US4614837A
Expired / Lapsed
US
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Method for placing electrically conductive paths on a substrate
Assignee: Honeywell International Inc
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Filing: 1985-04-03
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Granted: 1986-09-30
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Expires: 2005-04-03
Abstract
Abstract A process for placing conductive paths on to the surface of a heat softenable substrate by applying a layer of metal powder to the substrate, compacting the powder in a pre-determined pattern by applying a heated die under pressure, and embedding the compacted powder by the continued application of the die at a pressure less than the compacting pressure.
Inventors
- 👤 Robert P. Kane
- 👤 Edwin D. Lillie
- 👤 John D. Neidig
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-25 11:44
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/10; H05K3/102; H05K2201/00; H05K2201/01; H05K2201/0104; H05K2201/0129; H05K2201/03; H05K2201/0332; H05K2201/0364; H05K2201/0376; H05K2203/00; H05K2203/01; H05K2203/0104; H05K2203/0108; H05K3/107; Y; Y10; Y10S; Y10S428/00; Y10S428/901; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/49155; Y10T29/49163
Claims Analysis
Total Claims: 38
Claim 1
Independent Claim
151 words
A method of placing electrically conductive paths on a heat softenable substrate comprising the steps of: (a) applying a layer of a composition comprising finely divided metal particles to all or a portion of a heat softenable substrate; (b) compacting said metal particles in a pre-determined circuit pattern by applying a die heated to a temperature less than the melting point of said metal to said metal particles at a pressure and for a time sufficient to compact said particles, said die having the desired circuit pattern thereon and projecting from the surface thereof and acting to compact the metal particles in the areas contacted by the circuit defining portions of said die; and (c) embedding said compacted metal particles into said surface of said substrate by continuing the application of said heated die to said compacted metal particles for a time sufficient to embed said compacted particles in said substrate.
Claim 2
Independent Claim
151 words
A method of placing electrically conductive paths on a heat softenable substrate comprising the steps of: (a) applying a layer of a composition comprising finely divided metal particles to all or a portion of a heat softenable substrate; (b) compacting said metal particles in a pre-determined circuit pattern by applying a die heated to a temperature less than the melting point of said metal to said metal particles at a pressure and for a time sufficient to compact said particles, said die having the desired circuit pattern thereon and projecting from the surface thereof and acting to compact the metal particles in the areas contacted by the circuit defining portions of said die; and (c) embedding said compacted metal particles into said surface of said substrate by continuing the application of said heated die to said compacted metal particles for a time sufficient to embed said compacted particles in said substrate.
Claim 3
Dependent Claim
18 words
A method according to claim 1 wherein the surfaces of said particles are substantially free of metal oxides.
Claim 4
Dependent Claim
22 words
A method according to claim 1 wherein said metal is tin, copper, iron, platinum, aluminum, silver, gold, nickel, palladium or alloys thereof.
Claim 5
Dependent Claim
11 words
A method according to claim 3 wherein said metal is copper.
Claim 6
Dependent Claim
12 words
A method according to claim 4 wherein said copper is electrolytic dust.
Claim 7
Dependent Claim
11 words
A method according to claim 3 wherein said metal is tin.
Claim 8
Dependent Claim
24 words
A method according to claim 1 wherein said particles are flaky and irregularly shaped having an averge diameter of less than about 75 micrometers.
Claim 9
Dependent Claim
15 words
A method according to claim 7 wherein said diameter is less than about 50 micrometers.
Claim 10
Dependent Claim
15 words
A method according the claim 8 wherein said diameter is less than about 35 micrometers.
Claim 11
Dependent Claim
14 words
A method according to claim 1 wherein said substrate is a thermoplastic polymeric material.
Claim 12
Dependent Claim
14 words
A method according to claim 8 wherein said thermoplastic polymeric material is glass filled.
Claim 13
Dependent Claim
28 words
A method according to claim 11 wherein said substrate is composed of a material selected from the group consisting of polyetherimides, polyethersulfones, polysulfones, polyethylene terephthalate, and polyphenylene sulfides.
Claim 14
Dependent Claim
16 words
A method according to claim 12 wherein said substrate is composed of polyetherimides and polyethylene terephthalates.
Claim 15
Dependent Claim
14 words
A method according to claim 11 wherein said substrate is composed of a polyetherimide.
Claim 16
Dependent Claim
55 words
A method according to claim 1 wherein in step (b) said heated die is applied to said metal powder at a temperature of from about 25° C. to about 300° C., and a pressure of from about 34,470 kPa to about 379,170 kPa for a period of from about 1 sec to about 3600 secs.
Claim 17
Dependent Claim
40 words
A method according to claim 15 wherein said temperature is from about 100° C. to about 280° C., said pressure is from about 68,940 kPa to about 275,760 kPa, and said period is from about 1 to about 60 secs.
Claim 18
Dependent Claim
40 words
A method according to claim 16 wherein said temperature is from about 180° C. to about 265° C., said pressure is from about 103,410 kPa to about 241,290 kPa and said period is from about 1 to about 30 secs.
Claim 19
Dependent Claim
34 words
A method according to claim 1 wherein said metal particles are compacted in step (b) to an average thickness of at least about 0.005 mm and a conductivity of at least about 5% IACS.
Claim 20
Dependent Claim
27 words
A method according to claim 18 wherein said average thickness is from about 0.025 to about 0.30 mm and said conductivity is at least about 20% IACS.
Claim 21
Dependent Claim
27 words
A method according to claim 19 wherein said average thickness is from about 0.05 to about 0.20 mm and said conductivity is at least about 30% IACS.
Claim 22
Dependent Claim
27 words
A method according to claim 20 wherein said average thickness is from about 0.05 to about 0.10 mm, and said conductivity is at least about 40% IACS.
Claim 23
Dependent Claim
56 words
A method according to claim 1 wherein in step (c) said heated die is applied to said compacted particles at a temperature of from about 25° C. to about 300° C. and at a pressure of from about 6,894 kPa to about 344,700 kPa for a time period of from about 1 to about 3600 seconds.
Claim 24
Dependent Claim
40 words
A method according to claim 22 wherein said temperature is from about 180° C. to about 280° C., said pressure is from about 3,447 kPa to about 68,940 kPa and said period is from about 1 to about 60 sec.
Claim 25
Dependent Claim
38 words
A method according to claim 23 wherein said temperature is from about 200° C. to about 265° C., said pressure from about 6,894 kPa to about 34,470 kPa and said period from about 1 to about 30 seconds.
Claim 26
Dependent Claim
40 words
A method according to claim 24 wherein said temperature is from aobut 245° C. to about 260° C., said pressure from about 10,341 kPa to about 24,129 kPa and said pressure is from about 5 seconds to about 20 seconds.
Claim 27
Dependent Claim
24 words
A method according to claim 1 wherein said compacted metal particles are embedded in said substrate to depth of at least about 75 micrometers.
Claim 28
Dependent Claim
18 words
A method according to claim 26 wherein said depth is from about 25 micrometers to about 250 micrometers.
Claim 29
Dependent Claim
17 words
A method according to claim 27 wherein said depth is from about 125 to about 200 micrometers.
Claim 30
Dependent Claim
13 words
A printed circuit board manufactured in accordance with the method of claim 1.
Claim 31
Dependent Claim
22 words
A method according to claim 1 wherein the temperature of said die is less than about the fusion temperature of said metal.
Claim 32
Dependent Claim
23 words
A method according to claim 30 wherein said temperature is more than about 100° C. less than the fusion temperature of said metal.
Claim 33
Dependent Claim
30 words
A method according to claim 30 wherein said temperature is equal to or greater than about the isothermal annealing temperature of said metal and less than about said fusion temperature.
Claim 34
Dependent Claim
17 words
A method according to claim 1 wherein said substrate is cooled during said compacting and embedding step.
Claim 35
Independent Claim
132 words
A method of placing electrically conductive paths on a heat softenable substrate comprising the steps of: (a) applying a layer of a composition consisting essentially of finely divided flaky metal particles to all or a portion of a heat softenable substrate, the surface of said particles being substantially free of metal oxides; and (b) compacting said metal particles in a predetermined circuit pattern by applying to said particles a die having a temperature less than the fusion temperature of said metal at a pressure and for a time sufficient to compact said particles, said die having the desired circuit pattern thereon, and projecting from the surface thereof, and acting to compact the metal particles in the areas contacted by the circuit pattern and embedding said compacted particles into said heat softenable substrate.
Claim 36
Independent Claim
132 words
A method of placing electrically conductive paths on a heat softenable substrate comprising the steps of: (a) applying a layer of a composition consisting essentially of finely divided flaky metal particles to all or a portion of a heat softenable substrate, the surface of said particles being substantially free of metal oxides; and (b) compacting said metal particles in a predetermined circuit pattern by applying to said particles a die having a temperature less than the fusion temperature of said metal at a pressure and for a time sufficient to compact said particles, said die having the desired circuit pattern thereon, and projecting from the surface thereof, and acting to compact the metal particles in the areas contacted by the circuit pattern and embedding said compacted particles into said heat softenable substrate.
Claim 37
Dependent Claim
17 words
A method according to claim 34 wherein said substrate is cooled during said compaction and embedding step.
Claim 38
Dependent Claim
13 words
A printed circuit board prepared in accordance with the method of claim 1.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1989-09-29 | 1990-03-31 | 1990-09-30 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1993-09-29 | 1994-03-31 | 1994-09-30 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1997-09-29 | 1998-03-31 | 1998-09-30 | $7700.00 | Window Closed / Lapsed |