USH487H
Expired / Lapsed
US
⏱️ 0.0 years remaining
Direct cable attach method
Assignee: United States Department of the Air Force
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Filing: 1986-07-14
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Granted: 1988-07-05
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Expires: 2006-07-14
Abstract
Abstract A direct cable attachment method for directly connecting a flat ribbon cable to a stack of integrated circuit units by pre-tinning the leads of both the ribbon cable and the wiring board with solder. Positioning the ribbon cable on the wiring board and applying sufficient heat to the combination to achieve a physical and electrical connection. Adding epoxy to the assembly structure provides additional strength.
Inventors
- 👤 Barbara L. Clark
- 👤 Wayne D. Kuipers
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-25 23:16
CPC Classifications
H; H10; H10W; H10W99/00; H01; H01R; H01R12/00; H01R12/50; H01R12/59; H01R12/62; H10W70/00; H10W70/099
Claims Analysis
Total Claims: 8
Claim 1
Independent Claim
153 words
A method of directly attaching a ribbon cable to a stack of semiconductor modules comprising the steps of: a. pre-tinning the leads of the ribbon cable with solder, b. pre-tinning the leads of a wiring board with solder, c. preselectively aligning the leads of said ribbon cable, respectively, with the leads of said wiring board, d. securing each of the leads of said ribbon cable and each of the leads of said wiring board to each other, respectively, so as to maintain said preselected alignment and to form a ribbon cable/wiring board assembly, e. placing the ribbon cable/wiring board assembly in a heating means, f. applying a predetermined amount of heat to reflow the solder in order to provide an interconnection between said ribbon cable and said wiring board, and g. applying epoxy to each of said leads of said ribbon cable/wiring board assembly to provide additional stability and strength to said interconnection.
Claim 2
Independent Claim
153 words
A method of directly attaching a ribbon cable to a stack of semiconductor modules comprising the steps of: a. pre-tinning the leads of the ribbon cable with solder, b. pre-tinning the leads of a wiring board with solder, c. preselectively aligning the leads of said ribbon cable, respectively, with the leads of said wiring board, d. securing each of the leads of said ribbon cable and each of the leads of said wiring board to each other, respectively, so as to maintain said preselected alignment and to form a ribbon cable/wiring board assembly, e. placing the ribbon cable/wiring board assembly in a heating means, f. applying a predetermined amount of heat to reflow the solder in order to provide an interconnection between said ribbon cable and said wiring board, and g. applying epoxy to each of said leads of said ribbon cable/wiring board assembly to provide additional stability and strength to said interconnection.
Claim 3
Independent Claim
124 words
A method of directly attaching a ribbon cable to a stack of semiconductor modules comprising the steps of: a. preselectively aligning each lead of the ribbon cable precisely with a corresponding lead of a wiring board, b. securing each of the leads of said ribbon cable and each of the leads of said wiring board to each other, respectively, so as to maintain said preselected alignment and to form a ribbon cable/wiring board assembly, c. welding each lead of said ribbon cable to its corresponding lead on said wiring board by using a welding means with a predetermined tip shape, and d. applying epoxy to each of said leads of said ribbon cable/wiring board assembly to provide additional stability and strength to said interconnection.
Claim 4
Independent Claim
124 words
A method of directly attaching a ribbon cable to a stack of semiconductor modules comprising the steps of: a. preselectively aligning each lead of the ribbon cable precisely with a corresponding lead of a wiring board, b. securing each of the leads of said ribbon cable and each of the leads of said wiring board to each other, respectively, so as to maintain said preselected alignment and to form a ribbon cable/wiring board assembly, c. welding each lead of said ribbon cable to its corresponding lead on said wiring board by using a welding means with a predetermined tip shape, and d. applying epoxy to each of said leads of said ribbon cable/wiring board assembly to provide additional stability and strength to said interconnection.
Claim 5
Dependent Claim
14 words
The method as described in claim 1 wherein said heating means comprises an oven.
Claim 6
Dependent Claim
16 words
The method as described in claim 1 wherein said predetermined amount of heat equals 200° C.
Claim 7
Dependent Claim
16 words
The method as described in claim 2 wherein said predetermined tip shape comprises a single point.
Claim 8
Dependent Claim
16 words
The method as described in claim 2 wherein said predetermined tip shape comprises a split tip.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1991-07-05 | 1992-01-04 | 1992-07-05 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1995-07-05 | 1996-01-04 | 1996-07-05 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1999-07-05 | 2000-01-04 | 2000-07-05 | $7700.00 | Window Closed / Lapsed |