US7253519B2
Expired / Lapsed
US
⏱️ 0.0 years remaining
Chip packaging structure having redistribution layer with recess
Assignee: Advanced Semiconductor Engineering Inc
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Filing: 2004-06-09
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Granted: 2007-08-07
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Expires: 2024-06-09
Abstract
Abstract A chip structure comprising a chip, a redistribution layer, a second passivation layer and at least a bump is provided. The chip has a first passivation layer and at least a bonding pad. The first passivation layer exposes the bonding pad and has at least a recess. The redistribution layer is formed over the first passivation layer and electrically connected to the bonding pad. Furthermore, the redistribution layer also extends from the bonding pad to the recess. The second passivation layer is formed over the first passivation layer and the redistribution layer. The second passivation layer also has an opening that exposes the redistribution layer above the recess. The bump passes through the opening and connects electrically with the redistribution layer above the recess.
Inventors
- 👤 Min-Lung Huang
- 👤 Chi-Long Tsai
- 👤 Chao-Fu Weng
- 👤 Ching-Huei Su
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-01 08:48
CPC Classifications
H; H10; H10W; H10W72/00; H10W72/20; H10W20/00; H10W20/01; H10W20/031; H10W72/01; H10W72/012; H10W74/00; H10W74/10; H10W74/111; H10W74/129; H10W70/00; H10W70/60; H10W70/62; H10W70/65; H10W72/019; H10W72/241; H10W72/242; H10W72/251; H10W72/90; H10W72/921; H10W72/922; H10W72/9223; H10W72/923; H10W72/941; H10W72/9415; H10W72/942; H10W72/951; H10W72/952
Claims Analysis
Total Claims: 20
Claim 1
Independent Claim
202 words
A chip packaging structure, comprising: a chip having a first passivation layer and at least a bonding pad, wherein the bonding pad is exposed by the first passivation layer and the first passivation layer has at least a recess, the whole recess has a sidewall and a bottom surface being exposed; a redistribution layer formed over the first passivation layer, wherein the redistribution layer electrically connects with the bonding pad and extends from the bonding pad to the recess, and in contact with the sidewall and the bottom surface of the recess and the redistribution layer further comprises: a first metallic layer formed over the first passivation layer, wherein a material constituting the first metallic layer is selected from the group consisting of aluminum, titanium, titanium-tungsten alloy, tantalum, tantalum nitride and chromium; a second metallic layer formed over the first metallic layer; and a third metallic layer formed over the second metallic layer; a second passivation layer formed over the first passivation layer and the redistribution layer, wherein the second passivation layer has an opening that exposes the redistribution layer above the recess; and at least a bump disposed inside the opening and electrically connected to the redistribution layer above the recess.
Claim 2
Dependent Claim
202 words
A chip packaging structure, comprising: a chip having a first passivation layer and at least a bonding pad, wherein the bonding pad is exposed by the first passivation layer and the first passivation layer has at least a recess, the whole recess has a sidewall and a bottom surface being exposed; a redistribution layer formed over the first passivation layer, wherein the redistribution layer electrically connects with the bonding pad and extends from the bonding pad to the recess, and in contact with the sidewall and the bottom surface of the recess and the redistribution layer further comprises: a first metallic layer formed over the first passivation layer, wherein a material constituting the first metallic layer is selected from the group consisting of aluminum, titanium, titanium-tungsten alloy, tantalum, tantalum nitride and chromium; a second metallic layer formed over the first metallic layer; and a third metallic layer formed over the second metallic layer; a second passivation layer formed over the first passivation layer and the redistribution layer, wherein the second passivation layer has an opening that exposes the redistribution layer above the recess; and at least a bump disposed inside the opening and electrically connected to the redistribution layer above the recess.
Claim 3
Dependent Claim
31 words
The chip packaging structure of claim 1 , wherein the recess has an obtuse angle and is formed between the sidewall of the recess and the bottom surface of the recess.
Claim 4
Dependent Claim
53 words
The chip packaging structure of claim 1 , further comprising at least an under-bump-metallurgy layer formed in the opening of the second passivation layer and extending over an upper surface of the second passivation layer, wherein the hump is on the under-bump-metallurgy layer and electrically connected to the redistribution layer above the recess.
Claim 5
Dependent Claim
34 words
The chip structure of claim 3 , wherein the under-bump-metallurgy layer further comprises: a first metallic layer formed over the opening-exposed redistribution layer; and a second metallic layer formed over the first metallic layer.
Claim 6
Dependent Claim
31 words
The chip structure of claim 4 , wherein a material constituting the first metallic layer is selected from the group consisting of aluminum, titanium, titanium-tungsten alloy, tantalum, tantalum nitride and chromium.
Claim 7
Dependent Claim
17 words
The chip structure of claim 4 , wherein a material constituting the second metallic layer comprises copper.
Claim 8
Dependent Claim
55 words
The chip structure of claim 4 , wherein the under-bump-metallurgy layer further comprises at least an electroplated layer formed over the second metallic layer and the electroplated layer is selected from the group consisting of an electroplated copper layer, an electroplated nickel layer, an electroless nickel layer, an electroless plated gold layer and combination thereof.
Claim 9
Dependent Claim
45 words
The chip packaging structure of claim 3 , wherein the under-bump-metallurgy layer further comprises: a first metallic layer formed over the opening-exposed redistribution layer; a second metallic layer formed over the first metallic layer; and a third metallic layer formed over the second metallic layer.
Claim 10
Dependent Claim
32 words
The chip packaging structure or claim 8 , wherein a material constituting the first metallic layer is selected from the group consisting of aluminum, titanium, titanium-tungsten alloy, tantalum, tantalum nitride and chromium.
Claim 11
Dependent Claim
28 words
The chip packaging structure of claim 8 , wherein a material constituting the second metallic layer is selected from the group consisting of nickel-vanadium alloy and copper-chromium alloy.
Claim 12
Dependent Claim
18 words
The chip packaging structure of claim 8 , wherein a material constituting the third metallic layer comprises copper.
Claim 13
Dependent Claim
51 words
The chip packaging structure of claim 8 , wherein the under-bump-metallurgy layer further comprises at least an electroplated layer formed over the third metallic layer and the electroplated layer is selected from the group consisting of an electroplated copper layer, an electroplated nickel layer, an electroplated gold layer and combination thereof.
Claim 14
Dependent Claim
18 words
The chip packaging structure of claim 1 , wherein a material constituting the second metallic layer comprises copper.
Claim 15
Dependent Claim
198 words
A chip packaging structure, comprising: a chip haying a first passivation layer and at least a bonding pad, wherein the bonding pad is exposed by the first passivation layer and the first passivation layer has at least a recess, the whole recess has a sidewall and a bottom surface being exposed; a redistribution layer formed over the first passivation layer, wherein the redistribution layer electrically connects with the bonding pad and extends from the bonding, pad to the recess, and in contact with the sidewall and the bottom surface of the recess and the redistribution layer further comprises: a first metallic layer formed over the first passivation layer; a second metallic layer formed over the first metallic layer, wherein a material constituting the second metallic layer is selected from the group consisting of nickel-vanadium alloy and copper-chromium alloy, and a third metallic layer formed over the second metallic layer; a second passivation layer formed over the first passivation layer and the redistribution layer, wherein the second passivation layer has an opening that exposes the redistribution layer above the recess; and at least a bump disposed inside the opening and electrically connected to the redistribution layer above the recess.
Claim 16
Dependent Claim
198 words
A chip packaging structure, comprising: a chip haying a first passivation layer and at least a bonding pad, wherein the bonding pad is exposed by the first passivation layer and the first passivation layer has at least a recess, the whole recess has a sidewall and a bottom surface being exposed; a redistribution layer formed over the first passivation layer, wherein the redistribution layer electrically connects with the bonding pad and extends from the bonding, pad to the recess, and in contact with the sidewall and the bottom surface of the recess and the redistribution layer further comprises: a first metallic layer formed over the first passivation layer; a second metallic layer formed over the first metallic layer, wherein a material constituting the second metallic layer is selected from the group consisting of nickel-vanadium alloy and copper-chromium alloy, and a third metallic layer formed over the second metallic layer; a second passivation layer formed over the first passivation layer and the redistribution layer, wherein the second passivation layer has an opening that exposes the redistribution layer above the recess; and at least a bump disposed inside the opening and electrically connected to the redistribution layer above the recess.
Claim 17
Dependent Claim
18 words
The chip packaging structure of claim 14 , wherein a material constituting the third metallic layer comprises copper.
Claim 18
Dependent Claim
27 words
The chip packaging structure of claim 1 , wherein an obtuse angle is formed between a sidewall of the opening and a bottom surface of the opening.
Claim 19
Dependent Claim
31 words
The chip packaging structure of claim 14 , wherein the recess has an obtuse angle and is formed between the sidewall of the recess and the bottom surface of the recess.
Claim 20
Dependent Claim
53 words
The chip packaging structure of claim 14 , further comprising at least an under-bump-metallurgy layer formed in the opening of the second passivation layer and extending over an upper surface of the second passivation layer, wherein the bump is on the under-bump-metallurgy layer and electrically connected to the redistribution layer above the recess.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2010-08-06 | 2011-02-05 | 2011-08-07 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2014-08-06 | 2015-02-05 | 2015-08-07 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2018-08-06 | 2019-02-05 | 2019-08-07 | $7700.00 | Window Closed / Lapsed |