EP0245713A1
Expired / Lapsed
EP
⏱️ 0.0 years remaining
Solder pads for use on printed circuit boards
Assignee: International Business Machines Corp
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Filing: 1987-04-30
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Granted: —
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Expires: 2007-04-30
Abstract
Abstract Alignment of leaded surface mount components to solder pads is enhanced by providing at least two soldered areas (12, 14) per lead, separated by a space of non-wettable material (16) so that during component placement on the soldered areas there is a tendency for the components to self centre as the leads fall between the raised soldered areas where they are retained during a reflow operation.
Inventors
- 👤 Duane Theodor Napp
- 👤 Kevin Joseph Roche
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-10-25 12:08
CPC Classifications
H; H05; H05K; H05K1/00; H05K1/02; H05K1/11; H05K1/111; H05K3/00; H05K3/30; H05K3/32; H05K3/34; H05K3/341; H05K3/3421; H05K1/0266; H05K1/0268; H05K1/112; H05K2201/00; H05K2201/09; H05K2201/09209; H05K2201/09372; H05K2201/09381; H05K2201/09654; H05K2201/09663; H05K2201/10; H05K2201/10613; H05K2201/10621; H05K2201/10689; H05K2203/00; H05K2203/04; H05K2203/044; H05K2203/0455; H05K2203/048; H05K3/3465; H05K3/3468; Y; Y02; Y02P; Y02P70/00; Y02P70/50
Claims Analysis
Total Claims: 17
Claim 1
Independent Claim
46 words
A method of attaching components to surface solder pads on printed circuitry comprising dividing each solder pad area into a plurality of sections metalising non-adjacent ones of said sections depositing solder on the metalised solder pad areas placing components on the solder; and reflowing the solder.
Claim 2
Independent Claim
46 words
A method of attaching components to surface solder pads on printed circuitry comprising dividing each solder pad area into a plurality of sections metalising non-adjacent ones of said sections depositing solder on the metalised solder pad areas placing components on the solder; and reflowing the solder.
Claim 3
Dependent Claim
19 words
A method as claimed in claim 1, wherein the dividing step includes dividing each solder pad into three areas.
Claim 4
Dependent Claim
18 words
A method as claimed in claim 1 or claim 2, wherein the metalising step includes plating with copper.
Claim 5
Independent Claim
48 words
A method of improving leaded surface mountable electronic component self alignment to solder pads having a generally rectangular shape comprising metalising non adjacent areas of the solder pads for providing two metalised areas per component lead; separating the two metalised areas; and depositing solder on the metalised areas.
Claim 6
Independent Claim
48 words
A method of improving leaded surface mountable electronic component self alignment to solder pads having a generally rectangular shape comprising metalising non adjacent areas of the solder pads for providing two metalised areas per component lead; separating the two metalised areas; and depositing solder on the metalised areas.
Claim 7
Independent Claim
21 words
A method as claimed in any preceding claim wherein the depositing step includes passing the solder pads over a solder wave.
Claim 8
Independent Claim
42 words
A method of enhancing leaded surface mount components to solder pad alignment on printed circuit boards comprising metalising surface solder pad areas associated with each lead in a generally U-shaped pattern; and depositing solder on the pad areas from a solder wave.
Claim 9
Independent Claim
42 words
A method of enhancing leaded surface mount components to solder pad alignment on printed circuit boards comprising metalising surface solder pad areas associated with each lead in a generally U-shaped pattern; and depositing solder on the pad areas from a solder wave.
Claim 10
Dependent Claim
33 words
A method as claimed in claim 6, wherein the depositing step includes using the width of the non-metalised area of each solder pad to aid in forming solder domes on the metalised areas.
Claim 11
Dependent Claim
27 words
A method as claimed in claim 6 or claim 7 including the additional step of providing a through hole in the base of the U-shaped metalised area.
Claim 12
Dependent Claim
50 words
A surface mount technique for improving leaded component to solder pad alignment on a printed circuit substrate comprising providing solder on a pad in a pattern covering less than the whole pad placing components so that their leads are aligned generally between the soldered pads; and reflowing the populated substrate.
Claim 13
Dependent Claim
50 words
A surface mount technique for improving leaded component to solder pad alignment on a printed circuit substrate comprising providing solder on a pad in a pattern covering less than the whole pad placing components so that their leads are aligned generally between the soldered pads; and reflowing the populated substrate.
Claim 14
Dependent Claim
24 words
A technique as claimed in claim 9 wherein the step of providing solder on the pad comprises passing the substrate over a solder wave.
Claim 15
Dependent Claim
36 words
A technique as claimed in claim 9 or claim 10, wherein the providing step additionally includes metalising less than the whole pad in a pattern comprising two parallel strips separated by an area of non-wettable material.
Claim 16
Independent Claim
46 words
A method of improving surface mount component alignment to solder pads on printing circuitry comprising metalising portions of each solder pad; and controlling the amount of solder deposited on each solder pad as a function of the geometry of the metalised portion of each solder pad.
Claim 17
Independent Claim
46 words
A method of improving surface mount component alignment to solder pads on printing circuitry comprising metalising portions of each solder pad; and controlling the amount of solder deposited on each solder pad as a function of the geometry of the metalised portion of each solder pad.
References Cited (Backward Citations)
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