01-15 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2002-01-14 | 2002-07-16 | 2003-01-15 | $7700.00 | Window Closed / Lapsed |