Abstract A wafer polishing apparatus has a wafer chuck for holding a wafer with a surface to be polished directed upward, the wafer chuck being rotatable by a wafer chuck rotation motor; a pair of nozzles for supplying slurries used as polishing solutions to the wafer; and a polishing head for holding a polishing cloth pad which is smaller in diameter than the wafer. The polishing head is rotated in the same direction as the wafer chuck by a polishing head rotation motor and is also reciprocally moved along the surface of the wafer to be polished by an arm driving motor. The wafer polishing apparatus also has a polishing head load adjusting air cylinder for pressing the polishing cloth pad against the wafer by way of the polishing head.
A wafer polishing apparatus comprising: a wafer chuck for holding a wafer with a surface to be polished thereof being directed upward; first drive means for rotating said wafer chuck; polishing solution supply means for supplying a polishing solution to the wafer held by said wafer chuck; a polishing head which is smaller in diameter than the wafer; a polishing pad which is smaller in diameter than the wafer, said polished pad being attached to said polishing head; second drive means for rotating said polishing head; reciprocating means for reciprocally moving said polishing head on said surface to be polished; and pressing means for pressing said polishing pad against a wafer held by said wafer chuck by way of said polishing head.
Claim 2
Dependent Claim
122 words
A wafer polishing apparatus comprising: a wafer chuck for holding a wafer with a surface to be polished thereof being directed upward; first drive means for rotating said wafer chuck; polishing solution supply means for supplying a polishing solution to the wafer held by said wafer chuck; a polishing head which is smaller in diameter than the wafer; a polishing pad which is smaller in diameter than the wafer, said polished pad being attached to said polishing head; second drive means for rotating said polishing head; reciprocating means for reciprocally moving said polishing head on said surface to be polished; and pressing means for pressing said polishing pad against a wafer held by said wafer chuck by way of said polishing head.
Claim 3
Dependent Claim
25 words
A wafer polishing apparatus according to claim 1 wherein said polishing pad has a diameter substantially equal to an interval of undulations of the wafer.
Claim 4
Dependent Claim
25 words
A wafer polishing apparatus according to claim 1 comprising a plurality of polishing heads for holding a corresponding plurality of polishing pads of different types.
Claim 5
Dependent Claim
25 words
A wafer polishing apparatus according to claim 2 comprising a plurality of polishing heads for holding a corresponding plurality of polishing pads of different types.