US4851613A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Flexible circuit laminate for surface mount devices
Assignee: Flex Technologies Inc
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Filing: 1988-06-08
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Granted: 1989-07-25
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Expires: 2008-06-08
Abstract
Abstract The disclosed invention provides a flexible circuit board for use in surface mount technology. A polyaramid fiber reinforced resin provides a substrate for a copper cladding in which a circuit is formed. Overlaying the circuitry are a plurality of spaced insulating pads also reinforced with polyaramid fiber for dimensional stability. The spaces insulated pads define fold-lines along which the circuit may be folded, thereby providing a degree of flexibility required for flexible circuit applications.
Inventors
- 👤 Roland Jacques
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-27 08:55
CPC Classifications
H; H05; H05K; H05K1/00; H05K1/02; H05K1/03; H05K1/0393; H05K1/0277; H05K1/028; H05K1/0313; H05K1/0353; H05K1/0366; H05K2201/00; H05K2201/02; H05K2201/0275; H05K2201/0278; H05K2201/029; H05K2201/09; H05K2201/09009; H05K2201/09036; H05K2201/09818; H05K2201/0989; H05K3/00; H05K3/22; H05K3/28; H05K3/281
Claims Analysis
Total Claims: 9
Claim 1
Independent Claim
77 words
A flexible circuit board for surface mount components comprising: a dielectric substrate including a polyaramid layer; a layer of conductive material adhered to at least a portion of said substrate; an insulating layer adhered to said conductive layer, said insulating layer including: a plurality of insulating panels adhered to said conductive layer and spaced along one dimension of said circuit board to provide for fold-lines therebetween, said insulating panels each comprising a woven fabric of polyaramid fiber.
Claim 2
Dependent Claim
77 words
A flexible circuit board for surface mount components comprising: a dielectric substrate including a polyaramid layer; a layer of conductive material adhered to at least a portion of said substrate; an insulating layer adhered to said conductive layer, said insulating layer including: a plurality of insulating panels adhered to said conductive layer and spaced along one dimension of said circuit board to provide for fold-lines therebetween, said insulating panels each comprising a woven fabric of polyaramid fiber.
Claim 3
Dependent Claim
17 words
A flexible circuit board in accordance with claim 1 wherein said conductive material defines an electrical circuit.
Claim 4
Dependent Claim
35 words
A flexible circuit in accordance with claim 2 wherein windows are cut out of at least one of said insulating panels to allow surface mount devices to be soldered to said circuit through said windows.
Claim 5
Dependent Claim
14 words
A flexible circuit in accordance with claim 2 wherein said conductive material is copper.
Claim 6
Dependent Claim
18 words
A flexible circuit in accordance with claim 1 wherein said polyaramid layer is woven fabric of polyaramid fiber.
Claim 7
Dependent Claim
28 words
A flexible circuit in accordance with claim 5 wherein said woven fabric of said substrate and said woven fabric of said insulating panels are impregnated with a resin.
Claim 8
Dependent Claim
15 words
A flexible circuit in accordance with claim 5 wherein said resin is an acrylic resin.
Claim 9
Dependent Claim
26 words
A flexible circuit in accordance with claim 1 wherein said panels are approximately coextensive with said circuit board in the direction transverse to said one dimension.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1992-07-24 | 1993-01-23 | 1993-07-25 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1996-07-24 | 1997-01-23 | 1997-07-25 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2000-07-24 | 2001-01-23 | 2001-07-25 | $7700.00 | Window Closed / Lapsed |