Abstract A method for manufacturing a semiconductor device, comprising the steps of selectively oxidizing a surface of a semiconductor layer of a first conductivity type so as to form a field oxide film, selectively forming an impurity region of a second conductivity type in an element region isolated by the field oxide film, forming a polycrystalline silicon pattern containing an impurity of the first conductivity type on a surface including at least part of the impurity region and the field oxide film, and diffusing the impurity of the first conductivity type from the polycrystalline silicon pattern into the impurity region so as to form another impurity region of the first conductivity type contiguous with the field oxide film, wherein a thickness t of the field oxide film and a concentration n of the impurity of the first conductivity type in the polycrystalline silicon pattern have the following relation: t (μm)≦-0.117×10.sup.-20 (μm·cm 3 )·n(cm -3 )+1.42 (μm) for 1×10 19 ≦n(cm -3 )≦1×10 21 . The method eliminates short-circuiting and flow of leakage current between the collector and emitter, and improves manufacturing yield.
A method for manufacturing a semiconductor device, comprising the steps of: selectively oxidizing a surface of a semiconductor layer of a first conductivity type so as to form a field oxide film; selectively forming an impurity region of a second conductivity type in an element region isolated by said field oxide film; forming a polycrystalline silicon pattern containing an inpurity of the first conductivity type on a surface including at least part of said impurity region and said field oxide film; and diffusing the impurity of the first conductivity type from said polycrystalline silicon pattern into said impurity region so as to form another impurity region of the first conductivity type contiguous with said field oxide film; wherein a thickness t of said field oxide film and a concentration n of the impurity of the first conductivity type in said polycrystalline silicon pattern have the following relation: t(μm)≦-0.117×10.sup.-20 (μm·cm.sup.3)·n(cm.sup.-3)+1.42(μm) for 1×10 19 ≦n(cm -3 )≦1×10 21 .
Claim 2
Independent Claim
157 words
A method for manufacturing a semiconductor device, comprising the steps of: selectively oxidizing a surface of a semiconductor layer of a first conductivity type so as to form a field oxide film; selectively forming an impurity region of a second conductivity type in an element region isolated by said field oxide film; forming a polycrystalline silicon pattern containing an inpurity of the first conductivity type on a surface including at least part of said impurity region and said field oxide film; and diffusing the impurity of the first conductivity type from said polycrystalline silicon pattern into said impurity region so as to form another impurity region of the first conductivity type contiguous with said field oxide film; wherein a thickness t of said field oxide film and a concentration n of the impurity of the first conductivity type in said polycrystalline silicon pattern have the following relation: t(μm)≦-0.117×10.sup.-20 (μm·cm.sup.3)·n(cm.sup.-3)+1.42(μm) for 1×10 19 ≦n(cm -3 )≦1×10 21 .
Claim 3
Dependent Claim
51 words
A method according to claim 1, wherein said impurity region of the second conductivity type constitutes a base region, said impurity region of the first conductivity type constitutes an emitter region and a collector contact region, and said polycrystalline silicon pattern constitutes electrodes for said emitter region and a collector region.
Claim 4
Dependent Claim
49 words
A method according to claim 1, wherein said polycrystalline silicon pattern is formed by forming an undoped polycrystalline silicon film on said surface, ion-implanting arsenic in said undoped polycrystalline silicon film, annealing to render an arsenic concentration in said polycrystalline silicon film uniform, and patterning said polycrystalline silicon film.
Claim 5
Dependent Claim
34 words
A method according to claim 1, wherein said polycrystalline silicon pattern is formed by depositing an arsenic-doped polycrystalline silicon film on said surface by chemical vapor deposition and subsequently patterning said polycrystalline silicon film.