Claims Analysis
Total Claims: 9
Claim 1
Independent Claim
141 words
A probing plate for wafer testing having a plurality of probes arranged so as to correspond to a plurality of bonding pads of semiconductor devices fabricated on a semiconductor wafer, comprising: an electrically insulating base plate having raised portions formed at predetermined positions in the major surface thereof; contact conductors of a conductive film formed over the surfaces of said raised portions and serving as portions of said probes, respectively; and wiring conductors formed integrally with said contact conductors over the major surface of said base plate in a predetermined pattern so as to extend respectively from said contact conductors, wherein said raised portions are formed respectively at distal ends of contact fingers formed by removing portions of said base plate selectively by a photolithographic process so as to extend at predetermined intervals and correspond to said plurality of bonding pads.
Claim 2
Dependent Claim
141 words
A probing plate for wafer testing having a plurality of probes arranged so as to correspond to a plurality of bonding pads of semiconductor devices fabricated on a semiconductor wafer, comprising: an electrically insulating base plate having raised portions formed at predetermined positions in the major surface thereof; contact conductors of a conductive film formed over the surfaces of said raised portions and serving as portions of said probes, respectively; and wiring conductors formed integrally with said contact conductors over the major surface of said base plate in a predetermined pattern so as to extend respectively from said contact conductors, wherein said raised portions are formed respectively at distal ends of contact fingers formed by removing portions of said base plate selectively by a photolithographic process so as to extend at predetermined intervals and correspond to said plurality of bonding pads.
Claim 3
Dependent Claim
43 words
A probing plate for wafer testing according to claim 1, wherein: the height of the surfaces of the raised portions with respect to the major surface of said base plate is greater than the height of the bonding pads of the semiconductor devices.
Claim 4
Dependent Claim
19 words
A probing plate for wafer testing according to claim 1, wherein: said base plate comprises a photosensitive glass material.
Claim 5
Dependent Claim
18 words
A probing plate for wafer testing according to claim 1, wherein: said base plate includes an elastic plate.
Claim 6
Dependent Claim
28 words
A probing plate for wafer testing according to claim 1, wherein: said wiring conductors include terminal conductors to be connected electrically to contact pins of a wafer prober.
Claim 7
Dependent Claim
58 words
A probing plate for wafer testing according to claim 5, wherein: said wiring conductors include wiring conductors that are formed on the surface of said base plate opposite the major surface and are connected to the wiring conductors formed on the major surface through conductive layers formed over the inner surfaces of through-holes in the base plate, respectively.
Claim 8
Dependent Claim
41 words
A probing plate for wafer testing according to claim 1, wherein: said wiring conductors include contact conductors to be connected electrically through wiring conductors formed on a plate holding said probing plate to correspondingly disposed contact pins of a wafer prober.
Claim 9
Dependent Claim
32 words
A probing plate for wafer testing according to claim 1, wherein: the surface areas of said contact conductors are smaller than the areas of the corresponding bonding pads of the semiconductor devices.