US6284091B1
Expired / Lapsed
US
⏱️ 0.0 years remaining
Unique chemical mechanical planarization approach which utilizes magnetic slurry for polish and magnetic fields for process control
Assignee: Intel Corp
•
Filing: 1999-07-13
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Granted: 2001-09-04
•
Expires: 2019-07-13
Abstract
Abstract The present invention is an improved apparatus and process for chemical mechanical polishing (CMP) layers which have a low dielectric constant (k). The present invention uses a magnetic slurry and a magnetic coil for polishing the wafer with the magnetic slurry. By using a magnetic slurry and a magnetic coil the force used during polishing can be controlled resulting greater control over the CMP process during the polishing of low k materials.
Inventors
- 👤 Lawrence D. Wong
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-03 00:33
CPC Classifications
H; H10; H10P; H10P95/00; H10P95/06; H10P95/062; B; B24; B24B; B24B1/00; B24B1/005; B24B37/00; B24B37/04; C; C09; C09G; C09G1/00; C09G1/02
Claims Analysis
Total Claims: 26
Claim 1
Independent Claim
38 words
An apparatus comprising: a substrate holder; a substrate disposed on top of said substrate holder; a magnetic slurry disposed on top of said substrate; and a stage disposed below said substrate holder, said stage comprising a magnetic coil.
Claim 2
Independent Claim
38 words
An apparatus comprising: a substrate holder; a substrate disposed on top of said substrate holder; a magnetic slurry disposed on top of said substrate; and a stage disposed below said substrate holder, said stage comprising a magnetic coil.
Claim 3
Dependent Claim
11 words
The apparatus of claim 1 wherein said substrate is a wafer.
Claim 4
Dependent Claim
13 words
The apparatus of claim 2 wherein said substrate holder is a wafer holder.
Claim 5
Dependent Claim
13 words
The apparatus of claim 3 wherein said wafer holder is an electrostatic chuck.
Claim 6
Dependent Claim
14 words
The apparatus of claim 3 wherein said wafer is recessed in said wafer holder.
Claim 7
Dependent Claim
13 words
The apparatus of claim 1 wherein said magnetic slurry comprises a ferromagnetic material.
Claim 8
Dependent Claim
13 words
The apparatus of claim 6 wherein said magnetic slurry further comprises siilica oxide.
Claim 9
Dependent Claim
13 words
The apparatus of claim 6 wherein said magnetic slurry further comprises cerium oxide.
Claim 10
Dependent Claim
14 words
The apparatus of claim 1 wherein said magnetic slurry comprises a wet polishing slurry.
Claim 11
Dependent Claim
14 words
The apparatus of claim 1 wherein said magnetic slurry comprises a dry polishing slurry.
Claim 12
Dependent Claim
19 words
The apparatus of claim 1 wherein said strength can increase a force of said magnetic slurry on said substrate.
Claim 13
Dependent Claim
16 words
The apparatus of claim 1 wherein said strength can increase a polishing rate of said substrate.
Claim 14
Dependent Claim
20 words
The apparatus of claim 1 wherein said magnetic coil has a field strength that may range from approximately 100-1000 Gauss.
Claim 15
Dependent Claim
20 words
The apparatus of claim 1 wherein said magnetic coil has a field strength in a range of approximately 800-900 Gauss.
Claim 16
Dependent Claim
20 words
The apparatus of claim 1 wherein said magnetic coil may have a field strength that may vary within said stage.
Claim 17
Dependent Claim
25 words
The apparatus of claim 1 wherein said stage may be moved in any desired direction in order to move said magnetic slurry to desired locations.
Claim 18
Dependent Claim
23 words
The apparatus of claim 1 wherein said stage may be moved in any desired direction in order to perform a particular polish pattern.
Claim 19
Dependent Claim
23 words
The apparatus of claim 1 wherein said stage may be moved in an x-y directional plane as well as in a circular motion.
Claim 20
Dependent Claim
33 words
The apparatus of claim 1 wherein said stage may be moved closer to or further from said substrate holder in order to vary said strength of said magnetic coil on said magnetic slurry.
Claim 21
Dependent Claim
14 words
The apparatus of claim 1 wherein said apparatus does not comprise a polishing pad.
Claim 22
Independent Claim
49 words
An apparatus comprising: a wafer holder, said wafer holder having a first side and a second side; a magnetic slurry disposed adjacent to said first side of said wafer holder; and a stage disposed adjacent to said second side of said wafer holder, said stage comprising a magnetic coil.
Claim 23
Independent Claim
49 words
An apparatus comprising: a wafer holder, said wafer holder having a first side and a second side; a magnetic slurry disposed adjacent to said first side of said wafer holder; and a stage disposed adjacent to said second side of said wafer holder, said stage comprising a magnetic coil.
Claim 24
Dependent Claim
20 words
The apparatus of claim 21 wherein said magnetic coil has a strength that is sized to obtain optimal polishing parameters.
Claim 25
Dependent Claim
23 words
The apparatus of claim 21 wherein said stage may be moved in any desired direction in order to perform a particular polish pattern.
Claim 26
Dependent Claim
33 words
The apparatus of claim 22 wherein said stage may be moved closer to or further from said wafer holder in order to vary said strength of said magnetic coil on said magnetic slurry.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2004-09-03 | 2005-03-05 | 2005-09-04 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2008-09-03 | 2009-03-05 | 2009-09-04 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2012-09-03 | 2013-03-05 | 2013-09-04 | $7700.00 | Window Closed / Lapsed |