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US4049478A Expired / Lapsed US ⏱️ 0.0 years remaining

Utilization of an arsenic diffused emitter in the fabrication of a high performance semiconductor device

Assignee: International Business Machines Corp
•
Filing: 1975-12-08
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Granted: 1977-09-20
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Expires: 1995-12-08
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Abstract

Abstract A substantially square N-type impurity distribution profile in a silicon substrate produces much superior dc and ac characteristics in PN junction devices than can be expected from the usual phosphorus distribution profile. Such a square profile is obtained by diffusion of arsenic in the silicon substrate. The sharper impurity gradient allows a relatively low surface concentration to be used for the device. This lower surface concentration relieves precipitation and dislocation problems.

Inventors

  • 👤 Hitendra N. Ghosh
  • 👤 Madhukar L. Joshi
  • 👤 Tsu-Hsing Yeh

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-10-26 09:07
CPC Classifications
H; H10; H10P; H10P32/00; H10D; H10D62/00; H10D62/10; H10D62/13; H10D62/133; H10P32/10; H10P32/12; H10P32/17; H10P32/171; Y; Y10; Y10S; Y10S148/00; Y10S148/04; Y10S148/041; Y10S148/085; Y10S148/157

Claims Analysis

Total Claims: 5
Claim 1
Independent Claim 78 words
The mehtod of forming a high performance PN semiconductor device comprising: introducing a P-type impurity into a silicon semi-conductor body so as to provide a surface concentration level of greater than about 10 19 atoms per cm 3 ; diffusing arsenic within said P-type region so as to provide a surface concentration level of arsenic of greater than about 10 20 per cm 3 ; continuing said diffusion step until said arsenic forms a substantially square impurity distribution.
Claim 2
Dependent Claim 78 words
The mehtod of forming a high performance PN semiconductor device comprising: introducing a P-type impurity into a silicon semi-conductor body so as to provide a surface concentration level of greater than about 10 19 atoms per cm 3 ; diffusing arsenic within said P-type region so as to provide a surface concentration level of arsenic of greater than about 10 20 per cm 3 ; continuing said diffusion step until said arsenic forms a substantially square impurity distribution.
Claim 3
Dependent Claim 16 words
The method of forming a semiconductor device of claim 1 wherein said P-type impurity is boron.
Claim 4
Dependent Claim 48 words
The method as in claim 1 wherein said diffusion step comprises: placing said devices into a diffusion furnace heated to around 1000° C. to 1200° C.; and providing an arsenic capsule source, having an impurity of around 10 21 atoms/cm 3 available in said capsule, in said furnace.
Claim 5
Dependent Claim 16 words
The method as in claim 3 wherein said diffusing step continues for at least 1 hour.

References Cited (Backward Citations)

US3477886A Cited
US3484313A Cited
US3455748A Cited
US3707410A Cited
US3852127A Cited
US3638081A Cited
US3600241A Cited
US3607468A Cited
US3713908A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1980-09-19 1981-03-21 1981-09-20 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1984-09-19 1985-03-21 1985-09-20 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 1988-09-19 1989-03-21 1989-09-20 $7700.00 Window Closed / Lapsed

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