US4254448A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Techniques for assembling electrical components with printed circuit boards
Assignee: AT&T Inc
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Filing: 1979-05-14
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Granted: 1981-03-03
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Expires: 1999-05-14
Abstract
Abstract Electrical components (10 or 30) are fastened to a mounting surface (16) of a printed circuit board (11) by forming a plurality of thermoplastic pins (20, 35) projecting from the mounting surface of the board adjacent to positions where components are to be located. The component is placed on the board so that portions of the component are located adjacent to portions of the pins, following which portions of the pins are heated and formed about portions of the component to form plastic locking sections (22 or 37) that fasten the component to the board in a desired position. The mounting surface (16) of the board may be formed with a pocket (18 or 33) that receives and positions the component at the desired location, so that component leads (17 or 32) extend along the mounting surface to positions overlapping lead-contact areas (14, 34) of printed contact patterns deposited on the mounting surface, after which the leads are attached to the contact areas, as by reflow soldering.
Inventors
- 👤 Gerald J. Martyniak
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-28 14:20
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/30; H05K3/32; H05K3/325; H05K1/00; H05K1/02; H05K1/0284; H05K1/11; H05K1/119; H05K1/18; H05K1/182; H05K1/183; H05K3/303; H05K3/34; H05K3/341; H05K3/3421; H05K1/111; H05K2201/00; H05K2201/01; H05K2201/0104; H05K2201/0129; H05K2201/09; H05K2201/09009; H05K2201/09036; H05K2201/091; H05K2201/09118; H05K2201/09209; H05K2201/09372; H05K2201/09472; H05K2201/09654; H05K2201/09745; H05K2201/10; H05K2201/10227; H05K2201/10393; H05K2201/10431; H05K2201/10568; H05K2201/10583; H05K2201/10598; H05K2201/10613; H05K2201/10621; H05K2201/10651; H05K2201/10689; H10; H10W; H10W72/00; Y; Y02; Y02P; Y02P70/00; Y02P70/50; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/4913; Y10T29/49144
Claims Analysis
Total Claims: 20
Claim 1
Independent Claim
198 words
An improved method of connecting an electrical component having leads projecting therefrom with a printed circuit board having a conductive pattern deposited on a mounting surface of an insulating substrate and having lead-contact areas deposited on the substrate at locations where the leads are to be electrically connected to the printed circuit, the method being of the type including the steps of (a) placing the component on the mounting surface of the board at a predetermined position in which the leads are aligned with the contact areas, and (b) thereafter bonding the leads to the contact area, wherein the improved method comprises the additional steps of: (c) forming a plurality of thermoplastic pins projecting outward from the substrate at locations adjacent to positions where portions of the component are placed in step (a); and (d) after step (a) and before step (b), heating and forming end portions of the pins about the adjacent portions of the component so as to form plastic locking sections that mechanically fasten the adjacent portions of the component to the board at the predetermined position and so that the leads align with the lead-contact areas of the printed circuit for the lead-bonding step.
Claim 2
Dependent Claim
198 words
An improved method of connecting an electrical component having leads projecting therefrom with a printed circuit board having a conductive pattern deposited on a mounting surface of an insulating substrate and having lead-contact areas deposited on the substrate at locations where the leads are to be electrically connected to the printed circuit, the method being of the type including the steps of (a) placing the component on the mounting surface of the board at a predetermined position in which the leads are aligned with the contact areas, and (b) thereafter bonding the leads to the contact area, wherein the improved method comprises the additional steps of: (c) forming a plurality of thermoplastic pins projecting outward from the substrate at locations adjacent to positions where portions of the component are placed in step (a); and (d) after step (a) and before step (b), heating and forming end portions of the pins about the adjacent portions of the component so as to form plastic locking sections that mechanically fasten the adjacent portions of the component to the board at the predetermined position and so that the leads align with the lead-contact areas of the printed circuit for the lead-bonding step.
Claim 3
Dependent Claim
31 words
A method as recited in claim 1, wherein the board includes a molded thermoplastic substrate and the pins comprise molded thermoplastic elements extending outwardly from the mounting surface of the substrate.
Claim 4
Dependent Claim
44 words
A method as recited in claim 2, wherein the mounting surface of the substrate is formed with a pocket for receiving and locating a body portion of the component with respect to the printed circuit patterns deposited on the mounting surface of the substrate.
Claim 5
Dependent Claim
59 words
A method as recited in claim 3, wherein the pocket is so formed and located that projecting electrical leads of the component extend from the body portion along the mounting surface of the substrate to positions overlapping the associated lead-contact areas of the printed circuit patterns; and wherein portions of the leads are subsequently attached to the contact areas.
Claim 6
Dependent Claim
30 words
A method as recited in claim 4, wherein the mounting surface of the substrate is also formed with grooves for receiving and aligning the leads with respect to the patterns.
Claim 7
Dependent Claim
27 words
A method as recited in claim 5, wherein portions of the grooves are coated with the printed-circuit conductor material to define the lead-contact areas in the grooves.
Claim 8
Dependent Claim
32 words
A method as recited in claim 6, wherein the grooves are arcuate grooves, shaped to fit and make substantial surface area contact with cylindrical leads of the component received in the grooves.
Claim 9
Independent Claim
24 words
A method as recited in any of claims 4, 6 or 7, wherein the leads are attached to the contact areas by reflow soldering.
Claim 10
Dependent Claim
52 words
A method as recited in claim 1, wherein the heating and forming step includes melting the outer ends of the pins and simultaneously causing flow of the melted portions about adjacent portions of the component to form the plastic locking sections that fasten the adjacent portions of the component to the board.
Claim 11
Dependent Claim
31 words
A method as recited in claim 9, wherein the pins are formed with chamfered tips that taper toward the substrate in the direction away from the adjacent portion of the component.
Claim 12
Dependent Claim
50 words
A method as recited in claim 10, wherein the molten portions of the pins are formed about the adjacent portions of the component by a heating element that contacts the tips of the pins and has an angular contact face shaped to form the melted plastic into the locking section.
Claim 13
Independent Claim
30 words
A method as recited in any of claims 9, 10 or 11, wherein the pins comprise rectangular tabs having flat vertical walls facing the adjacent mounting portions of the component.
Claim 14
Dependent Claim
13 words
A printed circuit-and-component assembly fabricated in accordance with the methods of claim 12.
Claim 15
Dependent Claim
31 words
A method as recited in claim 12, wherein the heating and forming process is performed by an ultrasonic plastic-melting horn having a contact face for melting and forming the thermoplastic material.
Claim 16
Independent Claim
53 words
A method as recited in any of claims 9, 10 or 11, wherein at least two pins are positioned across from each other sufficiently close together that portions of the molten plastic from the two pins run together to form a joint locking section covering and bridging the adjacent portion of the component.
Claim 17
Dependent Claim
13 words
A printed circuit-and-component assembly fabricated in accordance with the methods of claim 15.
Claim 18
Independent Claim
185 words
A method of fabricating a printed circuit board and connecting electrical components thereto, which comprises: (a) molding a thermoplastic substrate having a component-mounting surface, at least one pocket in that surface for receiving and locating a body portion of a component so that component leads extend along the mounting surface, and a plurality of molded thermoplastic studs projecting outwardly from the mounting surface at spaced positions adjacent to selected portions of components received in the pockets; (b) depositing a printed-circuit pattern on the mounting surface, including lead-contact areas at regions where the component leads are to be attached to the circuit; (c) placing the components in the pockets, the pockets being so shaped and arranged that the component leads extend along the mounting surface and portions of the leads overlap the lead-contact areas of the printed circuit; (d) melting end portions of the studs and forming the melted material about adjacent portions of the component to form plastic locking sections that fasten the adjacent portions of the component to the substrate; and then (e) attaching the leads to the contact areas of the printed circuit.
Claim 19
Independent Claim
185 words
A method of fabricating a printed circuit board and connecting electrical components thereto, which comprises: (a) molding a thermoplastic substrate having a component-mounting surface, at least one pocket in that surface for receiving and locating a body portion of a component so that component leads extend along the mounting surface, and a plurality of molded thermoplastic studs projecting outwardly from the mounting surface at spaced positions adjacent to selected portions of components received in the pockets; (b) depositing a printed-circuit pattern on the mounting surface, including lead-contact areas at regions where the component leads are to be attached to the circuit; (c) placing the components in the pockets, the pockets being so shaped and arranged that the component leads extend along the mounting surface and portions of the leads overlap the lead-contact areas of the printed circuit; (d) melting end portions of the studs and forming the melted material about adjacent portions of the component to form plastic locking sections that fasten the adjacent portions of the component to the substrate; and then (e) attaching the leads to the contact areas of the printed circuit.
Claim 20
Dependent Claim
22 words
A printed circuit-and-component assembly fabricated in accordance with the methods of any of claims 1, 2, 6, 9, 10, 11, or 17.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1984-03-02 | 1984-09-01 | 1985-03-03 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1988-03-02 | 1988-09-01 | 1989-03-03 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1992-03-02 | 1992-09-01 | 1993-03-03 | $7700.00 | Window Closed / Lapsed |