US6323735B1 — Method and apparatus for synthesizing high-freque…

Claim 1

Independent Claim 133 words

A semiconductor package comprising: a package substrate having a first surface; an integrated circuit electrically connected to said first surface of said package substrate, said integrated circuit and said package substrate together forming said semiconductor package, the integrated circuit and package substrate including frequency synthesizer circuitry; and at least one inductance circuit formed entirely within said semiconductor package and formed at least partially between said integrated circuit and said package substrate, the inductance circuit at least in part determining an output frequency for the frequency synthesizer circuitry; wherein said frequency synthesizer circuitry has an output frequency selectably operable within a plurality of bands, and wherein said at least one inductance circuit forms part of a controlled oscillator circuit within said frequency synthesizer circuitry, the output frequency being dependent upon the controlled oscillator circuit.

Claim 2

Dependent Claim 133 words

A semiconductor package comprising: a package substrate having a first surface; an integrated circuit electrically connected to said first surface of said package substrate, said integrated circuit and said package substrate together forming said semiconductor package, the integrated circuit and package substrate including frequency synthesizer circuitry; and at least one inductance circuit formed entirely within said semiconductor package and formed at least partially between said integrated circuit and said package substrate, the inductance circuit at least in part determining an output frequency for the frequency synthesizer circuitry; wherein said frequency synthesizer circuitry has an output frequency selectably operable within a plurality of bands, and wherein said at least one inductance circuit forms part of a controlled oscillator circuit within said frequency synthesizer circuitry, the output frequency being dependent upon the controlled oscillator circuit.

Claim 3

Dependent Claim 18 words

The semiconductor package of claim 1 , wherein said frequency synthesizer circuitry comprises a phase locked loop circuit.

Claim 4

Dependent Claim 26 words

The semiconductor package of claim 1 , wherein said controlled oscillator circuit within said frequency synthesizer circuitry is selectably operable within said plurality of frequency bands.

Claim 5

Dependent Claim 18 words

The semiconductor package of claim 3 , wherein said controlled oscillator circuit comprises an LC tank oscillator circuit.

Claim 6

Dependent Claim 135 words

A semiconductor package comprising: a package substrate having a first surface; an integrated circuit electrically connected to said first surface of said package substrate, said integrated circuit and said package substrate together forming said semiconductor package, the integrated circuit and package substrate including frequency synthesizer circuitry; at least one inductance circuit formed entirely within said semiconductor package and formed at least partially between said integrated circuit and said package substrate, the inductance circuit at least in part determining an output frequency for the frequency synthesizer circuitry; and at least one substrate electrical contact disposed on said first surface of said package substrate; and wherein said inductance circuit is formed by first and second conductive features electrically coupled between said integrated circuit and said at least one substrate electrical contact to form an electrically conductive path.

Claim 7

Dependent Claim 135 words

A semiconductor package comprising: a package substrate having a first surface; an integrated circuit electrically connected to said first surface of said package substrate, said integrated circuit and said package substrate together forming said semiconductor package, the integrated circuit and package substrate including frequency synthesizer circuitry; at least one inductance circuit formed entirely within said semiconductor package and formed at least partially between said integrated circuit and said package substrate, the inductance circuit at least in part determining an output frequency for the frequency synthesizer circuitry; and at least one substrate electrical contact disposed on said first surface of said package substrate; and wherein said inductance circuit is formed by first and second conductive features electrically coupled between said integrated circuit and said at least one substrate electrical contact to form an electrically conductive path.

Claim 8

Dependent Claim 19 words

The semiconductor package of claim 5 , wherein no external package electrical connection exists to said substrate electrical contact.

Claim 9

Dependent Claim 92 words

The semiconductor package of claim 5 , wherein said package substrate is provided with at least two alternative substrate electrical contacts corresponding to said inductance circuit to provide alternate electrical connection points during package assembly for at least one or both of said first and second conductive features of said inductance circuit, an inductance value of said inductance circuit being dependent on the identity of the alternative substrate electrical contact selected for connection with at least one or both of said first and second conductive features to form said electrically conductive path.

Claim 10

Dependent Claim 115 words

The semiconductor package of claim 7 , wherein said alternative substrate electrical contacts corresponding to said inductance circuit comprise alternative substrate bonding pads spaced at variable distances from said integrated circuit; and wherein said first and second conductive features of said inductance circuit comprise first and second wire bonds electrically connected to a selected one of said alternative substrate bonding pads to form an electrically conductive path having an inductance value at least partially dependent on at least one of the length of the first and second wire bonds required to span the distance between said selected substrate bonding pad and said integrated circuit, the distance between said first and second wire bonds, or both.

Claim 11

Dependent Claim 142 words

The semiconductor package of claim 7 , wherein said alternative substrate electrical contacts corresponding to said inductance circuit comprise alternative pairs of first and second substrate bonding pads positioned at variable locations on or within said package substrate, each of the first and second substrate bonding pads of a bonding pad pair being electrically coupled to one another on or within said package substrate by a third conductive feature; wherein said first and second conductive features of said inductance circuit comprise first and second solder bumps positioned so that they are electrically connected to a selected respective alternative pair of first and second substrate bonding pads to form an electrically conductive path having an inductance value at least partially dependent on the inductive value of the third conductive feature electrically coupled between said selected pair of first and second substrate bonding pads.

Claim 12

Dependent Claim 165 words

The semiconductor package of claim 7 , wherein said alternative substrate electrical contacts corresponding to said inductance circuit comprise alternative pairs of first and second substrate bonding pads positioned at variable locations on or within said package substrate, each of the first and second substrate bonding pads of a bonding pad pair being electrically coupled to one another on or within said package substrate by a third conductive feature; wherein said first and second conductive features of said inductance circuit comprise first and second wire bonds electrically connected to a selected respective alternative pair of first and second substrate bonding pads to form an electrically conductive path having an inductance value at least partially dependent on the inductive value of the third conductive feature electrically coupled between said selected pair of first and second substrate bonding pads, the length of the first and second wire bonds required to span the distance between said selected substrate bonding pads and said integrated circuit, or a combination thereof.

Claim 13

Dependent Claim 98 words

The semiconductor package of claim 3 , further comprising a plurality of substrate electrical contacts disposed on said first surface of said package substrate; and wherein the controlled oscillator circuit has a plurality of selectable inductance circuits having different inductance values, the selectable inductance circuits allowing for the oscillator circuit to be operable in the plurality of frequency bands; and wherein each of said plurality of selectable inductance circuits is formed by first and second conductive features electrically coupled between said integrated circuit and one or more of said substrate electrical contacts to form an electrically conductive path.

Claim 14

Dependent Claim 93 words

The semiconductor package of claim 11 , wherein said package is provided with alternative substrate electrical contacts corresponding to each of said inductance circuits to provide alternate electrical connection points during package assembly for at least one or both of said first and second conductive features of each said inductance circuits, the inductance value of each of said inductance circuits being dependent on the identity of the alternative substrate electrical contact selected for connection with at least one or both of said first and second conductive features to form said electrically conductive path.

Claim 15

Dependent Claim 118 words

The semiconductor package of claim 12 , wherein said alternative substrate electrical contacts corresponding to each of said inductance circuits comprise alternative substrate bonding pads spaced at variable distances from said integrated circuit; and wherein said first and second conductive features of each inductance circuit comprise first and second wire bonds electrically connected to a selected one of said alternative substrate bonding pads to form an electrically conductive path having a first inductance value at least partially dependent on at least one of the length of the first and second wire bonds required to span the distance between said selected substrate bonding pad and said integrated circuit, the distance between said first and second wire bonds, or both.

Claim 16

Dependent Claim 144 words

The semiconductor package of claim 12 , wherein said alternative substrate electrical contacts corresponding to each of said inductance circuits comprise alternative pairs of first and second substrate bonding pads positioned at variable locations on or within said package substrate, each of the first and second substrate bonding pads of a bonding pad pair being electrically coupled to one another on or within said package substrate by a third conductive feature; wherein said first and second conductive features of each inductance circuit comprise first and second solder bumps positioned so that they are electrically connected to a selected respective alternative pair of first and second substrate bonding pads to form an electrically conductive path having an inductance value at least partially dependent on the inductive value of the third conductive feature electrically coupled between said selected pair of first and second substrate bonding pads.

Claim 17

Dependent Claim 172 words

The semiconductor package of claim 12 , wherein said alternative substrate electrical contacts corresponding to each of said inductance circuits comprise alternative pairs of first and second substrate bonding pads positioned at variable locations on or within said package substrate, each of the first and second substrate bonding pads of a bonding pad pair being electrically coupled to one another on or within said package substrate by a third conductive feature; wherein said first and second conductive features of each inductance circuit comprise first and second wire bonds positioned so that they are electrically connected to a selected respective alternative pair of first and second substrate bonding pads to form an electrically conductive path having an inductance value at least partially dependent on the inductive value of the third conductive feature electrically coupled between said selected pair of first and second substrate bonding pads, the length of the first and second wire bonds required to span the distance between said selected substrate bonding pads and said integrated circuit, or a combination thereof.

Claim 18

Dependent Claim 42 words

The semiconductor package of claim 12 , wherein said controlled oscillator circuit comprises first and second selectable inductance circuits and a switch coupled to selectively choose either said first or said second selectable inductance circuit for inclusion within said controlled oscillator circuit.

Claim 19

Dependent Claim 45 words

The semiconductor package of claim 12 , wherein said controlled oscillator circuit comprises first and second selectable inductance circuits and a switch coupled to selectively choose either one or both of said first or second selectable inductance circuits for inclusion within said controlled oscillator circuit.

Claim 20

Dependent Claim 36 words

The semiconductor package of claim 17 , wherein said switch is coupled so that both of said first and second selectable inductance circuits may be chosen for inclusion within said controlled oscillator circuit in series relationship.

Claim 21

Dependent Claim 36 words

The semiconductor package of claim 17 , wherein said switch is coupled so that both of said first and second selectable inductance circuits may be chosen for inclusion within said controlled oscillator circuit in parallel relationship.

Claim 22

Dependent Claim 179 words

A frequency synthesizer for generating output signals in at least one band of frequency, comprising: a package substrate having a plurality of substrate electrical contacts disposed on a first surface thereof; an integrated circuit structurally connected to said first surface of said package substrate and having a plurality of integrated circuit electrical contacts disposed on a surface thereof, said integrated circuit and said package substrate together forming said frequency synthesizer and comprising: a frequency circuit having an output frequency operable within at least one frequency band; and a controlled oscillator circuit within a phase locked loop circuit, the controlled oscillator circuit being operable within said at least one frequency band and the output frequency being dependent upon the controlled oscillator circuit; wherein the controlled oscillator circuit has at least one inductance circuit formed at least partially between said integrated circuit and said package substrate, said inductance circuit being electrically connected to an on-package inductor having an inductance value, the at least one inductance circuit allowing the controlled oscillator circuit to be operable in said at least one frequency band.

Claim 23

Dependent Claim 179 words

A frequency synthesizer for generating output signals in at least one band of frequency, comprising: a package substrate having a plurality of substrate electrical contacts disposed on a first surface thereof; an integrated circuit structurally connected to said first surface of said package substrate and having a plurality of integrated circuit electrical contacts disposed on a surface thereof, said integrated circuit and said package substrate together forming said frequency synthesizer and comprising: a frequency circuit having an output frequency operable within at least one frequency band; and a controlled oscillator circuit within a phase locked loop circuit, the controlled oscillator circuit being operable within said at least one frequency band and the output frequency being dependent upon the controlled oscillator circuit; wherein the controlled oscillator circuit has at least one inductance circuit formed at least partially between said integrated circuit and said package substrate, said inductance circuit being electrically connected to an on-package inductor having an inductance value, the at least one inductance circuit allowing the controlled oscillator circuit to be operable in said at least one frequency band.

Claim 24

Dependent Claim 158 words

The frequency synthesizer of claim 20 , wherein said at least one inductance circuit is formed by first and second conductive features electrically coupled between two or more of said integrated circuit electrical contacts and one or more of said substrate electrical contacts to form an electrically conductive path; and wherein said package is provided with at least one of alternative substrate electrical contacts or alternative integrated circuit electrical contacts corresponding to said inductance circuit to provide alternate electrical connection points during package assembly for at least one or both of said first and second conductive features of said inductance circuit, the on-package inductance value of said inductance circuit being dependent on at least one or both of the identity of the alternative substrate electrical contacts, or the identity of the alternative integrated circuit electrical contacts, selected for connection with at least one or both of said first and second conductive features to form said electrically conductive path.

Claim 25

Dependent Claim 28 words

The frequency synthesizer of claim 21 , wherein no external package connection exists to said alternative substrate contact selected for connection with said first and second conductive features.

Claim 26

Dependent Claim 17 words

The frequency synthesizer of claim 21 , wherein said frequency circuit comprises a phase locked loop circuit.

Claim 27

Dependent Claim 18 words

The frequency synthesizer of claim 23 , wherein said controlled oscillator circuit comprises an LC tank oscillator circuit.

Claim 28

Independent Claim 186 words

A method of assembling a semiconductor package, comprising: providing a package substrate having a plurality of substrate electrical contacts disposed on a first surface thereof; providing an integrated circuit electrically connected to said first surface of said package substrate, said integrated circuit and said package substrate together forming said semiconductor package, the integrated circuit and package substrate including frequency synthesizer circuitry, the package substrate being provided with at least two alternative substrate electrical contacts to provide alternate electrical connection points during package assembly for at least one or both of a first conductive feature and a second conductive feature of a frequency synthesizer inductance circuit formed entirely within said semiconductor package; selecting at least one of said alternative substrate electrical contacts; and electrically connecting at least one or both of said first and second conductive features to said selected alternative substrate electrical contact to form said frequency synthesizer inductance circuit, the inductance value of said frequency synthesizer inductance circuit being dependent on the identity of the alternative substrate electrical contact selected for connection with at least one or both of said first and second conductive features.

Claim 29

Independent Claim 186 words

A method of assembling a semiconductor package, comprising: providing a package substrate having a plurality of substrate electrical contacts disposed on a first surface thereof; providing an integrated circuit electrically connected to said first surface of said package substrate, said integrated circuit and said package substrate together forming said semiconductor package, the integrated circuit and package substrate including frequency synthesizer circuitry, the package substrate being provided with at least two alternative substrate electrical contacts to provide alternate electrical connection points during package assembly for at least one or both of a first conductive feature and a second conductive feature of a frequency synthesizer inductance circuit formed entirely within said semiconductor package; selecting at least one of said alternative substrate electrical contacts; and electrically connecting at least one or both of said first and second conductive features to said selected alternative substrate electrical contact to form said frequency synthesizer inductance circuit, the inductance value of said frequency synthesizer inductance circuit being dependent on the identity of the alternative substrate electrical contact selected for connection with at least one or both of said first and second conductive features.

Claim 30

Dependent Claim 17 words

The method of claim 25 , wherein said frequency synthesizer circuitry comprises a phase locked loop circuit.

Claim 31

Dependent Claim 60 words

The method of claim 25 , wherein said frequency synthesizer circuitry has an output frequency operable within a plurality of bands, and wherein said frequency synthesizer inductance circuit forms part of a controlled oscillator circuit within said frequency synthesizer circuitry that is selectably operable within said plurality of frequency bands, the output frequency being dependent upon the controlled oscillator circuit.

Claim 32

Dependent Claim 18 words

The semiconductor package of claim 27 , wherein said controlled oscillator circuit comprises an LC tank oscillator circuit.

Claim 33

Dependent Claim 34 words

The method of claim 25 , wherein no external package connection exists to said alternative substrate contact selected for electrical connection with at least one or both of said first and second conductive features.

Claim 34

Dependent Claim 130 words

The method of claim 25 , wherein said at least two alternative substrate electrical contacts comprise at least two alternative substrate bonding pads spaced at variable distances from said integrated circuit; wherein said first and second conductive features of said inductance circuit comprise first and second wire bonds; and wherein said step of electrically connecting comprises electrically connecting both of said first and second wire bonds to a selected one of said alternative substrate bonding pads to form an electrically conductive path having an inductance value at least partially dependent on at least one of the length of the first and second wire bonds required to span the distance between said selected substrate bonding pad and said integrated circuit, the distance between said first and second wire bonds, or both.

Claim 35

Dependent Claim 161 words

The semiconductor package of claim 25 , wherein said at least two alternative substrate electrical contacts comprise at least two alternative pairs of first and second substrate bonding pads positioned at variable locations on or within said package substrate, each of the first and second substrate bonding pads of a bonding pad pair being electrically coupled to one another on or within said package substrate by a third conductive feature; wherein said first and second conductive features of said inductance circuit comprise first and second solder bumps; and wherein said step of electrically connecting comprises positioning said first and second conductive features of said inductance circuit so that they are electrically connected to a selected respective alternative pair of first and second substrate bonding pads to form an electrically conductive path having an inductance value at least partially dependent on the inductive value of the third conductive feature electrically coupled between said selected pair of first and second substrate bonding pads.

Claim 36

Dependent Claim 185 words

The semiconductor package of claim 25 , wherein said at least two alternative substrate electrical contacts corresponding to said inductance circuit comprise at least two alternative pairs of first and second substrate bonding pads positioned at variable locations on or within said package substrate, each of the first and second substrate bonding pads of a bonding pad pair being electrically coupled to one another on or within said package substrate by a third conductive feature; wherein said first and second conductive features of said inductance circuit comprise first and second wire bonds; and wherein said step of electrically connecting comprises electrically connecting said first and second wire bonds to a selected respective alternative pair of first and second substrate bonding pads to form an electrically conductive path having an inductance value at least partially dependent on the inductive value of the third conductive feature electrically coupled between said selected pair of first and second substrate bonding pads, the length of the first and second wire bonds required to span the distance between said selected substrate bonding pads and said integrated circuit, or a combination thereof.

Claim 37

Dependent Claim 161 words

A semiconductor package comprising: a package substrate having a first surface; an integrated circuit electrically connected to said first surface of said package substrate, said integrated circuit and said package substrate together forming said semiconductor package, the integrated circuit and package substrate including frequency synthesizer circuitry; at least one inductance circuit formed entirely within said semiconductor package and formed at least partially between said integrated circuit and said package substrate, the inductance circuit at least in part determining an output frequency for the frequency synthesizer circuitry; and at least two alternative substrate electrical contacts disposed on said package substrate; wherein said inductance circuit comprises at least one conductive feature electrically coupled between said integrated circuit and one of said alternative substrate electrical contacts to form an electrically conductive path, an inductance value of said inductance circuit being dependent on the identity of the alternative substrate electrical contact coupled to said at least one conductive feature to form said electrically conductive path.

Claim 38

Dependent Claim 161 words

A semiconductor package comprising: a package substrate having a first surface; an integrated circuit electrically connected to said first surface of said package substrate, said integrated circuit and said package substrate together forming said semiconductor package, the integrated circuit and package substrate including frequency synthesizer circuitry; at least one inductance circuit formed entirely within said semiconductor package and formed at least partially between said integrated circuit and said package substrate, the inductance circuit at least in part determining an output frequency for the frequency synthesizer circuitry; and at least two alternative substrate electrical contacts disposed on said package substrate; wherein said inductance circuit comprises at least one conductive feature electrically coupled between said integrated circuit and one of said alternative substrate electrical contacts to form an electrically conductive path, an inductance value of said inductance circuit being dependent on the identity of the alternative substrate electrical contact coupled to said at least one conductive feature to form said electrically conductive path.

Annuity Stage	Window Opens	Payment Deadline	Surcharge Period Until	Estimated Fee	Status
3.5 Years (Year 4)	2004-11-26	2005-05-28	2005-11-27	$2000.00	Window Closed / Lapsed
7.5 Years (Year 8)	2008-11-26	2009-05-28	2009-11-27	$3760.00	Window Closed / Lapsed
11.5 Years (Year 12)	2012-11-26	2013-05-28	2013-11-27	$7700.00	Window Closed / Lapsed

Method and apparatus for synthesizing high-frequency signals utilizing on-package oscillator circuit inductors

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