Patent US6719615B1 successfully refreshed from Google Patents.
US6719615B1
Expired / Lapsed
US
⏱️ 0.0 years remaining
Versatile wafer refining
Assignee: SemCon Tech LLC
•
Filing: 2002-08-14
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Granted: 2004-04-13
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Expires: 2022-08-14
Abstract
Abstract A refining apparatus having magnetically responsive refining elements that can be smaller than the workpiece being refined are disclosed. The refining apparatus can supply a parallel refining motion to the refining element(s) through magnetic coupling forces. The refining apparatus can supply multiple different parallel refining motions to multiple different refining elements solely through magnetic coupling forces to improve refining quality and versatility. New refining methods, refining apparatus, and refining elements disclosed. Methods of refining using frictional refining, chemical refining, tribocbemical refining, and electrochemical refining and combinations thereof are disclosed. A refining chamber can be used. New methods of control are refining disclosed. The new magnetic refining methods, apparatus, and magnetically responsive refining elements can help improve yield and lower the cost of manufacture for refining of workpieces having extremely close tolerances such as semiconductor wafers. Refining fluids are preferred. Reactive refining aids are preferred. Electro-refining for adding and removing material is disclosed. New methods and new apparatus for non-steady state refining control are disclosed.
Inventors
- 👤 Charles J. Molnar
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-02 08:56
CPC Classifications
B; B24; B24B; B24B1/00; B24B1/005; B24B37/00; B24B37/04
Claims Analysis
Total Claims: 55
Claim 1
Independent Claim
116 words
A method for refining a semiconductor wafer having a semiconductor wafer surface comprising the steps of: providing a magnetically responsive refining element having a refining surface and free of any physically connected mechanical movement mechanism; providing a magnetic driving element having a driving mechanism; positioning the semiconductor wafer being refined with a holder proximate to the magnetically responsive refining element and between the magnetically responsive refining element and magnetic driving element; and applying an operative refining motion comprising a magnetically induced parallel operative refining motion in the interface between the semiconductor wafer surface being refined and the refining surface of the magnetically responsive refining element for changing the amount of material on the semiconductor wafer surface.
Claim 2
Independent Claim
116 words
A method for refining a semiconductor wafer having a semiconductor wafer surface comprising the steps of: providing a magnetically responsive refining element having a refining surface and free of any physically connected mechanical movement mechanism; providing a magnetic driving element having a driving mechanism; positioning the semiconductor wafer being refined with a holder proximate to the magnetically responsive refining element and between the magnetically responsive refining element and magnetic driving element; and applying an operative refining motion comprising a magnetically induced parallel operative refining motion in the interface between the semiconductor wafer surface being refined and the refining surface of the magnetically responsive refining element for changing the amount of material on the semiconductor wafer surface.
Claim 3
Dependent Claim
48 words
The method for refining according to claim 1 wherein applying an operative refining motion comprises using an action selected from the group consisting of a chemical action a tribochemical action, a frictional action, and an electrochemical action and combinations thereof to remove material from the semiconductor wafer surface.
Claim 4
Dependent Claim
24 words
The method for refining according to claim 1 wherein applying an operative refining motion comprises changing the amount of material using a chemical action.
Claim 5
Dependent Claim
24 words
The method for refining according to claim 1 wherein applying an operative refining motion comprises changing the amount of material using a tribochemical action.
Claim 6
Dependent Claim
81 words
The method for refining according to claim 1 wherein: the magnetically responsive refining element has a first operative electrode; and the semiconductor wafer surface has an operative electrical contact forming a second operative electrode between the magnetically responsive refining element and the magnetic driving element; and during the operative refining motion having the additional step of: applying an operative electric field across the first operative electrode and second operative electrode for removing material from the surface of the semiconductor wafer surface.
Claim 7
Dependent Claim
81 words
The method for refining according to claim 1 wherein: the magnetically responsive refining element has a first operative electrode; and the semiconductor wafer surface has an operative electrical contact forming a second operative electrode between the magnetically responsive refining element and the magnetic driving element; and during the operative refining motion having the additional step of: applying an operative electric field across the first operative electrode and second operative electrode for adding material to the surface of the semiconductor wafer surface.
Claim 8
Dependent Claim
32 words
The method for refining according to claim 1 wherein applying an operative refining motion comprises applying the operative refining motion in a chamber while the magnetic driving element is outside the chamber.
Claim 9
Dependent Claim
51 words
The method for refining according to claim 1 wherein: applying an operative refining motion comprises applying the operative refining motion in a sealed chamber; and during the operative refining motion having the additional step of: supplying a reactive refining aid between the magnetically responsive refining element and the semiconductor wafer surface.
Claim 10
Dependent Claim
42 words
The method for refining according to claim 1 wherein providing a reactive refining aid between the magnetically responsive refining element and the semiconductor wafer surface comprises supplying a refining composition having a refining aid therein which reacts with the semiconductor wafer surface.
Claim 11
Dependent Claim
80 words
The method for refining according to claim 1 having the additional steps of: providing a control subsystem having an operative sensor, a processor, and a controller; during the operative refining motion, sensing with the operative sensor a progress of refining information; during the operative refining motion, determining a change for at least one process control parameter with the control subsystem using the progress of refining information; and during the operative refining motion, changing the at least one process control parameter.
Claim 12
Dependent Claim
48 words
The method for refining according to claim 10 wherein applying an operative refining motion comprises using an action selected from the group consisting of a chemical action, a tribochemical action, a frictional action, and an electrochemical action and combinations thereof to remove material from the semiconductor wafer surface.
Claim 13
Dependent Claim
24 words
The method for refining according to claim 11 wherein changing the at least one process control parameter makes an appreciable change to the refining.
Claim 14
Independent Claim
131 words
A method for refining a semiconductor wafer having a semiconductor wafer surface comprising the steps of: providing a magnetically responsive refining element having a first operative electrode; providing a magnetic driving element operatively connected to a driving mechanism; providing a semiconductor wafer surface having an operative electrical contact forming a second operative electrode between the magnetically responsive refining element and the magnetic driving element; magnetically coupling the magnetically responsive refining element with the magnetic driving element; applying a parallel operative refining motion between the semiconductor wafer surface and the magnetically responsive refining element by moving the magnetic driving element with the driving mechanism; and applying an operative electric field across the first operative electrode and the second operative electrode for electro-refining during at least a portion of a refining cycle time.
Claim 15
Independent Claim
131 words
A method for refining a semiconductor wafer having a semiconductor wafer surface comprising the steps of: providing a magnetically responsive refining element having a first operative electrode; providing a magnetic driving element operatively connected to a driving mechanism; providing a semiconductor wafer surface having an operative electrical contact forming a second operative electrode between the magnetically responsive refining element and the magnetic driving element; magnetically coupling the magnetically responsive refining element with the magnetic driving element; applying a parallel operative refining motion between the semiconductor wafer surface and the magnetically responsive refining element by moving the magnetic driving element with the driving mechanism; and applying an operative electric field across the first operative electrode and the second operative electrode for electro-refining during at least a portion of a refining cycle time.
Claim 16
Dependent Claim
35 words
The method for refining according to claim 13 wherein applying the parallel operative refining motion comprises applying the parallel operative refining motion in a chamber with the magnetic driving element which is outside the chamber.
Claim 17
Dependent Claim
41 words
The method for refining according to claim 13 wherein applying the operative electric field across the first operative electrode and the second operative electrode during at least the portion of the refining cycle time removes material from the semiconductor wafer surface.
Claim 18
Dependent Claim
41 words
The method for refining according to claim 13 wherein applying the operative electric field across the first operative electrode and the second operative electrode during at least the portion of the refining cycle time adds material to the semiconductor wafer surface.
Claim 19
Dependent Claim
47 words
The method for refining according to claim 13 wherein: providing a magnetically responsive refining element comprises providing at least two magnetically responsive refining elements; and wherein: applying a parallel operative motion comprises applying a different parallel operative refining motion to at least two magnetically responsive refining elements.
Claim 20
Dependent Claim
35 words
The method for refining according to claim 13 wherein: providing a magnetically responsive refining element comprises providing at least two magnetically responsive refining elements, each having at least one different refining surface from each other.
Claim 21
Dependent Claim
35 words
The method for refining according to claim 13 wherein applying an operative refining motion comprises applying the operative refining motion in a sealed chamber with the magnetic driving element which is outside the sealed chamber.
Claim 22
Dependent Claim
64 words
The method for refining according to claim 13 during applying the operative electric field having the additional steps of: sensing the progress of refining information with an operative sensor; evaluating the progress of refining information and determining a change for at least one process control parameter; and controlling the at least one process control parameter to change the electro-refining during the refining cycle time.
Claim 23
Dependent Claim
45 words
The method for refining according to claim 20 after determining a change for at least one process control parameter having the additional step of: storing the progress of refining information and the change for the at least one process control parameter in a memory device.
Claim 24
Dependent Claim
143 words
The method for refining according to claim 13 wherein: the semiconductor wafer has an assigned tracking code; and before applying the operative refining motion, the method having the additional steps of: providing an operative control subsystem having an operative sensor, a controller, and a processor and wherein the processor has access to a process model, the assigned tracking code, and historical performance; and during applying the operative refining motion, the method having the additional steps of: sensing progress of a first progress of refining information with the operative sensor; determining a first change for at least one control parameter using at least in part at least the process model, the tracking code, the historical performance, and the first progress of refining information with the operative control subsystem; and changing in real time the at least one process control parameter which changes the refining.
Claim 25
Dependent Claim
53 words
The method for refining according to claim 22 after determining the first change for the at least one process control parameter having the additional step of: storing at least in part at least the process model, the tracking code, the historical performance, and the first progress of refining information in a memory device.
Claim 26
Dependent Claim
110 words
The method for refining according to claim 23 after storing at least in part the process model, the tracking code, the historical performance, and the first progress of refining information in a memory device having the additional steps of: sensing a second progress of refining information with the operative sensor; determining a second change for at least one control parameter using at least in part at least the process model, the tracking code, the historical performance, the first progress of refining information, and the second progress of refining information with the operative control subsystem; and changing in real time the at least one process control parameter which changes the refining.
Claim 27
Dependent Claim
148 words
The method for refining according to claim 13 wherein: the semiconductor wafer has an assigned tracking code; and before applying the operative refining motion, the method having the additional steps of: providing an operative control subsystem having an operative sensor, a controller, and a processor and wherein the processor has access to a process model, the assigned tracking code, and information in at least one memory device; and during applying the operative refining motion, the method having the additional steps of: sensing progress of refining information with the operative sensor; determining a change for at least one control parameter using at least in part at least the process model, the assigned tracking code, the information in at least one memory device, and the progress of refining information with the operative control subsystem; and changing in real time the at least one process control parameter which changes the refining.
Claim 28
Independent Claim
90 words
An apparatus for refining a workpiece surface comprising: at least one magnetically responsive refining element free of any nonmagnetic driving mechanism; at least one magnetic driving element operatively connected to a driving mechanism and wherein the at least one magnetic driving element is spaced apart from the at least one magnetically responsive refining element; and a holder for a workpiece which exposes the workpiece surface for refining, the holder situated between the magnetically responsive refining element and the at least one magnetic driving element and having an adjustable retainer ring.
Claim 29
Independent Claim
90 words
An apparatus for refining a workpiece surface comprising: at least one magnetically responsive refining element free of any nonmagnetic driving mechanism; at least one magnetic driving element operatively connected to a driving mechanism and wherein the at least one magnetic driving element is spaced apart from the at least one magnetically responsive refining element; and a holder for a workpiece which exposes the workpiece surface for refining, the holder situated between the magnetically responsive refining element and the at least one magnetic driving element and having an adjustable retainer ring.
Claim 30
Dependent Claim
31 words
The apparatus according to claim 26 wherein the workpiece surface and the magnetically responsive refining element is in an enclosed chamber and the magnetic driving element is outside the enclosed chamber.
Claim 31
Dependent Claim
38 words
The apparatus according to claim 26 wherein the at least one magnetically responsive refining element comprises at least two magnetically responsive refining elements and the at least one magnetic driving element comprises at least two magnetic driving elements.
Claim 32
Dependent Claim
41 words
The apparatus according to claim 26 wherein the at least one magnetically responsive refining element comprises at least one magnetically responsive refining element having a first operative electrode and the workpiece having an operative electrical contact forming a second operative electrode.
Claim 33
Dependent Claim
47 words
The apparatus according to claim 26 further comprising: a refining element placement robot having a electromagnet for lifting, placing, and releasing the magnetically responsive refining element; and an operative controller to control the refining element placement robot for lifting, placing, and releasing the magnetically responsive refining element.
Claim 34
Dependent Claim
94 words
The apparatus according to claim 26 wherein the magnetically responsive refining element has a tracking code and further comprising: a refining element placement arm having an electromagnet for lifting, placing, and releasing the magnetically responsive refining element and an operative sensor to sense the tracking code; a processor to evaluate information related to the tracking code; and an operative controller to control the refining element placement arm for lifting, placing, and releasing the magnetically responsive refining element based at least in part on the processor evaluation of the information related to the tracking code.
Claim 35
Dependent Claim
42 words
A magnetic refining element comprising: an operative electrode; a magnetically responsive member protected with a corrosion resistant material; and an operative electro-refining surface; and at least one material which connects the operative electrode, the magnetically responsive element, and the operative electro-refining surface.
Claim 36
Dependent Claim
42 words
A magnetic refining element comprising: an operative electrode; a magnetically responsive member protected with a corrosion resistant material; and an operative electro-refining surface; and at least one material which connects the operative electrode, the magnetically responsive element, and the operative electro-refining surface.
Claim 37
Dependent Claim
14 words
The magnetic refining element according to claim 32 having a plurality of operative electrodes.
Claim 38
Dependent Claim
15 words
The magnetic refining element according to claim 32 having a plurality of magnetically responsive members.
Claim 39
Dependent Claim
22 words
The magnetic refining element according to claim 32 further comprises a refining surface free of electro-refining capacity proximate the operative electro-refining surface.
Claim 40
Dependent Claim
39 words
The magnetic refining element according to claim 32 further comprises a low friction surface free of electro-refining capability proximate the operative electro-refining surface and wherein the low friction surface has coefficient of friction of at most 0.3 during refining.
Claim 41
Dependent Claim
34 words
A magnetic refining element comprising: at least one magnetically responsive refining member protected with a corrosion resistant material; at least one operative refining surface; and wherein the magnetic refining element has an identification code.
Claim 42
Dependent Claim
34 words
A magnetic refining element comprising: at least one magnetically responsive refining member protected with a corrosion resistant material; at least one operative refining surface; and wherein the magnetic refining element has an identification code.
Claim 43
Dependent Claim
23 words
A magnetic refining element according to claim 37 wherein the at least one operative refining surface comprises a plurality of operative refining surfaces.
Claim 44
Dependent Claim
23 words
A magnetic refining element according to claim 37 wherein at least one magnetically responsive refining member comprises a plurality of magnetically responsive members.
Claim 45
Dependent Claim
38 words
The method according to claim 3 having the additional step before applying the operative refining motion of: providing a finishing composition free of abrasive particles in the interface of the semiconductor wafer being refined and the refining surface.
Claim 46
Dependent Claim
51 words
The method according to claim 3 having the additional step before applying the operative refining motion of: providing a finishing composition free of abrasive particles in the interface of the semiconductor wafer being refined and the refining surface; and wherein the refining surface comprises a finishing surface free of abrasive particles.
Claim 47
Dependent Claim
38 words
The method according to claim 4 having the additional step before applying the operative refining motion of: providing a finishing composition free of abrasive particles in the interface of the semiconductor wafer being refined and the refining surface.
Claim 48
Dependent Claim
51 words
The method according to claim 4 having the additional step before applying the operative refining motion of: providing a finishing composition free of abrasive particles in the interface of the semiconductor wafer being refined and the refining surface; and wherein the refining surface comprises a finishing surface free of abrasive particles.
Claim 49
Dependent Claim
38 words
The method according to claim 10 having the additional step before applying the operative refining motion of: providing a finishing composition free of abrasive particles in the interface of the semiconductor wafer being refined and the refining surface.
Claim 50
Dependent Claim
51 words
The method according to claim 10 having the additional step before applying the operative refining motion of: providing a finishing composition free of abrasive particles in the interface of the semiconductor wafer being refined and the refining surface; and wherein the refining surface comprises a finishing surface free of abrasive particles.
Claim 51
Dependent Claim
16 words
The magnetic refining element of claim 37 wherein the refining surface comprises an abrasive refining surface.
Claim 52
Dependent Claim
20 words
The magnetic refining element of claim 37 wherein the refining surface comprises an abrasive refining surface having inorganic abrasive particles.
Claim 53
Dependent Claim
20 words
The magnetic refining element of claim 37 wherein the refining surface comprises an abrasive refining surface having organic abrasive particles.
Claim 54
Dependent Claim
21 words
The magnetic refining element of claim 37 wherein the refining surface comprises an abrasive refining surface having an abrasive organic polymer.
Claim 55
Dependent Claim
19 words
The magnetic refining element of claim 37 wherein the refining surface comprises a finishing surface free of abrasive particles.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2007-04-13 | 2007-10-13 | 2008-04-13 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2011-04-13 | 2011-10-13 | 2012-04-13 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2015-04-13 | 2015-10-13 | 2016-04-13 | $7700.00 | Window Closed / Lapsed |