Interposer for electrically coupling a semiconductive device to an electrical apparatus

Claim 2

An interposer for electrically coupling a semiconductive device to an electrical apparatus, the interposer comprising: an electrically insulative substrate for removable coupling to an electrical apparatus, said substrate having a portion that has a uniform thickness, and said portion having a planar surface, said planar surface being part of a substrate outermost surface for receiving thereover a semiconductive device such that said semiconductive device lies at least in part over said outermost surface and is unimbedded into said substrate; and an electrical conductor on the planar surface of the portion of the electrically insulative substrate, the electrical conductor having a receiving end on the planar surface of the portion of the electrically insulative substrate for contacting an electrically conductive terminal on connecting to said semiconductive device at electrically conductive terminals of said semiconductive device and such that at least some of said terminals are located in the region between said semiconductive device and said outermost surface of said substrate, and a terminal end on the planar surface of the portion of the electrically insulative substrate for connecting to said electrical apparatus, such that the coupling of said substrate to said electrical apparatus structurally supports said substrate with said terminal end in electric contact with said electric apparatus.

Claim 3

An interposer as recited in claim 1 , wherein the substrate comprises crystalline glass.

Claim 4

An interposer as recited in claim 1 , wherein the receiving end protrudes upwardly with respect to the substrate.

Claim 5

An interposer as recited in claim 1 , wherein the receiving end is disposed within a recess in the substrate.

Claim 6

An interposer as recited in claim 1 , wherein the substrate comprises a material selected from the group consisting of glass, alumina, glass ceramic, nonmetallic nitride, aluminum nitride, nonmetallic carbide, and mixtures thereof.

Claim 7

An interposer as recited in claim 1 , wherein the substrate comprises a nitride.

Claim 8

An interposer as recited in claim 6 , wherein the nitride comprises boron nitride.

Claim 9

An interposer as recited in claim 6 , wherein the nitride comprises nonmetallic nitride.

Claim 10

An interposer as recited in claim 1 , wherein the interposer further comprises an electrically insulating layer on a portion of the conductor between the receiving end and the terminal end.

Claim 11

An interposer as recited in claim 1 , wherein the substrate comprises a carbide.

Claim 12

An interposer as recited in claim 10 , wherein the carbide comprises nonmetallic carbide.

Claim 13

An interposer as recited in claim 1 , wherein the electric apparatus is selected from the group consisting of a computer, a program logic controller, an electronic game assembly, and a controlling module.

Claim 14

An interposer as recited in claim 1 , wherein the electric apparatus that monitors, tests, or evaluates the semiconductive device.

Claim 15

An interposer for electrically coupling a semiconductive device to an electrical apparatus, the interposer comprising: a sheet for removable coupling to an electrical apparatus, said sheet having a portion that has a uniform thickness, and said sheet comprised of an electrically insulating material, said sheet having an outermost surface for receiving thereon a semiconductive device such that said semiconductive device lies at least in part on said outermost surface and is unimbedded into said sheet; and an electrical conductor on the portion, the electrical conductor having a receiving end on said portion for connecting to said semiconductive device at electrically conductive terminals of said semiconductive device such that at least some of said terminals are located in the region between said semiconductive device and said outermost surface of said sheet, and a terminal end on said portion for connecting to said electrical apparatus, such that the semiconductive device is electrically coupled to the electrical apparatus when the semiconductive device is connected to the receiving end of the electrical conductor and the terminal end of the electrical conductor is connected to the electrical apparatus, such that the coupling of said sheet to said electrical apparatus structurally supports said sheet with said terminal end in electric contact with said electrical apparatus.

Claim 16

An interposer for electrically coupling a semiconductive device to an electrical apparatus, the interposer comprising: a sheet for removable coupling to an electrical apparatus, said sheet having a portion that has a uniform thickness, and said sheet comprised of an electrically insulating material, said sheet having an outermost surface for receiving thereon a semiconductive device such that said semiconductive device lies at least in part on said outermost surface and is unimbedded into said sheet; and an electrical conductor on the portion, the electrical conductor having a receiving end on said portion for connecting to said semiconductive device at electrically conductive terminals of said semiconductive device such that at least some of said terminals are located in the region between said semiconductive device and said outermost surface of said sheet, and a terminal end on said portion for connecting to said electrical apparatus, such that the semiconductive device is electrically coupled to the electrical apparatus when the semiconductive device is connected to the receiving end of the electrical conductor and the terminal end of the electrical conductor is connected to the electrical apparatus, such that the coupling of said sheet to said electrical apparatus structurally supports said sheet with said terminal end in electric contact with said electrical apparatus.

Claim 17

An interposer as recited in claim 14 , wherein the material comprises alumina.

Claim 18

An interposer as recited in claim 14 , wherein the material comprises crystallized glass.

Claim 19

An interposer for electrically coupling a semiconductive device to an electrical apparatus, the interposer comprising: an electrically insulative sheet for removable coupling to an electrical apparatus, said sheet having a portion that has a uniform thickness, and said portion being composed of a material selected from the group consisting of devitrified ceramics, vitro ceramics, single oxide ceramics, and mixed oxide ceramics, and mixtures thereof, said sheet having an outermost surface for receiving thereon a semiconductive device such that said semiconductive device lies at least in part on said outermost surface and is unimbedded into said sheet; and an electrical conductor on said portion, the electrical conductor having a receiving end on said portion for connecting to said semiconductive device at electrically conductive terminals of said semiconductive device such that at least some of said terminals are located in the region between said semiconductive device and said outermost surface of said sheet, and a terminal end on said portion for connecting to said electrical apparatus, such that the semiconductive device is electrically coupled to the electrical apparatus when the semiconductive device is connected to the receiving end of the electrical conductor and the terminal end of the electrical conductor is connected to the electrical apparatus, such that the coupling of said sheet to said electrical apparatus structurally supports said sheet with said terminal end in electric contact with said electrical apparatus.

Claim 20

An interposer for electrically coupling a semiconductive device to an electrical apparatus, the interposer comprising: an electrically insulative sheet for removable coupling to an electrical apparatus, said sheet having a portion that has a uniform thickness, and said portion being composed of a material selected from the group consisting of devitrified ceramics, vitro ceramics, single oxide ceramics, and mixed oxide ceramics, and mixtures thereof, said sheet having an outermost surface for receiving thereon a semiconductive device such that said semiconductive device lies at least in part on said outermost surface and is unimbedded into said sheet; and an electrical conductor on said portion, the electrical conductor having a receiving end on said portion for connecting to said semiconductive device at electrically conductive terminals of said semiconductive device such that at least some of said terminals are located in the region between said semiconductive device and said outermost surface of said sheet, and a terminal end on said portion for connecting to said electrical apparatus, such that the semiconductive device is electrically coupled to the electrical apparatus when the semiconductive device is connected to the receiving end of the electrical conductor and the terminal end of the electrical conductor is connected to the electrical apparatus, such that the coupling of said sheet to said electrical apparatus structurally supports said sheet with said terminal end in electric contact with said electrical apparatus.

Claim 21

The interposer as defined in claim 17 , wherein: the portion of the sheet has a planar surface; the electrical conductor is on the planar surface of the portion of the sheet; the receiving end is on the planar surface of the portion of the sheet; and the terminal end is on the planar surface of the portion of the sheet.

Claim 22

An interposer for electrically coupling a semiconductive device to an electrical apparatus, the interposer comprising: an electrically insulative sheet for removable coupling to an electrical apparatus, said sheet having a portion that has a uniform thickness, and said portion being composed of an electrically insulating material selected from the group consisting of alumina, alumina with silica, alumina with silicates, alumina with derivatives of silicates, and mixtures thereof, said sheet having an outermost surface for receiving thereon a semiconductive device such that said semiconductive device lies at least in part on said outermost surface and is unimbedded into said sheet; and an electrical conductor on said portion, the electrical conductor having a receiving end on said portion for connecting to said semiconductive device at electrically conductive terminals of said semiconductive device such that at least some of said terminals are located in the region between said semiconductive device and said outermost surface of said sheet, and a terminal end on said portion for connecting to said electrical apparatus, such that the semiconductive device is electrically coupled to the electrical apparatus when the semiconductive device is connected to the receiving end of the electrical conductor and the terminal end of the electrical conductor is connected to the electrical apparatus, such that the coupling of said sheet to said electrical apparatus structurally supports said sheet with said terminal end in electric contact with said electrical apparatus.

Claim 23

An interposer for electrically coupling a semiconductive device to an electrical apparatus, the interposer comprising: an electrically insulative sheet for removable coupling to an electrical apparatus, said sheet having a portion that has a uniform thickness, and said portion being composed of an electrically insulating material selected from the group consisting of alumina, alumina with silica, alumina with silicates, alumina with derivatives of silicates, and mixtures thereof, said sheet having an outermost surface for receiving thereon a semiconductive device such that said semiconductive device lies at least in part on said outermost surface and is unimbedded into said sheet; and an electrical conductor on said portion, the electrical conductor having a receiving end on said portion for connecting to said semiconductive device at electrically conductive terminals of said semiconductive device such that at least some of said terminals are located in the region between said semiconductive device and said outermost surface of said sheet, and a terminal end on said portion for connecting to said electrical apparatus, such that the semiconductive device is electrically coupled to the electrical apparatus when the semiconductive device is connected to the receiving end of the electrical conductor and the terminal end of the electrical conductor is connected to the electrical apparatus, such that the coupling of said sheet to said electrical apparatus structurally supports said sheet with said terminal end in electric contact with said electrical apparatus.

Claim 24

The interposer as defined in claim 19 , wherein: the portion of the sheet has a planar surface; the electrical conductor is on the planar surface of the portion of the sheet; the receiving end is on the planar surface of the portion of the sheet; and the terminal end is on the planar surface of the portion of the sheet.

Claim 25

An interposer for electrically coupling a semiconductive device to an electrical apparatus, the interposer comprising: an electrically insulative sheet for removable coupling to an electrical apparatus, said sheet having a portion that has a uniform thickness, and said portion being composed of an electrically insulating material selected from the group consisting of boron nitrides, aluminum nitrides, and mixtures thereof, said sheet having an outermost surface for receiving thereon a semiconductive device such that said semiconductive device lies at least in part on said outermost surface and is unimbedded into said sheet; and an electrical conductor on said portion, the electrical conductor having a receiving end on said portion for connecting to said semiconductive device at electrically conductive terminals of said semiconductive device such that at least some of said terminals are located in the region between said semiconductive device and said outermost surface of said sheet, and a terminal end on said portion for connecting to said electrical apparatus, such that the semiconductive device is electrically coupled to the electrical apparatus when the semiconductive device is connected to the receiving end of the electrical conductor and the terminal end of the electrical conductor is connected to the electrical apparatus, such that the coupling of said sheet to said electrical apparatus structurally supports said sheet with said terminal end in electric contact with said electrical apparatus.

Claim 26

An interposer for electrically coupling a semiconductive device to an electrical apparatus, the interposer comprising: an electrically insulative sheet for removable coupling to an electrical apparatus, said sheet having a portion that has a uniform thickness, and said portion being composed of an electrically insulating material selected from the group consisting of boron nitrides, aluminum nitrides, and mixtures thereof, said sheet having an outermost surface for receiving thereon a semiconductive device such that said semiconductive device lies at least in part on said outermost surface and is unimbedded into said sheet; and an electrical conductor on said portion, the electrical conductor having a receiving end on said portion for connecting to said semiconductive device at electrically conductive terminals of said semiconductive device such that at least some of said terminals are located in the region between said semiconductive device and said outermost surface of said sheet, and a terminal end on said portion for connecting to said electrical apparatus, such that the semiconductive device is electrically coupled to the electrical apparatus when the semiconductive device is connected to the receiving end of the electrical conductor and the terminal end of the electrical conductor is connected to the electrical apparatus, such that the coupling of said sheet to said electrical apparatus structurally supports said sheet with said terminal end in electric contact with said electrical apparatus.

Claim 27

The interposer as defined in claim 21 , wherein: the portion of the sheet has a planar surface; the electrical conductor is on the planar surface of the portion of the sheet; the receiving end is on the planar surface of the portion of the sheet; and the terminal end is on the planar surface of the portion of the sheet.

Claim 28

An interposer for electrically coupling a semiconductive device to an electrical apparatus, the interposer comprising: an electrically insulative substrate for removable coupling to an electrical apparatus, said substrate being comprised of a material selected from the group consisting of crystalline glass, nitride, and carbide, and mixtures thereof, said substrate having an outermost surface for receiving thereon a semiconductive device such that said semiconductive device lies at least in part on said outermost surface and is unimbedded into said substrate; and an electrical conductor on the substrate, the electrical conductor having a receiving end for connecting to said semiconductive device at electrically conductive terminals of said semiconductive device such that at least some of said terminals are located in the region between said semiconductive device and said outermost surface of said substrate, and a terminal end for connecting to said electrical apparatus, such that the coupling of said substrate to said electrical apparatus structurally supports said substrate with said terminal and in electrical contact with said electrical apparatus.

Claim 29

An interposer for electrically coupling a semiconductive device to an electrical apparatus, the interposer comprising: an electrically insulative substrate for removable coupling to an electrical apparatus, said substrate being comprised of a material selected from the group consisting of crystalline glass, nitride, and carbide, and mixtures thereof, said substrate having an outermost surface for receiving thereon a semiconductive device such that said semiconductive device lies at least in part on said outermost surface and is unimbedded into said substrate; and an electrical conductor on the substrate, the electrical conductor having a receiving end for connecting to said semiconductive device at electrically conductive terminals of said semiconductive device such that at least some of said terminals are located in the region between said semiconductive device and said outermost surface of said substrate, and a terminal end for connecting to said electrical apparatus, such that the coupling of said substrate to said electrical apparatus structurally supports said substrate with said terminal and in electrical contact with said electrical apparatus.

Claim 30

The interposer as defined in claim 23 , wherein the nitride is a nonmetallic nitride.

Claim 31

The interposer as defined in claim 23 , wherein the nonmetallic nitride is boron nitride.

Claim 32

The interposer as defined in claim 23 , wherein the carbide is a nonmetallic carbide.

Claim 33

An interposer for electrically coupling a semiconductive device to an electrical apparatus, the interposer comprising: a substrate for coupling to an electric apparatus, the electrical apparatus selected from the group consisting of a computer, a program logic controller, an electronic game assembly, a controlling module, and a testing apparatus which monitors, tests, or evaluates the semiconductive device, the substrate having a planar surface, said planar surface being part of a substrate outermost surface for receiving thereover a semiconductive device such that said semiconductive device lies at least in part over said outermost surface and is unimbedded into said substrate; and an electrical conductor on the planar surface of the portion of the electrically insulative substrate, the electrical conductor having: a receiving end on the planar surface of the portion of the electrically insulative substrate for connecting to said semiconductive device at electrically conductive terminals of said semiconductive device and such that at least some of said terminals are located in the region between said semiconductive device and said outermost surface of said substrate, and a terminal end on the planar surface of the portion of the electrically insulative substrate for coupling to the electrical apparatus, such that the coupling of said substrate to said electrical apparatus puts said terminal end in electric contact with said electrical apparatus and structurally supports said substrate.

Claim 34

An interposer for electrically coupling a semiconductive device to an electrical apparatus, the interposer comprising: a substrate for coupling to an electric apparatus, the electrical apparatus selected from the group consisting of a computer, a program logic controller, an electronic game assembly, a controlling module, and a testing apparatus which monitors, tests, or evaluates the semiconductive device, the substrate having a planar surface, said planar surface being part of a substrate outermost surface for receiving thereover a semiconductive device such that said semiconductive device lies at least in part over said outermost surface and is unimbedded into said substrate; and an electrical conductor on the planar surface of the portion of the electrically insulative substrate, the electrical conductor having: a receiving end on the planar surface of the portion of the electrically insulative substrate for connecting to said semiconductive device at electrically conductive terminals of said semiconductive device and such that at least some of said terminals are located in the region between said semiconductive device and said outermost surface of said substrate, and a terminal end on the planar surface of the portion of the electrically insulative substrate for coupling to the electrical apparatus, such that the coupling of said substrate to said electrical apparatus puts said terminal end in electric contact with said electrical apparatus and structurally supports said substrate.