US6022807A
Expired / Lapsed
US
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Method for fabricating an integrated circuit
Assignee: Micro Processing Technology Inc
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Filing: 1996-04-24
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Granted: 2000-02-08
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Expires: 2016-04-24
Abstract
Abstract An apparatus 100 for removing surface non-uniformities is provided. This apparatus has a stage 103 for holding a substrate 127 to be processed. This substrate often includes a film thereon, where the film has the non-uniformities. The apparatus 200 includes a movable head 111, which can provide rotatable movement about a fixed axis 123. A drive motor 115 is operably attached to the movable head 111 to provide this rotatable movement. A pad 113 (e.g., polishing or planarizing pad) is attached to the movable head. This pad 113 comprises an abrasive material and also has a smaller length (e.g, diameter, etc.) relative to a length (e.g, diameter, etc.) of the substrate. The smaller pad is capable of selectively removing a portion of the non-uniformities on the film.
Inventors
- 👤 Paul C. Lindsey, Jr.
- 👤 Robert J. McClelland
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-04 00:57
CPC Classifications
B; B24; B24B; B24B53/00; B24B53/017; B24B37/00; B24B37/04; H; H10; H10P; H10P52/00; H10P52/40; H10P52/403; H10P95/00; H10P95/06; H10P95/062
Claims Analysis
Total Claims: 22
Claim 1
Independent Claim
90 words
A method for fabricating an integrated circuit, said method comprising: providing a semiconductor wafer having a film thereon, said film having a surface that is non-uniform; providing a pad comprising abrasive material, said pad defining an opening configured to be an orifice for fluid flow; and rotating said pad and applying said pad against said film, said applying occurring at a selected force to remove a portion of said surface where said surface is non-uniform; wherein said pad has a substantially smaller diameter than a diameter of said semiconductor wafer.
Claim 2
Independent Claim
90 words
A method for fabricating an integrated circuit, said method comprising: providing a semiconductor wafer having a film thereon, said film having a surface that is non-uniform; providing a pad comprising abrasive material, said pad defining an opening configured to be an orifice for fluid flow; and rotating said pad and applying said pad against said film, said applying occurring at a selected force to remove a portion of said surface where said surface is non-uniform; wherein said pad has a substantially smaller diameter than a diameter of said semiconductor wafer.
Claim 3
Dependent Claim
17 words
The method of claim 1 wherein said selected force ranges from about 0.5 to about 10 lbs-force.
Claim 4
Dependent Claim
24 words
The method of claim 1 wherein said film is selected from a group consisting of a dielectric material, a metal, and a semiconductor material.
Claim 5
Dependent Claim
21 words
The method of claim 1 wherein said pad is rotated at a speed ranging from about 100 to about 100,000 RPM.
Claim 6
Dependent Claim
21 words
The method of claim 1 wherein said pad is rotated at a speed ranging from about 500 to about 20,000 RPM.
Claim 7
Dependent Claim
25 words
The method of claim 1 wherein the diameter of said pad ranges from about 0.1 inch to about one-half the diameter of said semiconductor wafer.
Claim 8
Dependent Claim
16 words
The method of claim 6 wherein the diameter of said semiconductor wafer is about 3 inches.
Claim 9
Dependent Claim
10 words
The method of claim 1 wherein said pad is multilayered.
Claim 10
Dependent Claim
17 words
The method of claim 1 wherein said pad comprises an abrasive material overlying a compliant backing material.
Claim 11
Dependent Claim
17 words
The method of claim 1 wherein said pad comprises an abrasive material overlying a non-compliant backing material.
Claim 12
Dependent Claim
22 words
The method of claim 1 wherein said abrasive material is provided with a diameter ranging from about 0.001 to about 10 μm.
Claim 13
Dependent Claim
33 words
The method of claim 1 wherein rotating said pad further includes rotating a plurality of pads wherein said plurality of pads have a substantially smaller diameter than said diameter of said semiconductor wafer.
Claim 14
Dependent Claim
14 words
The method claim 1 wherein said pad defines a plurality of openings distributed spatially.
Claim 15
Dependent Claim
10 words
The method of claim 1 further including conditioning said pad.
Claim 16
Dependent Claim
35 words
The method of claim 1 wherein a face of said semiconductor wafer is maintained substantially perpendicular to the ground at a semiconductor fabrication plant to permit fluid to flow off said semiconductor wafer via gravity.
Claim 17
Dependent Claim
20 words
The method of claim 1 further including injecting a fluid into an area between said pad and said semiconductor wafer.
Claim 18
Dependent Claim
19 words
The method of claim 16 wherein said fluid is selected from a group comprising lubricant, slurry, cleaner, and water.
Claim 19
Independent Claim
92 words
A method of fabricating an integrated circuit, said method comprising: providing a semiconductor wafer having a film thereon, said film having a surface that is non-uniform; providing a pad comprising abrasive material, said pad defining an opening configured to be an orifice for fluid flow, said pad having a substantially smaller diameter than a diameter of said semiconductor wafer; rotating said pad and applying said pad against said film, said applying occurring at a selected force to remove a portion of said surface where said surface is non-uniform; and conditioning said pad.
Claim 20
Independent Claim
92 words
A method of fabricating an integrated circuit, said method comprising: providing a semiconductor wafer having a film thereon, said film having a surface that is non-uniform; providing a pad comprising abrasive material, said pad defining an opening configured to be an orifice for fluid flow, said pad having a substantially smaller diameter than a diameter of said semiconductor wafer; rotating said pad and applying said pad against said film, said applying occurring at a selected force to remove a portion of said surface where said surface is non-uniform; and conditioning said pad.
Claim 21
Independent Claim
117 words
A method of fabricating an integrated circuit, said method comprising: providing a semiconductor wafer having a film thereon, said film having a surface that is non-uniform; providing a pad comprising abrasive material, said pad defining an opening configured to be an orifice for fluid flow, said pad having a substantially smaller diameter than a diameter of said semiconductor wafer; rotating said pad and applying said pad against said film, said applying occurring at a selected force to remove a portion of said surface where said surface is non-uniform; and maintaining a face of said semiconductor wafer substantially perpendicular to the ground at a semiconductor fabrication plant to permit fluid to flow off said semiconductor wafer via gravity.
Claim 22
Independent Claim
117 words
A method of fabricating an integrated circuit, said method comprising: providing a semiconductor wafer having a film thereon, said film having a surface that is non-uniform; providing a pad comprising abrasive material, said pad defining an opening configured to be an orifice for fluid flow, said pad having a substantially smaller diameter than a diameter of said semiconductor wafer; rotating said pad and applying said pad against said film, said applying occurring at a selected force to remove a portion of said surface where said surface is non-uniform; and maintaining a face of said semiconductor wafer substantially perpendicular to the ground at a semiconductor fabrication plant to permit fluid to flow off said semiconductor wafer via gravity.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2003-02-07 | 2003-08-09 | 2004-02-08 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2007-02-07 | 2007-08-09 | 2008-02-08 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2011-02-07 | 2011-08-09 | 2012-02-08 | $7700.00 | Window Closed / Lapsed |