High density printing wiring

Claim 1

The method of increasing the number of thin conductive layer printed wiring conductor lines that may be disposed on the surface of a printed wiring board insulating support body, comprising the steps of, disposing on said surface a layer of photopolymer, photo processing the photopolymer layer to produce a flat polymer outer surface with indented channels reaching to the surface of said insulating substrate thereby defining conductor paths by both two side wall surfaces on the polymer layer spanned by the substrate surface thereby to present significantly more surface area in the indented channels than afforded by the alternating flat ridge tops spaced between the conductor paths to define insulation spacings of precise dimensions between the conductor channels, and disposing on the indented channels the conductive lines comprising a surface coating of metallic electrical conductive material of predetermined thickness to produce thereby wider conductor lines more closely spaced together than possible on a flat surface with insulation spaces between the conductors and providing adjacent conductor lines that are less likely to short circuit by mechanically processing the flat ridge tops to assure that all conductive materials are removed therefrom in a manner without damage to the conductor lines on said side walls because of the flatness of the polymer outer surface.

Claim 2

The method of increasing the number of thin conductive layer printed wiring conductor lines that may be disposed on the surface of a printed wiring board insulating support body, comprising the steps of, disposing on said surface a layer of photopolymer, photo processing the photopolymer layer to produce a flat polymer outer surface with indented channels reaching to the surface of said insulating substrate thereby defining conductor paths by both two side wall surfaces on the polymer layer spanned by the substrate surface thereby to present significantly more surface area in the indented channels than afforded by the alternating flat ridge tops spaced between the conductor paths to define insulation spacings of precise dimensions between the conductor channels, and disposing on the indented channels the conductive lines comprising a surface coating of metallic electrical conductive material of predetermined thickness to produce thereby wider conductor lines more closely spaced together than possible on a flat surface with insulation spaces between the conductors and providing adjacent conductor lines that are less likely to short circuit by mechanically processing the flat ridge tops to assure that all conductive materials are removed therefrom in a manner without damage to the conductor lines on said side walls because of the flatness of the polymer outer surface.

Claim 6

The method of producing high density printed wiring boards having a plurality of closely spaced parallel conductors in a wiring pattern with conductor widths greater than the insulation spacing between adjacent conductors, comprising the steps of, providing on the surface of a substantially flat planar insulating printed wiring board surface a photopolymer layer, photoprinting in the photopolymer layer a plurality of channels extending below the photopolymer surface having a channel width substantially equal to the spacing on the photopolymer surface between the channels, and selectively covering the surface of said channels with a metallic conductor without disposing the conductor on the spacing of the photopolymer surface between the channels thereby to provide conductor lines wider than the spacing between the channels.

Claim 7

The method of producing high density printed wiring boards having a plurality of closely spaced parallel conductors in a wiring pattern with conductor widths greater than the insulation spacing between adjacent conductors, comprising the steps of, providing on the surface of a substantially flat planar insulating printed wiring board surface a photopolymer layer, photoprinting in the photopolymer layer a plurality of channels extending below the photopolymer surface having a channel width substantially equal to the spacing on the photopolymer surface between the channels, and selectively covering the surface of said channels with a metallic conductor without disposing the conductor on the spacing of the photopolymer surface between the channels thereby to provide conductor lines wider than the spacing between the channels.