US6319829B1
Expired / Lapsed
US
⏱️ 0.0 years remaining
Enhanced interconnection to ceramic substrates
Assignee: International Business Machines Corp
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Filing: 1999-08-18
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Granted: 2001-11-20
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Expires: 2019-08-18
Abstract
Abstract A semiconductor chip interposer increases fatigue life of interconnections between a first component having a relatively high thermal coefficient of expansion (TCE) and a second component having a relatively low TCE. The semiconductor chip interposer includes a thin metal plate having a plurality of through holes, the thin metal plate having a TCE intermediate the relatively high TCE and the relatively low TCE. An insulation coating on the thin metal plate is also included on walls of the through holes. An electrical conductive material fills each of the insulated through holes for electrical interconnection between the first component and the second component.
Inventors
- 👤 Robert W. Pasco
- 👤 Srinivasa S. N. Reddy
- 👤 Rao V. Vallabhaneni
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 19:35
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/60; H10W70/62; H10W70/63; H10W70/635; H05; H05K; H05K3/00; H05K3/30; H05K3/32; H05K3/34; H05K3/341; H05K3/3431; H05K3/3436; H05K1/00; H05K1/02; H05K1/14; H05K1/141; H05K2201/00; H05K2201/06; H05K2201/068; H05K2201/10; H05K2201/10227; H05K2201/10378; H10W90/00; H10W90/701; H10W90/721; H10W90/724; Y; Y02; Y02P; Y02P70/00; Y02P70/50
Claims Analysis
Total Claims: 13
Claim 1
Independent Claim
102 words
A semiconductor chip interposer for increasing fatigue life of interconnections between a first component having a relatively high thermal coefficient of expansion (TCE) and a second component having a relatively low TCE, comprising: a thin substrate having a TCE intermediate the relatively high TCE and the relatively low TCE and a plurality of through holes that are electrically insulated from one another, wherein the substrate is a thin metal plate having a thickness in the range of 2-8 mil; and an electrical conductive material filling each of the insulated through holes for electrical interconnection between the first component and the second component.
Claim 2
Dependent Claim
102 words
A semiconductor chip interposer for increasing fatigue life of interconnections between a first component having a relatively high thermal coefficient of expansion (TCE) and a second component having a relatively low TCE, comprising: a thin substrate having a TCE intermediate the relatively high TCE and the relatively low TCE and a plurality of through holes that are electrically insulated from one another, wherein the substrate is a thin metal plate having a thickness in the range of 2-8 mil; and an electrical conductive material filling each of the insulated through holes for electrical interconnection between the first component and the second component.
Claim 3
Dependent Claim
24 words
The interposer of claim 1 wherein the substrate includes an insulation coating on said thin metal plate including on walls of the through holes.
Claim 4
Dependent Claim
13 words
The interposer of claim 2 wherein the insulation coating comprises an oxide coating.
Claim 5
Dependent Claim
98 words
A semiconductor chip interposer for increasing fatigue life of interconnections between a first component having a relatively high thermal coefficient of expansion (TCE) and a second component having a relatively low TCE, comprising: a thin metal plate having a plurality of through holes, the thin metal plate having a TCE intermediate the relatively high TCE and the relatively low TCE; an insulation coating on said thin metal plate including on walls of the through holes; and an electrical conductive material filling each of the insulated through holes for electrical interconnection between the first component and the second component.
Claim 6
Dependent Claim
98 words
A semiconductor chip interposer for increasing fatigue life of interconnections between a first component having a relatively high thermal coefficient of expansion (TCE) and a second component having a relatively low TCE, comprising: a thin metal plate having a plurality of through holes, the thin metal plate having a TCE intermediate the relatively high TCE and the relatively low TCE; an insulation coating on said thin metal plate including on walls of the through holes; and an electrical conductive material filling each of the insulated through holes for electrical interconnection between the first component and the second component.
Claim 7
Dependent Claim
23 words
The interposer of claim 4 wherein the thin metal plate is a metal foil having a thickness in the range of 2-8 mil.
Claim 8
Dependent Claim
13 words
The interposer of claim 4 wherein the insulation coating comprises an oxide coating.
Claim 9
Dependent Claim
19 words
The interposer of claim 4 wherein the chip comprises a multi-chip module and the interposer comprises a segmented interposer.
Claim 10
Dependent Claim
23 words
The interposer of claim 4 further comprising conductive I/O pads on either side of the through openings electrically connected to the conductive material.
Claim 11
Dependent Claim
35 words
The interposer of claim 8 wherein the second component is a glass-ceramic substrate having I/O pads and the interposer is joined to the substrate by co-sintering the substrate I/O pads and the interposer I/O pads.
Claim 12
Dependent Claim
19 words
The interposer of claim 8 further comprising conductive pins brazed to I/O pads on one side of the interposer.
Claim 13
Dependent Claim
43 words
The interposer of claim 10 wherein the second component is a glass-ceramic substrate having I/O pads and the interposer is joined to the substrate by co-sintering using the substrate I/O pads and the interposer I/O pads to provide a glass-ceramic pin grid array.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2004-11-19 | 2005-05-21 | 2005-11-20 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2008-11-19 | 2009-05-21 | 2009-11-20 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2012-11-19 | 2013-05-21 | 2013-11-20 | $7700.00 | Window Closed / Lapsed |