Patent US7160323B2 successfully refreshed from Google Patents.
US4697143A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Wafer probe
Assignee: FormFactor Beaverton Inc
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Filing: 1984-04-30
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Granted: 1987-09-29
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Expires: 2004-04-30
Abstract
Abstract A wafer probe is provided having metallic transmission lines mounted on a tapered alumina substrate generally surrounded by microwave absorbing material. The probe provides for on-wafer measurements of small planar devices at frequencies from DC to at least 18 GHz with low inductance, and with constant characteristic impedance from the probe external cable terminal to the point of contact on device being probed. The microwave absorbing material absorbs energy propagating along the probe ground preventing this energy from resonating, radiating and re-exciting normal transmission line modes with minimal transmission line mode resonance along the probe ground. The probe, which may be coupled to receive signals from a coaxial cable, is capable of making contact with bonding pads of a device having a center-to-center distance between pads of only 4 mils.
Inventors
- 👤 Larry R. Lockwood
- 👤 Kimberly R. Gleason
- 👤 Eric W. Strid
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-23 14:46
CPC Classifications
G; G01; G01R; G01R1/00; G01R1/02; G01R1/06; G01R1/067; G01R1/06772; G01R1/073; G01R1/07307; G01R1/07342
Claims Analysis
Total Claims: 42
Claim 1
Independent Claim
85 words
A probe for connecting electrical test equipment to selected points on a small planar device on a semiconductive wafer, comprising: a transmission line assembly, having a probe board and having a metallic signal conductor and a metallic ground conductor spaced from said metallic signal conductor on the probe board; and selected microwave absorbing material positioned near the transmission line ground conductor on said probe board, said absorbing material having a thickness at least as great as the spacing between said signal conductor and ground conductor.
Claim 2
Dependent Claim
85 words
A probe for connecting electrical test equipment to selected points on a small planar device on a semiconductive wafer, comprising: a transmission line assembly, having a probe board and having a metallic signal conductor and a metallic ground conductor spaced from said metallic signal conductor on the probe board; and selected microwave absorbing material positioned near the transmission line ground conductor on said probe board, said absorbing material having a thickness at least as great as the spacing between said signal conductor and ground conductor.
Claim 3
Dependent Claim
27 words
A probe as in claim 1 wherein the selected microwave absorbing material has a high magnetic loss coefficient and a characteristic impedance near that of free space.
Claim 4
Dependent Claim
14 words
A probe as in claim 1 wherein the probe board comprises a dielectric material.
Claim 5
Dependent Claim
17 words
A probe as in claim 1 wherein the probe board comprises alumina (A1 2 O 3 ).
Claim 6
Dependent Claim
14 words
A probe as in claim 1 wherein the selected microwave absorbing material comprises ferrite.
Claim 7
Dependent Claim
14 words
A probe as in claim 1 wherein the selected microwave absorbing material comprises iron.
Claim 8
Dependent Claim
17 words
A probe as in claim 1 wherein the selected microwave absorbing material generally surrounds the transmission line.
Claim 9
Dependent Claim
95 words
A probe for connecting electrical test equipment to selected points on a small planar device on a semiconductive wafer, comprising: a transmission line assembly, having a probe board and having a metallic signal conductor and a metallic ground conductor deposited in a coplanar fashion in one side of the probe board; and selected microwave absorbing material positioned near the transmission line ground conductor for substantially absorbing extraneous external transmission line modes, said absorbing material comprising a body of material having a high magnetic loss coefficient and positioned near and substantially coplanar with said probe board.
Claim 10
Dependent Claim
95 words
A probe for connecting electrical test equipment to selected points on a small planar device on a semiconductive wafer, comprising: a transmission line assembly, having a probe board and having a metallic signal conductor and a metallic ground conductor deposited in a coplanar fashion in one side of the probe board; and selected microwave absorbing material positioned near the transmission line ground conductor for substantially absorbing extraneous external transmission line modes, said absorbing material comprising a body of material having a high magnetic loss coefficient and positioned near and substantially coplanar with said probe board.
Claim 11
Dependent Claim
73 words
A probe for connecting electrical test equipment to selected points on a small planar device on a semiconductive wafer, comprising: a transmission line assembly having a probe board, with a top and a bottom side, and having a metallic signal conductor and a metallic ground conductor deposited in a coplanar fashion on the bottom side of the probe board; and selected microwave absorbing material positioned near the top side of the probe board.
Claim 12
Dependent Claim
73 words
A probe for connecting electrical test equipment to selected points on a small planar device on a semiconductive wafer, comprising: a transmission line assembly having a probe board, with a top and a bottom side, and having a metallic signal conductor and a metallic ground conductor deposited in a coplanar fashion on the bottom side of the probe board; and selected microwave absorbing material positioned near the top side of the probe board.
Claim 13
Dependent Claim
86 words
A probe for connecting electrical test equipment to selected points on a small planar device on a semiconductive wafer, comprising: a transmission line assembly having a probe board and having a metallic signal conductor and a metallic ground conductor deposited in a coplanar fashion on the probe board; and a body of selected microwave absorbing material having substantial thickness adjacent the transmission line assembly; said body of selected microwave absorbing material being tapered from a wider dimension to a narrower dimension proximate said small planar device.
Claim 14
Dependent Claim
86 words
A probe for connecting electrical test equipment to selected points on a small planar device on a semiconductive wafer, comprising: a transmission line assembly having a probe board and having a metallic signal conductor and a metallic ground conductor deposited in a coplanar fashion on the probe board; and a body of selected microwave absorbing material having substantial thickness adjacent the transmission line assembly; said body of selected microwave absorbing material being tapered from a wider dimension to a narrower dimension proximate said small planar device.
Claim 15
Dependent Claim
94 words
A probe for connecting electrical test equipment to selected points on a small planar device on a semiconductive wafer, comprising: a transmission line assembly having a probe board, at least one metallic signal conductor and one more than an equal number of metallic ground conductors, the signal and ground conductors being deposited alternately in a coplanar fashion on one side of the probe board; a metallic channel attached to the ground conductors and spanning, but not touching, the at least one signal conductor; and selected microwave absorbing material generally surrounding the transmission line assembly.
Claim 16
Dependent Claim
94 words
A probe for connecting electrical test equipment to selected points on a small planar device on a semiconductive wafer, comprising: a transmission line assembly having a probe board, at least one metallic signal conductor and one more than an equal number of metallic ground conductors, the signal and ground conductors being deposited alternately in a coplanar fashion on one side of the probe board; a metallic channel attached to the ground conductors and spanning, but not touching, the at least one signal conductor; and selected microwave absorbing material generally surrounding the transmission line assembly.
Claim 17
Dependent Claim
76 words
A probe for connecting electrical test equipment to selected points on a small planar device on a semiconductive wafer, comprising: a probe board, a plurality of transmission lines mounted on the probe board, and selected microwave absorbing material positioned near the transmission lines for substantially absorbing extraneous external transmission line modes, said absorbing material comprising a body of material having a high magnetic loss coefficient and mounted substantially on and substantially coplanar with said probe board.
Claim 18
Dependent Claim
76 words
A probe for connecting electrical test equipment to selected points on a small planar device on a semiconductive wafer, comprising: a probe board, a plurality of transmission lines mounted on the probe board, and selected microwave absorbing material positioned near the transmission lines for substantially absorbing extraneous external transmission line modes, said absorbing material comprising a body of material having a high magnetic loss coefficient and mounted substantially on and substantially coplanar with said probe board.
Claim 19
Dependent Claim
107 words
A probe for connecting electrical test equipment to selected points on a small planar device on a semiconductor wafer, comprising: a transmission line assembly, having a probe board, and having a metallic signal conductor and a metallic ground conductor deposited on the probe board; wherein the metallic ground and signal conductors form a transmission line extending from the selected points on the planar device to points of connection with the electrical test equipment, the ground and signal conductors being sized and juxtaposed such that the transmission line has a constant characteristic impedance throughout its length; and selected microwave absorbing material positioned near the transmission line ground conductor.
Claim 20
Dependent Claim
107 words
A probe for connecting electrical test equipment to selected points on a small planar device on a semiconductor wafer, comprising: a transmission line assembly, having a probe board, and having a metallic signal conductor and a metallic ground conductor deposited on the probe board; wherein the metallic ground and signal conductors form a transmission line extending from the selected points on the planar device to points of connection with the electrical test equipment, the ground and signal conductors being sized and juxtaposed such that the transmission line has a constant characteristic impedance throughout its length; and selected microwave absorbing material positioned near the transmission line ground conductor.
Claim 21
Dependent Claim
102 words
A probe for connecting electrical test equipment to selected points on a small planar device on a semiconductive wafer, comprising: a transmission line assembly having a probe board, with a top and a bottom side, and having a metallic signal conductor and a metallic ground conductor deposited in a coplanar fashion on the bottom side of the probe board; and selected microwave absorbing material positioned above and near the top side of the probe board, wherein the probe board is trapezoidal-shaped and the microwave absorbing material comprises a tapered layer mounted on, and generally coextensive with, the top of the probe board.
Claim 22
Dependent Claim
102 words
A probe for connecting electrical test equipment to selected points on a small planar device on a semiconductive wafer, comprising: a transmission line assembly having a probe board, with a top and a bottom side, and having a metallic signal conductor and a metallic ground conductor deposited in a coplanar fashion on the bottom side of the probe board; and selected microwave absorbing material positioned above and near the top side of the probe board, wherein the probe board is trapezoidal-shaped and the microwave absorbing material comprises a tapered layer mounted on, and generally coextensive with, the top of the probe board.
Claim 23
Dependent Claim
35 words
A probe as in claim 14 wherein the microwave absorbing material layer has a groove extending along the top of the probe board above the signal conductor, the groove being wider than the signal conductor.
Claim 24
Dependent Claim
101 words
A probe for connecting electrical test equipment to selected points on a small planar device on a semiconductive wafer, comprising: a transmission line assembly having a probe board, at least one metallic signal conductor and one more than an equal number of metallic ground conductors, the signal and ground conductors being deposited alternately in a coplanar fashion on one side of the probe board; a metallic channel attached to the ground conductors and spanning, but not touching, the at least one signal conductor; and selected microwave absorbing material generally surrounding the transmission line assembly, wherein the microwave absorbing material comprises iron.
Claim 25
Dependent Claim
101 words
A probe for connecting electrical test equipment to selected points on a small planar device on a semiconductive wafer, comprising: a transmission line assembly having a probe board, at least one metallic signal conductor and one more than an equal number of metallic ground conductors, the signal and ground conductors being deposited alternately in a coplanar fashion on one side of the probe board; a metallic channel attached to the ground conductors and spanning, but not touching, the at least one signal conductor; and selected microwave absorbing material generally surrounding the transmission line assembly, wherein the microwave absorbing material comprises iron.
Claim 26
Dependent Claim
101 words
A probe for connecting electrical test equipment to selected points on a small planar device on a semiconductive wafer, comprising: a transmission line assembly having a probe board, at least one metallic signal conductor and one more than an equal number of metallic ground conductors, the signal and ground conductors being deposited alternately in a coplanar fashion on one side of the probe board; a metallic channel attached to the ground conductors and scanning, but not touching, the at least one signal conductor; and selected microwave absorbing material generally surrounding the transmission line assembly, wherein the microwave absorbing material comprises ferrite.
Claim 27
Dependent Claim
101 words
A probe for connecting electrical test equipment to selected points on a small planar device on a semiconductive wafer, comprising: a transmission line assembly having a probe board, at least one metallic signal conductor and one more than an equal number of metallic ground conductors, the signal and ground conductors being deposited alternately in a coplanar fashion on one side of the probe board; a metallic channel attached to the ground conductors and scanning, but not touching, the at least one signal conductor; and selected microwave absorbing material generally surrounding the transmission line assembly, wherein the microwave absorbing material comprises ferrite.
Claim 28
Dependent Claim
110 words
A probe for connecting electrical test equipment to selected points on a small planar device on a semiconductive wafer, comprising: a transmission line assembly having a probe board, at least one metallic signal conductor and one more than an equal nmber of metallic ground conductors, the signal and ground conductors being deposited alternately in a coplanar fashion on one side of the probe board; a metallic channel attached to the ground conductors and spanning, but not touching, the at least one signal conductor; and selected microwave absorbing material generally surrounding the transmission line assembly; wherein the probe board is trapezoidal-shaped and the microwave aborbing material tapers with the probe board.
Claim 29
Dependent Claim
110 words
A probe for connecting electrical test equipment to selected points on a small planar device on a semiconductive wafer, comprising: a transmission line assembly having a probe board, at least one metallic signal conductor and one more than an equal nmber of metallic ground conductors, the signal and ground conductors being deposited alternately in a coplanar fashion on one side of the probe board; a metallic channel attached to the ground conductors and spanning, but not touching, the at least one signal conductor; and selected microwave absorbing material generally surrounding the transmission line assembly; wherein the probe board is trapezoidal-shaped and the microwave aborbing material tapers with the probe board.
Claim 30
Dependent Claim
78 words
A probe for connecting electrical test equipment to selected points on a small electrical component, said probe comprising: a transmission line assembly having a probe board and having a metallic signal conductor and a metallic ground conductor spaced on the probe board; and selected microwave absorbing material positioned near the transmission line ground conductor; wherein the probe board is trapezoidal-shaped and the microwave absorbing material comprises a tapered layer mounted on, and generally coextensive with, the probe board.
Claim 31
Dependent Claim
78 words
A probe for connecting electrical test equipment to selected points on a small electrical component, said probe comprising: a transmission line assembly having a probe board and having a metallic signal conductor and a metallic ground conductor spaced on the probe board; and selected microwave absorbing material positioned near the transmission line ground conductor; wherein the probe board is trapezoidal-shaped and the microwave absorbing material comprises a tapered layer mounted on, and generally coextensive with, the probe board.
Claim 32
Dependent Claim
186 words
A probe for testing an electrical component by means of connecting electrical test equipment to selected points on said electrical component, said probe comprising: a transmission line assembly having a probe board formed of dielectric material and having a metallic signal conductor and a metallic ground conductor deposited on said board to form a transmission line, said transmission line extending on said board substantially between selected points on said electrical component with which said probe is used to make contact and points of connection with said external test equipment, the ground and signal conductors being sized and spaced such that said transmission line has a substantially constant characteristic impedance, said probe further including a body of microwave absorbing material positioned adjacent said transmission line between said electrical component and said points of connection with said external test equipment for substantially completely absorbing microwave energy propagating up the board from said electrical component toward said points of connection in a transmission line mode involving at least one of said probe conductors and other conductors in the environment whereby to prevent undesired resonance, emission and non-reproducibility of measurements.
Claim 33
Dependent Claim
186 words
A probe for testing an electrical component by means of connecting electrical test equipment to selected points on said electrical component, said probe comprising: a transmission line assembly having a probe board formed of dielectric material and having a metallic signal conductor and a metallic ground conductor deposited on said board to form a transmission line, said transmission line extending on said board substantially between selected points on said electrical component with which said probe is used to make contact and points of connection with said external test equipment, the ground and signal conductors being sized and spaced such that said transmission line has a substantially constant characteristic impedance, said probe further including a body of microwave absorbing material positioned adjacent said transmission line between said electrical component and said points of connection with said external test equipment for substantially completely absorbing microwave energy propagating up the board from said electrical component toward said points of connection in a transmission line mode involving at least one of said probe conductors and other conductors in the environment whereby to prevent undesired resonance, emission and non-reproducibility of measurements.
Claim 34
Dependent Claim
20 words
The probe according to claim 20 wherein said probe board and said body of microwave absorbing material are substantially planar.
Claim 35
Dependent Claim
33 words
The probe according to claim 20 wherein said probe includes connecting tabs proximate said electrical component and joined to said metallic conductors for making contact with said selected points on said electrical component.
Claim 36
Dependent Claim
15 words
The probe according to claim 20 wherein said deposited conducors form a coplanar transmission line.
Claim 37
Dependent Claim
44 words
The probe according to claim 20 wherein said probe board, said deposited conductors, and said body of microwave absorbing material taper from wider proportions near said points of connection with external test equipment to narrower proportions nearer said selected points on said electrical component.
Claim 38
Dependent Claim
26 words
The probe according to claim 20 wherein said microwave absorbing material has a high magnetic loss coefficient and a characteristic impedance near that of free space.
Claim 39
Dependent Claim
36 words
The probe according to claim 20 wherein the total thickness of said body of microwave absorbing material on said board is at least as great as the spacing between said metallic conductors forming said transmission line.
Claim 40
Dependent Claim
23 words
The probe according to claim 26 wherein said total thickness is greater than said spacing between said metallic conductors forming said transmission line.
Claim 41
Dependent Claim
107 words
A probe for connecting electrical test equipment to selected points on a small planar device on a semiconductive wafer, comprising: a transmission line assembly, having a probe board and having a metallic signal conductor and a metallic ground conductor spaced on the probe board; and selected microwave absorbing material positioned near the transmission line ground conductor on said probe board, said absorbing material having a thickness at least as great as the spacing between said signal conductor and ground conductor, wherein the probe board is trapezoidal-shaped and the microwave absorbing material comprises a tapered layer mounted on, and generally coextensive with, the top of the probe board.
Claim 42
Dependent Claim
107 words
A probe for connecting electrical test equipment to selected points on a small planar device on a semiconductive wafer, comprising: a transmission line assembly, having a probe board and having a metallic signal conductor and a metallic ground conductor spaced on the probe board; and selected microwave absorbing material positioned near the transmission line ground conductor on said probe board, said absorbing material having a thickness at least as great as the spacing between said signal conductor and ground conductor, wherein the probe board is trapezoidal-shaped and the microwave absorbing material comprises a tapered layer mounted on, and generally coextensive with, the top of the probe board.
References Cited (Backward Citations)
US3596228A
Cited
US3654573A
Cited
JPS5219046A
Cited
US4186338A
Cited
US4371742A
Cited
JPS58130602A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1990-09-28 | 1991-03-30 | 1991-09-29 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1994-09-28 | 1995-03-30 | 1995-09-29 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1998-09-28 | 1999-03-30 | 1999-09-29 | $7700.00 | Window Closed / Lapsed |