US6184064B1
Expired / Lapsed
US
⏱️ 0.0 years remaining
Semiconductor die back side surface and method of fabrication
Assignee: Micron Technology Inc
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Filing: 2000-01-12
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Granted: 2001-02-06
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Expires: 2020-01-12
Abstract
Abstract A method of physically altering the backside surface of a semiconductor wafer or other substrate, and resulting article, to improve adhesion between the backside surface of semiconductor dice singulated from the wafer and a die attach adhesive or encapsulation compound. The physically altered backside surface reduces or substantially eliminates delamination and cracking damage in a semiconductor die assembly due to semiconductor wafer tape contamination and subsequent moisture penetration. The physically altered backside surface further reduces both semiconductor wafer tape contamination and shear stress along the interface between the semiconductor die backside surface and the die attach adhesive or encapsulation compound.
Inventors
- 👤 Tongbi Jiang
- 👤 Chad A. Cobbley
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 13:29
CPC Classifications
H; H10; H10D; H10D62/00; H10D62/10; H10D62/117; H10W; H10W72/00; H10W72/071; H10W72/073; H10W72/07331; H10W72/07337; H10W72/30; H10W72/351; H10W72/353; H10W72/354; H10W72/851; H10W72/874; H10W72/884; H10W74/00; H10W74/10; H10W74/111; H10W74/127; H10W90/00; H10W90/701; H10W90/731; H10W90/734; H10W90/751; H10W90/754; Y; Y10; Y10S; Y10S438/00; Y10S438/964
Claims Analysis
Total Claims: 41
Claim 1
Independent Claim
50 words
A semiconductor component assembly, comprising: a semiconductor component comprising an active surface and a back side surface, said back side surface having a substantially non-planar texture wherein said substantially non-planar texture of the back side surface has a peak to valley amplitude measuring between about 5 μm and 25 μm.
Claim 2
Dependent Claim
50 words
A semiconductor component assembly, comprising: a semiconductor component comprising an active surface and a back side surface, said back side surface having a substantially non-planar texture wherein said substantially non-planar texture of the back side surface has a peak to valley amplitude measuring between about 5 μm and 25 μm.
Claim 3
Dependent Claim
16 words
The semiconductor component assembly of claim 1 , wherein said semiconductor component is a semiconductor wafer.
Claim 4
Dependent Claim
29 words
The semiconductor component assembly of claim 1 , wherein said semiconductor component is either a singulated semiconductor die or a partial wafer comprising a plurality of semiconductor die locations.
Claim 5
Dependent Claim
23 words
The semiconductor component assembly of claim 1 , wherein the substantially non-planar texture of the back side surface has a sinuate cross-sectional contour.
Claim 6
Dependent Claim
23 words
The semiconductor component assembly of claim 1 , wherein the substantially non-planar texture of the back side surface has a saw-tooth cross-sectional contour.
Claim 7
Dependent Claim
23 words
The semiconductor component assembly of claim 1 , wherein the substantially non-planar texture of the back side surface has a square cross-sectional contour.
Claim 8
Dependent Claim
25 words
The semiconductor component assembly of claim 1 , wherein the substantially non-planar texture of the back side surface has a contour of geometric cross-sectional configuration.
Claim 9
Dependent Claim
24 words
The semiconductor component assembly of claim 1 , wherein the substantially non-planar texture of the back side surface has cross-sectional contour of irregular configuration.
Claim 10
Dependent Claim
32 words
The semiconductor component assembly of claim 1 , wherein the substantially non-planar texture of the back side surface has a peak to peak amplitude measuring between about 5 μm and 25 μm.
Claim 11
Dependent Claim
32 words
The semiconductor component assembly of claim 1 , wherein the substantially non-planar texture of the back side surface has a valley to valley amplitude measuring between about 5 μm and 25 μm.
Claim 12
Dependent Claim
27 words
The semiconductor component assembly of claim 1 , wherein the substantially non-planar texture of the back side surface is formed of a plurality of substantially concentric circles.
Claim 13
Dependent Claim
29 words
The semiconductor component assembly of claim 1 , wherein the substantially non-planar texture of the back side surface is formed in a pattern of wedges about a central point.
Claim 14
Dependent Claim
28 words
The semiconductor component assembly of claim 1 , wherein the substantially non-planar texture of the back side surface is formed in a pattern comprising a plurality of rectangles.
Claim 15
Dependent Claim
28 words
The semiconductor component assembly of claim 13 , wherein the substantially non-planar texture of the back side surface is formed in a pattern comprising a plurality of squares.
Claim 16
Dependent Claim
24 words
The semiconductor component assembly of claim 1 , wherein the substantially non-planar texture of the back side surface is formed in a spiral pattern.
Claim 17
Dependent Claim
24 words
The semiconductor component assembly of claim 1 , wherein the substantially non-planar texture of the back side surface is formed in a geometric pattern.
Claim 18
Dependent Claim
31 words
The semiconductor component assembly of claim 1 , further comprising an encapsulant adhered to the back side surface in substantial conformity with the substantially non-planar texture of the back side surface.
Claim 19
Dependent Claim
56 words
The semiconductor component assembly of claim 1 , further comprising: a carrier substrate; and a die attach adhesive positioned between the back side surface of said semiconductor component and said carrier substrate, said die attach adhesive being adhered to the substantially non-planar texture of the back side surface of said semiconductor component in substantial conformity therewith.
Claim 20
Dependent Claim
13 words
The semiconductor assembly of claim 18 , wherein said carrier substrate is ceramic.
Claim 21
Dependent Claim
13 words
The semiconductor assembly of claim 18 , wherein said carrier substrate is metallic.
Claim 22
Dependent Claim
13 words
The semiconductor assembly of claim 18 , wherein said semiconductor substrate is organic.
Claim 23
Dependent Claim
52 words
A semiconductor component assembly, comprising: at least a portion of a semiconductor wafer including an active surface and a back side surface, said back side surface having a substantially non-planar texture; and wafer tape attached intermittently to portions of the back side of said at least a portion of said semiconductor wafer.
Claim 24
Dependent Claim
52 words
A semiconductor component assembly, comprising: at least a portion of a semiconductor wafer including an active surface and a back side surface, said back side surface having a substantially non-planar texture; and wafer tape attached intermittently to portions of the back side of said at least a portion of said semiconductor wafer.
Claim 25
Dependent Claim
49 words
A semiconductor component assembly comprising: a plurality of singulated semiconductor dice each including an active surface and a back side surface, said back side surface having a substantially non-planar texture; and wafer tape attached intermittently to portions of the back side surface of said plurality of singulated semiconductor dice.
Claim 26
Dependent Claim
49 words
A semiconductor component assembly comprising: a plurality of singulated semiconductor dice each including an active surface and a back side surface, said back side surface having a substantially non-planar texture; and wafer tape attached intermittently to portions of the back side surface of said plurality of singulated semiconductor dice.
Claim 27
Independent Claim
61 words
A method of fabricating a semiconductor component comprising: providing a semiconductor component having an active surface and a back side surface; and texturing the back side surface of said semiconductor component to create a substantially non-planar surface over the back side surface wherein said substantially non-planar surface has a peak to valley amplitude measuring between about 5 μm and 25 μm.
Claim 28
Independent Claim
61 words
A method of fabricating a semiconductor component comprising: providing a semiconductor component having an active surface and a back side surface; and texturing the back side surface of said semiconductor component to create a substantially non-planar surface over the back side surface wherein said substantially non-planar surface has a peak to valley amplitude measuring between about 5 μm and 25 μm.
Claim 29
Dependent Claim
16 words
The method of claim 24 , further comprising providing the semiconductor component as a semiconductor wafer.
Claim 30
Dependent Claim
19 words
The method of claim 24 , further comprising providing the semiconductor component as a portion of a semiconductor wafer.
Claim 31
Dependent Claim
20 words
The method of claim 24 , further comprising providing the semiconductor component with a plurality of semiconductor die locations thereon.
Claim 32
Dependent Claim
21 words
The method of claim 24 , wherein texturing the back side surface further comprises grinding or scribing the back side surface.
Claim 33
Dependent Claim
22 words
The method of claim 24 , wherein texturing the back side surface further comprises selectively masking and etching the back side surface.
Claim 34
Dependent Claim
31 words
The method of claim 24 , wherein texturing the back side surface includes creating said substantially non-planar surface having a peak to peak amplitude between about 5 μm and 25 μm.
Claim 35
Dependent Claim
30 words
The method of claim 24 , wherein texturing the back side surface includes creating said substantially non-planar surface having a valley to valley amplitude between 5 μm and 25 μm.
Claim 36
Dependent Claim
34 words
The method of claim 24 , further comprising singulating the semiconductor component to define a plurality of individual semiconductor dice, each having a portion of the substantially non-planar surface on a back side thereof.
Claim 37
Dependent Claim
43 words
The method of claim 32 , further comprising attaching at least some of the individual semiconductor dice by the back side thereof to a supporting structure with a die attach material in substantially continuous contact with said portion of said substantially non-planar surface.
Claim 38
Dependent Claim
37 words
The method of claim 32 , further comprising at least partially encapsulating at least some of the individual semiconductor dice with an encapsulant compound disposed in substantially continuous contact with said portion of said substantially non-planar surface.
Claim 39
Dependent Claim
22 words
The method of claim 24 , wherein texturing the back side surface comprises forming a predetermined pattern in the back side surface.
Claim 40
Dependent Claim
20 words
The method of claim 35 , further comprising defining the predetermined pattern in a form of peaks and intervening valleys.
Claim 41
Dependent Claim
22 words
The method of claim 24 , further comprising intermittently adhering the back side surface of the semiconductor component to semiconductor wafer tape.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2004-02-06 | 2004-08-07 | 2005-02-06 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2008-02-06 | 2008-08-07 | 2009-02-06 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2012-02-06 | 2012-08-07 | 2013-02-06 | $7700.00 | Window Closed / Lapsed |