Patent SE431996B successfully refreshed from Google Patents.
US5346751A
Expired / Lapsed
US
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Electronic package using closed pore composites
Assignee: WR Grace and Co Conn
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Filing: 1991-05-14
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Granted: 1994-09-13
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Expires: 2011-05-14
Abstract
Abstract The electronic packages of the invention all employ the general materials scheme of a low dielectric constant material (low K material) mounted on a dense, high thermal conductivity (high TC) ceramic base. In this way, the low K material provides the signal transmission paths to and from the I.C. chips housed in the package and thus allows for higher signal transmission speed. The high TC material allows for heat dissipation out of the package. The dense base and/or the low K material may contain metallization in any desired pattern. The low K material is preferably a composite of closed pores in a glass-containing matrix.
Inventors
- 👤 John W. Lau
- 👤 Jack H. Enloe
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 23:02
CPC Classifications
H; H10; H10W; H10W40/00; H10W40/20; H10W40/25; H10W40/259; C; C04; C04B; C04B35/00; C04B35/515; C04B35/58; C04B35/581; H01; H01B; H01B3/00; H01B3/02; H01B3/08; H01B3/087; H05; H05K; H05K1/00; H05K1/02; H05K1/03; H05K1/0306; H10W70/00; H10W70/01; H10W70/05; H10W70/095; H10W70/60; H10W70/67; H10W70/69; H10W70/692; H10W99/00; Y; Y10; Y10S; Y10S428/00; Y10S428/901; Y10T; Y10T428/00; Y10T428/24; Y10T428/24802; Y10T428/24917; Y10T428/24926; Y10T428/249921; Y10T428/249953; Y10T428/249971; Y10T428/249976; Y10T428/249987; Y10T428/24999
Claims Analysis
Total Claims: 14
Claim 1
Independent Claim
71 words
An electronic package comprising a thermally conductive substrate, having a thermal conductivity of at least about 0.70 W/cm-k, and a first low dielectric constant layer, having a dielectric constant of about 3.0 or less, laminated onto said substrate, a first side of said layer and said substrate defining a layer-substrate interface, and said layer comprising a closed pore composite of 55-60 vol. % hollow glass microspheres in a glass containing matrix.
Claim 2
Dependent Claim
71 words
An electronic package comprising a thermally conductive substrate, having a thermal conductivity of at least about 0.70 W/cm-k, and a first low dielectric constant layer, having a dielectric constant of about 3.0 or less, laminated onto said substrate, a first side of said layer and said substrate defining a layer-substrate interface, and said layer comprising a closed pore composite of 55-60 vol. % hollow glass microspheres in a glass containing matrix.
Claim 3
Dependent Claim
41 words
The package of claim 1 wherein said layer contains a cavity extending from said interface through the entire thickness of the layer, said layer defining the walls of the cavity and said thermally conductive substrate defining the floor of the cavity.
Claim 4
Dependent Claim
10 words
The package of claim 2 wherein said substrate contains metallization.
Claim 5
Dependent Claim
12 words
The package of claim 3 having metallization at portions of said interface.
Claim 6
Dependent Claim
32 words
The package of claim 4 further comprising an additional layer of said low dielectric constant composite laminated on a second side of said first layer, said cavity extending through said second layer.
Claim 7
Dependent Claim
19 words
The package of claim 5 wherein metallization is present at portions of a layer-layer interface formed between said layers.
Claim 8
Dependent Claim
21 words
The package of claim 6 having metallization on a side of said additional layer not forming part of said layer-layer interface.
Claim 9
Dependent Claim
10 words
The package of claim 1 wherein said substrate contains metallization.
Claim 10
Dependent Claim
12 words
The package of claim 8 having metallization at portions of said interface.
Claim 11
Dependent Claim
17 words
The package of claim 9 wherein said layer contains metallization on a second side of said layer.
Claim 12
Dependent Claim
25 words
The package of claim 10 further comprising an additional layer of said low dielectric constant composite laminated on the second side of said first layer.
Claim 13
Dependent Claim
15 words
The package of claim 11 wherein a second side of said additional layer contains metallization.
Claim 14
Dependent Claim
11 words
The package of claim 1 wherein said substrate contains aluminum nitride.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1997-09-12 | 1998-03-14 | 1998-09-13 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2001-09-12 | 2002-03-14 | 2002-09-13 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2005-09-12 | 2006-03-14 | 2006-09-13 | $7700.00 | Window Closed / Lapsed |