Patent US6521995B1 successfully refreshed from Google Patents.
US6521995B1
Expired / Lapsed
US
⏱️ 0.0 years remaining
Wafer-level package
Assignee: Round Rock Research LLC
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Filing: 1999-09-30
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Granted: 2003-02-18
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Expires: 2019-09-30
Abstract
Abstract A carrier for use in a chip-scale package, including a polymeric film with apertures defined therethrough. The apertures, which are alignable with corresponding bond pads of a semiconductor device, each include a quantity of conductive material extending substantially through the length thereof. The carrier may also include laterally extending conductive traces in contact with or otherwise in electrical communication with the conductive material in the apertures of the carrier. Contacts may be disposed on a backside surface of the carrier. The contacts may communicate with the conductive material disposed in the apertures of the carrier. A conductive bump, such as a solder bump, may be disposed adjacent each or any of the contacts. A chip-scale package including the carrier of the present invention is also within the scope of the present invention. Such a chip-scale package includes a semiconductor device invertedly disposed over the carrier such that bond pads of the semiconductor device substantially align with apertures formed through the carrier. Thus, the bond pads of the semiconductor device may communicate with the conductive bumps by means of the conductive material disposed in the apertures of the carrier. Methods of fabricating the carrier of the present invention and methods of fabricating chip-scale packages including the carrier are also within the scope of the present invention.
Inventors
- 👤 Salman Akram
- 👤 Alan G. Wood
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 12:06
CPC Classifications
H; H10; H10W; H10W72/00; H10W72/20; H10W72/01; H10W72/012; H10W74/00; H10W74/10; H10W74/111; H10W74/129; H10W70/00; H10W70/01; H10W70/05; H10W72/251; H10W72/29; H10W72/50; H10W72/59; H10W72/90; H10W72/941; H10W72/944; H10W72/9445
Claims Analysis
Total Claims: 17
Claim 1
Independent Claim
123 words
A carrier for use in a chip-scale package, comprising: a preformed polymeric film, said preformed polymeric film having a first surface configured to be disposed in substantial contact with an active surface of a semiconductor device; at least one conductive via extending substantially longitudinally through said preformed polymeric film prior to placement thereof upon said active surface of said semiconductor device, electrically exposed at said first surface of said preformed polymeric film, and positioned to directly contact at least one bond pad of said semiconductor device; and at least one contact pad positionable directly over said at least one bond pad, in contact with said at least one conductive via, and substantially electrically exposed at a second surface of said preformed polymeric film.
Claim 2
Dependent Claim
123 words
A carrier for use in a chip-scale package, comprising: a preformed polymeric film, said preformed polymeric film having a first surface configured to be disposed in substantial contact with an active surface of a semiconductor device; at least one conductive via extending substantially longitudinally through said preformed polymeric film prior to placement thereof upon said active surface of said semiconductor device, electrically exposed at said first surface of said preformed polymeric film, and positioned to directly contact at least one bond pad of said semiconductor device; and at least one contact pad positionable directly over said at least one bond pad, in contact with said at least one conductive via, and substantially electrically exposed at a second surface of said preformed polymeric film.
Claim 3
Dependent Claim
17 words
The carrier of claim 1 , wherein said at least one conductive via comprises a conductive bump.
Claim 4
Dependent Claim
15 words
The carrier of claim 2 , wherein said at least one conductive bump comprises solder.
Claim 5
Dependent Claim
96 words
A chip-scale package, comprising: a polymeric carrier including at least one aperture extending substantially longitudinally therethrough between an active surface-abutting surface of said polymeric cartier and a contact beating surface of said polymeric carrier; a contact pad disposed over said at least one aperture; a semiconductor device including an active surface having at least one bond pad thereon and exposed to said at least one aperture, said active surface-abutting surface of said polymeric carrier in substantial contact with said active surface and secured thereto with adhesive material disposed between said polymeric carrier and said active surface.
Claim 6
Dependent Claim
96 words
A chip-scale package, comprising: a polymeric carrier including at least one aperture extending substantially longitudinally therethrough between an active surface-abutting surface of said polymeric cartier and a contact beating surface of said polymeric carrier; a contact pad disposed over said at least one aperture; a semiconductor device including an active surface having at least one bond pad thereon and exposed to said at least one aperture, said active surface-abutting surface of said polymeric carrier in substantial contact with said active surface and secured thereto with adhesive material disposed between said polymeric carrier and said active surface.
Claim 7
Dependent Claim
17 words
The chip-scale package of claim 4 , wherein said at least one aperture includes conductive material therein.
Claim 8
Dependent Claim
19 words
The chip-scale package of claim 5 , wherein said conductive material communicates with said at least one bond pad.
Claim 9
Dependent Claim
22 words
The chip-scale package of claim 6 , wherein said conductive in aerial is disposed directly adjacent said at least one bond pad.
Claim 10
Dependent Claim
17 words
The chip-scale package of claim 6 , further comprising a contact in communication with said conductive material.
Claim 11
Dependent Claim
15 words
The chip-scale package of claim 8 , further comprising a conductive bump adjacent said contact.
Claim 12
Dependent Claim
13 words
The chip-scale package of claim 7 , wherein said conductive bump comprises solder.
Claim 13
Dependent Claim
15 words
The chip-scale package of claim 5 , wherein said conductive material comprises a conductive bump.
Claim 14
Dependent Claim
17 words
The chip-scale package of claim 5 , further comprising a conductive elastomer disposed over said conductive material.
Claim 15
Dependent Claim
27 words
The chip-scale package of claim 12 , further comprising at least one conductive bump disposed on said conductive elastomer, opposite said conductive material, and in communication therewith.
Claim 16
Dependent Claim
23 words
The chip-scale package of claim 4 , wherein said at least one aperture and said at least one bond pad are substantially aligned.
Claim 17
Dependent Claim
23 words
The chip-scale package of claim 4 , wherein said preformed polymeric carrier at least partially contacts a peripheral edge of said semiconductor device.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2006-02-17 | 2006-08-19 | 2007-02-18 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2010-02-17 | 2010-08-19 | 2011-02-18 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2014-02-17 | 2014-08-19 | 2015-02-18 | $7700.00 | Window Closed / Lapsed |