US6143155A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method for simultaneous non-contact electrochemical plating and planarizing of semiconductor wafers using a bipiolar electrode assembly
Assignee: Novellus Systems Inc
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Filing: 1998-06-11
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Granted: 2000-11-07
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Expires: 2018-06-11
Abstract
Abstract Simultaneous non-contact plating and planarizing of copper interconnections in semiconductor wafer manufacturing is performed by providing relative motion between a bipolar electrode and a metallized surface of a semiconductor wafer without necessary physical contact with the wafer or direct electrical connection thereto.
Inventors
- 👤 John A. Adams
- 👤 Gerald A. Krulik
- 👤 Everett D. Smith
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-04 20:45
CPC Classifications
C; C25; C25D; C25D7/00; C25D7/001; C25D5/00; C25D5/04; C25D7/12; C25D7/123; H; H10; H10P; H10P14/00; H10P14/40; H10P14/46; H10P14/47; H10P95/00; H10P95/04; H10W; H10W20/00; H10W20/01; H10W20/031; H10W20/062
Claims Analysis
Total Claims: 28
Claim 1
Independent Claim
191 words
A method of bipolar concurrent metal plating and planarizing of a metallized surface of a semiconductor wafer, the method including the steps of: (a) positioning a bipolar electrode assembly proximate to said metallized surface, said bipolar electrode assembly having an anode and cathode separated along an axis parallel to said metallized surface; (b) bathing a region between said anode and said cathode and said metallized surface in an electroplating solution; (c) providing relative motion between said bipolar electrode assembly and said metallized surface, said relative motion being parallel to said metallized surface; and (d) applying a voltage across said anode and said cathode to plate metal from said electroplating solution onto a first region of said metallized surface; said first region being adjacent to said anode; and to concurrently electropolish said metal from a second region of said metallized surface; said second region being adjacent to said cathode; through the action of flowing current from said anode through said electroplating solution to said first region of said metallized surface, flowing said current through said metallized surface to said second region, and flowing said current to said cathode through said electroplating solution.
Claim 2
Independent Claim
191 words
A method of bipolar concurrent metal plating and planarizing of a metallized surface of a semiconductor wafer, the method including the steps of: (a) positioning a bipolar electrode assembly proximate to said metallized surface, said bipolar electrode assembly having an anode and cathode separated along an axis parallel to said metallized surface; (b) bathing a region between said anode and said cathode and said metallized surface in an electroplating solution; (c) providing relative motion between said bipolar electrode assembly and said metallized surface, said relative motion being parallel to said metallized surface; and (d) applying a voltage across said anode and said cathode to plate metal from said electroplating solution onto a first region of said metallized surface; said first region being adjacent to said anode; and to concurrently electropolish said metal from a second region of said metallized surface; said second region being adjacent to said cathode; through the action of flowing current from said anode through said electroplating solution to said first region of said metallized surface, flowing said current through said metallized surface to said second region, and flowing said current to said cathode through said electroplating solution.
Claim 3
Dependent Claim
24 words
The method according to claim 1, wherein said relative motion is provided by holding said metallized surface stationary and moving said bipolar electrode assembly.
Claim 4
Dependent Claim
24 words
The method according to claim 1, wherein said relative motion is provided by holding said bipolar electrode assembly stationary and moving said metallized surface.
Claim 5
Dependent Claim
23 words
The method according to claim 1, wherein said relative motion is provided by moving both said metallized surface and said bipolar electrode assembly.
Claim 6
Dependent Claim
31 words
The method according to claim 1, wherein said relative motion is selected from the group consisting of: linear motion, orbital motion, circular motion; and a combination of linear and circular motions.
Claim 7
Dependent Claim
42 words
The method according to claim 1, wherein the step of bathing a region between said anode and said cathode and said metallized surface in an electroplating solution is performed via separate supply lines providing different electrolytic solutions proximate the anode and cathode.
Claim 8
Dependent Claim
33 words
The method according to claim 1, including the step of positioning a brush between said bipolar electrode assembly and said metallized surface with a surface of said brush adjacent to said metallized surface.
Claim 9
Dependent Claim
26 words
The method according to claim 1, wherein said voltage across said anode and said cathode is controlled in accordance with a direction of said relative motion.
Claim 10
Dependent Claim
21 words
The method according to claim 1, wherein said flowing current is controlled in accordance with a direction of said relative motion.
Claim 11
Dependent Claim
21 words
The method according to claim 1, including the step of supporting said metallized surface from a side opposite said metallized surface.
Claim 12
Dependent Claim
20 words
The method according to claim 1, including the step of reusing said electroplating solution by recirculation means and conditioning means.
Claim 13
Dependent Claim
32 words
The method according to claim 11, wherein said conditioning means is selected from the group consisting of: heating means, cooling means, chemical modification means, and means for filtration of said electroplating solution.
Claim 14
Dependent Claim
31 words
The method according to claim 1, wherein said relative motion is chosen from the group consisting of: linear motion, orbital motion, circular motion; and a combination of linear and circular motions.
Claim 15
Dependent Claim
31 words
The method according to claim 1, wherein said relative motion is chosen from the group consisting of: linear motion, orbital motion, circular motion; and a combination of linear and circular motions.
Claim 16
Dependent Claim
31 words
The method according to claim 1, wherein said relative motion is selected from the group consisting of: linear motion, orbital motion, circular motion; and a combination of linear and circular motions.
Claim 17
Independent Claim
187 words
A method of bipolar concurrent metal plating and electropolishing of a metallized surface, the method including the steps of: (a) positioning a bipolar electrode assembly proximate to said metallized surface, said bipolar electrode assembly having an anode and cathode separated along an axis parallel to said metallized surface; (b) bathing a region between said anode and said cathode and said metallized surface in an electroplating solution; (c) providing relative motion between said bipolar electrode assembly and said metallized surface, said relative motion being parallel to said metallized surface; and (d) applying a voltage across said anode and said cathode to plate metal from said electroplating solution onto a first region of said metallized surface; said first region being adjacent to said anode; and to concurrently electropolish said metal from a second region of said metallized surface; said second region being adjacent to said cathode; through the action of flowing current from said anode through said electroplating solution to said first region of said metallized surface, flowing said current through said metallized surface to said second region, and flowing said current to said cathode through said electroplating solution.
Claim 18
Independent Claim
187 words
A method of bipolar concurrent metal plating and electropolishing of a metallized surface, the method including the steps of: (a) positioning a bipolar electrode assembly proximate to said metallized surface, said bipolar electrode assembly having an anode and cathode separated along an axis parallel to said metallized surface; (b) bathing a region between said anode and said cathode and said metallized surface in an electroplating solution; (c) providing relative motion between said bipolar electrode assembly and said metallized surface, said relative motion being parallel to said metallized surface; and (d) applying a voltage across said anode and said cathode to plate metal from said electroplating solution onto a first region of said metallized surface; said first region being adjacent to said anode; and to concurrently electropolish said metal from a second region of said metallized surface; said second region being adjacent to said cathode; through the action of flowing current from said anode through said electroplating solution to said first region of said metallized surface, flowing said current through said metallized surface to said second region, and flowing said current to said cathode through said electroplating solution.
Claim 19
Dependent Claim
24 words
The method according to claim 16, wherein said relative motion is provided by holding said metallized surface stationary and moving said bipolar electrode assembly.
Claim 20
Dependent Claim
24 words
The method according to claim 16, wherein said relative motion is provided by holding said bipolar electrode assembly stationary and moving said metallized surface.
Claim 21
Dependent Claim
23 words
The method according to claim 16, wherein said relative motion is provided by moving both said metallized surface and said bipolar electrode assembly.
Claim 22
Dependent Claim
42 words
The method according to claim 16, wherein the step of bathing a region between said anode and said cathode and said metallized surface in an electroplating solution is performed via separate supply lines providing different electrolytic solutions proximate the anode and cathode.
Claim 23
Dependent Claim
33 words
The method according to claim 16, including the step of positioning a brush between said bipolar electrode assembly and said metallized surface with a surface of said brush adjacent to said metallized surface.
Claim 24
Dependent Claim
26 words
The method according to claim 16, wherein said voltage across said anode and said cathode is controlled in accordance with a direction of said relative motion.
Claim 25
Dependent Claim
21 words
The method according to claim 16, wherein said flowing current is controlled in accordance with a direction of said relative motion.
Claim 26
Dependent Claim
21 words
The method according to claim 16, including the step of supporting said metallized surface from the side opposite said metallized surface.
Claim 27
Dependent Claim
20 words
The method according to claim 16, including the step of reusing said electroplating solution by recirculation means and conditioning means.
Claim 28
Dependent Claim
32 words
The method according to claim 25, wherein said conditioning means is selected from the group consisting of: heating means, cooling means, chemical modification means, and means for filtration of said electroplating solution.
References Cited (Backward Citations)
US4153531A
Cited
US4430167A
Cited
US5256565A
Cited
US5209833A
Cited
US5096550A
Cited
US5344539A
Cited
JPH06297245A
Cited
US5591671A
Cited
US5447615A
Cited
US5804052A
Cited
US5531874A
Cited
US5567300A
Cited
EP0699782A1
Cited
US5543032A
Cited
US5486282A
Cited
US5567304A
Cited
US5536388A
Cited
US5575706A
Cited
US5660706A
Cited
US5695810A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2003-11-07 | 2004-05-08 | 2004-11-07 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2007-11-07 | 2008-05-08 | 2008-11-07 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2011-11-07 | 2012-05-08 | 2012-11-07 | $7700.00 | Window Closed / Lapsed |