Chip scale ball grid array for integrated circuit packaging

Claim 2

An electronic package comprising: an integrated circuit having at least one electrical contact site centrally disposed on a first side of the integrated circuit; a flexible intermediate circuit including an array of electrical interconnects; at least one nonpolymer layer having first and second sides, said first side of said nonpolymer layer being structurally coupled to said first side of said integrated circuit, and said second side of said nonpolymer layer being structurally coupled to said intermediate circuit, wherein said nonpolymer layer is conductive and is electrically coupled to said integrated circuit to form a power or ground plane; a slot extending through a central portion of said intermediate circuit and said nonpolymer layer, the slot aligned with the at least one electrical contact site of the integrated circuit; wherein said at least one centrally disposed electrical contact site of the IC is electrically coupled to at least one electrical interconnect of said intermediate circuit by a conductive feature selected from the group consisting of wire bonding and thermocompression bonding.

Claim 3

The electronic package of claim 1 wherein said intermediate circuit has first and second sides, said first side of said intermediate circuit being structurally connected to said second side of said nonpolymer layer; and further comprising a plurality of solder balls or bumps electrically coupled to said intermediate circuit; said plurality of solder balls or bumps being structurally coupled to said second side of said intermediate circuit.

Claim 4

An electronic package comprising: an integrated circuit having at least one electrical contact site centrally disposed on a first side of the integrated circuit; a flexible intermediate circuit including an array of electrical interconnects; at least one nonpolymer layer having first and second sides, said first side of said nonpolymer layer being structurally coupled to said first side of said integrated circuit, and said second side of said nonpolymer layer being structurally coupled to said intermediate circuit, wherein said nonpolymer layer is a nonpolymer support structure having a modulus of elasticity of greater than about 6.89×10 6 kPA; a slot extending through a central portion of said intermediate circuit and said nonpolymer layer, the slot aligned with the at least one electrical contact site of the integrated circuit; wherein said at least one centrally disposed electrical contact site of the IC is electrically coupled to at least one electrical interconnect of said intermediate circuit by a conductive feature selected from the group consisting of wire bonding and thermocompression bonding.

Claim 5

An electronic package comprising: an integrated circuit having at least one electrical contact site centrally disposed on a first side of the integrated circuit; a flexible intermediate circuit including an array of electrical interconnects; at least one nonpolymer layer having first and second sides, said first side of said nonpolymer layer being structurally coupled to said first side of said integrated circuit, and said second side of said nonpolymer layer being structurally coupled to said intermediate circuit, wherein said nonpolymer layer is a nonpolymer support structure having a modulus of elasticity of greater than about 6.89×10 6 kPA; a slot extending through a central portion of said intermediate circuit and said nonpolymer layer, the slot aligned with the at least one electrical contact site of the integrated circuit; wherein said at least one centrally disposed electrical contact site of the IC is electrically coupled to at least one electrical interconnect of said intermediate circuit by a conductive feature selected from the group consisting of wire bonding and thermocompression bonding.

Claim 6

The electronic package of claim 3 wherein said intermediate circuit has first and second sides, said first side of said intermediate circuit being structurally connected to said second side of said nonpolymer layer; and further comprising a plurality of solder balls or bumps electrically coupled to said intermediate circuit; said plurality of solder balls or bumps being structurally coupled to said second side of said intermediate circuit.

Claim 7

An electronic package comprising: an integrated circuit having at least one electrical contact site centrally disposed on a first side of the integrated circuit; a flexible intermediate circuit including an array of electrical interconnects; at least one nonpolymer layer having first and second sides, said first side of said nonpolymer layer being structurally coupled to said first side of said integrated circuit, and said second side of said nonpolymer layer being structurally coupled to said intermediate circuit, wherein said nonpolymer layer is a nonpolymer support structure comprised of a metal foil having a thickness of between about 100 μm and about 250 μm; a slot extending through a central portion of said intermediate circuit and said nonpolymer layer, the slot aligned with the at least one electrical contact site of the integrated circuit; wherein said at least one centrally disposed electrical contact site of the IC is electrically coupled to at least one electrical interconnect of said intermediate circuit by a conductive feature selected from the group consisting of wire bonding and thermocompression bonding.

Claim 8

An electronic package comprising: an integrated circuit having at least one electrical contact site centrally disposed on a first side of the integrated circuit; a flexible intermediate circuit including an array of electrical interconnects; at least one nonpolymer layer having first and second sides, said first side of said nonpolymer layer being structurally coupled to said first side of said integrated circuit, and said second side of said nonpolymer layer being structurally coupled to said intermediate circuit, wherein said nonpolymer layer is a nonpolymer support structure comprised of a metal foil having a thickness of between about 100 μm and about 250 μm; a slot extending through a central portion of said intermediate circuit and said nonpolymer layer, the slot aligned with the at least one electrical contact site of the integrated circuit; wherein said at least one centrally disposed electrical contact site of the IC is electrically coupled to at least one electrical interconnect of said intermediate circuit by a conductive feature selected from the group consisting of wire bonding and thermocompression bonding.

Claim 9

The electronic package of claim 5 wherein said intermediate circuit has first and second sides, said first side of said intermediate circuit being structurally connected to said second side of said nonpolymer layer; and further comprising a plurality of solder balls or bumps electrically coupled to said intermediate circuit; said plurality of solder balls or bumps being structurally coupled to said second side of said intermediate circuit.

Claim 10

An electronic package comprising: an integrated circuit having at least one electrical contact site centrally disposed on a first side of the integrated circuit; a flexible intermediate circuit including an array of electrical interconnects; at least one nonpolymer layer having first and second sides, said first side of said nonpolymer layer being structurally coupled to said first side of said integrated circuit, and said second side of said nonpolymer layer being structurally coupled to said intermediate circuit, wherein said nonpolymer layer is a nonpolymer support structure comprised of a copper foil; a slot extending through a central portion of said intermediate circuit and said nonpolymer layer, the slot aligned with the at least one electrical contact site of the integrated circuit; wherein said at least one centrally disposed electrical contact site of the IC is electrically coupled to at least one electrical interconnect of said intermediate circuit by a conductive feature selected from the group consisting of wire bonding and thermocompression bonding.

Claim 11

An electronic package comprising: an integrated circuit having at least one electrical contact site centrally disposed on a first side of the integrated circuit; a flexible intermediate circuit including an array of electrical interconnects; at least one nonpolymer layer having first and second sides, said first side of said nonpolymer layer being structurally coupled to said first side of said integrated circuit, and said second side of said nonpolymer layer being structurally coupled to said intermediate circuit, wherein said nonpolymer layer is a nonpolymer support structure comprised of a copper foil; a slot extending through a central portion of said intermediate circuit and said nonpolymer layer, the slot aligned with the at least one electrical contact site of the integrated circuit; wherein said at least one centrally disposed electrical contact site of the IC is electrically coupled to at least one electrical interconnect of said intermediate circuit by a conductive feature selected from the group consisting of wire bonding and thermocompression bonding.

Claim 12

The electronic package of claim 7 wherein said intermediate circuit has first and second sides, said first side of said intermediate circuit being structurally connected to said second side of said nonpolymer layer; and further comprising a plurality of solder balls or bumps electrically coupled to said intermediate circuit; said plurality of solder balls or bumps being structurally coupled to said second side of said intermediate circuit.

Claim 13

An electronic package comprising: an integrated circuit having at least one electrical contact site centrally disposed on a first side of the integrated circuit; a flexible intermediate circuit including an array of electrical interconnects; at least one nonpolymer layer having first and second sides, said first side of said nonpolymer layer being structurally coupled to said first side of said integrated circuit, and said second side of said nonpolymer layer being structurally coupled to a mounting layer having first and second sides, said first side of said mounting layer being structurally coupled to said second side of said nonpolymer layer, and said second side of said mounting layer being structurally coupled to said intermediate circuit wherein said mounting layer is a polyimide layer having a thickness of between about 25 μm and about 75 μm, and wherein said nonpolymer layer is a copper layer having a thickness of between about 1 μm and about 50 μm; a slot extending through a central portion of said intermediate circuit and said nonpolymer layer, the slot aligned with the at least one electrical contact site of the integrated circuit; wherein said at least one centrally disposed electrical contact site of the IC is electrically coupled to at least one electrical interconnect of said intermediate circuit by a conductive feature selected from the group consisting of wire bonding and thermocompression bonding.

Claim 14

An electronic package comprising: an integrated circuit having at least one electrical contact site centrally disposed on a first side of the integrated circuit; a flexible intermediate circuit including an array of electrical interconnects; at least one nonpolymer layer having first and second sides, said first side of said nonpolymer layer being structurally coupled to said first side of said integrated circuit, and said second side of said nonpolymer layer being structurally coupled to a mounting layer having first and second sides, said first side of said mounting layer being structurally coupled to said second side of said nonpolymer layer, and said second side of said mounting layer being structurally coupled to said intermediate circuit wherein said mounting layer is a polyimide layer having a thickness of between about 25 μm and about 75 μm, and wherein said nonpolymer layer is a copper layer having a thickness of between about 1 μm and about 50 μm; a slot extending through a central portion of said intermediate circuit and said nonpolymer layer, the slot aligned with the at least one electrical contact site of the integrated circuit; wherein said at least one centrally disposed electrical contact site of the IC is electrically coupled to at least one electrical interconnect of said intermediate circuit by a conductive feature selected from the group consisting of wire bonding and thermocompression bonding.

Claim 15

The electronic package of claim 9 wherein said intermediate circuit has first and second sides, said first side of said intermediate circuit being structurally connected to said second side of said nonpolymer layer; and further comprising a plurality of solder balls or bumps electrically coupled to said intermediate circuit ; said plurality of solder balls or bumps being structurally coupled to said second side of said intermediate circuit.

Claim 16

An electronic package comprising: a flexible circuit including a patterned conductive layer and at least one patterned dielectric layer, each of said layers having a first side and a second side; a copper foil support structure having a thickness of between about 100 μm and about 250 μm, the support structure having first and second sides, said second side of said support structure being structurally coupled to said first side of said conductive layer of said flexible circuit; a semiconductor device having a first side structurally coupled to said first side of said support structure, said semiconductor device including a plurality of centrally located electrical contact sites; said contact sites being electrically coupled to said conductive layer of said flexible circuit.

Claim 17

An electronic package comprising: a flexible circuit including a patterned conductive layer and at least one patterned dielectric layer, each of said layers having a first side and a second side; a copper foil support structure having a thickness of between about 100 μm and about 250 μm, the support structure having first and second sides, said second side of said support structure being structurally coupled to said first side of said conductive layer of said flexible circuit; a semiconductor device having a first side structurally coupled to said first side of said support structure, said semiconductor device including a plurality of centrally located electrical contact sites; said contact sites being electrically coupled to said conductive layer of said flexible circuit.

Claim 18

An electronic package according to claim 11 wherein said conductive layer is patterned to form an electrically conductive region, wherein said dielectric layer is patterned to form a plurality of openings extending through said dielectric layer, each of said openings being configured to receive a solder ball, and wherein said second side of said conductive layer is joined to said first side of said dielectric layer so that said plurality of openings in said dielectric layer are aligned with at least part of said electrically conductive region of said conductive layer.

Claim 19

The electronic package of claim 11, further comprising a plurality of solder balls or bumps disposed on said second side of said dielectric layer of said flexible tape, each of said solder balls or bumps being positioned in one of said plurality of openings in said dielectric layer and being electrically connected to said conductive region of said conductive layer of said flexible circuit.