US5851664A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Semiconductor wafer processing adhesives and tapes
Assignee: 3M Co
•
Filing: 1997-06-03
•
Granted: 1998-12-22
•
Expires: 2017-06-03
Abstract
Abstract A semiconductor wafer processing tape comprises a permanent backing and a layer of a non-pressure sensitive adhesive comprising a thermoplastic elastomer block copolymer on the permanent backing. Optionally, the adhesive may include an adhesion modifier such as a tackifying resin, a liquid rubber or a photocrosslinking agent. The tapes are useful for both wafer grinding and wafer dicing applications. A method of processing semiconductor wafers is disclosed.
Inventors
- 👤 Richard E. Bennett
- 👤 Gerald C. Bird
- 👤 Mark K. Nestegard
- 👤 Eleanor Rudin
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 14:40
CPC Classifications
H; H10; H10P; H10P76/00; H10P72/00; H10P72/70; H10P72/74; H10P72/7402; H10P72/7416; Y; Y10; Y10T; Y10T428/00; Y10T428/28; Y10T428/2852; Y10T428/2857; Y10T428/2878; Y10T428/2883
Claims Analysis
Total Claims: 43
Claim 1
Independent Claim
57 words
A semiconductor wafer processing tape comprising a permanent backing and a layer of a non-pressure sensitive adhesive comprising a thermoplastic elastomer block copolymer on the permanent backing, wherein the adhesive has a storage modulus at room temperature greater than 3×10 5 Pascals and wherein the tape attaches to a surface of a semiconductor wafer under ambient conditions.
Claim 2
Dependent Claim
57 words
A semiconductor wafer processing tape comprising a permanent backing and a layer of a non-pressure sensitive adhesive comprising a thermoplastic elastomer block copolymer on the permanent backing, wherein the adhesive has a storage modulus at room temperature greater than 3×10 5 Pascals and wherein the tape attaches to a surface of a semiconductor wafer under ambient conditions.
Claim 3
Dependent Claim
26 words
A semiconductor wafer processing tape according to claim 1 wherein the storage modulus of the adhesive composition at room temperature is greater than 1×10 6 Pascals.
Claim 4
Dependent Claim
22 words
A semiconductor wafer processing tape according to claim 1 wherein the thermoplastic elastomer block copolymer comprises 15 to 25% by weight styrene.
Claim 5
Dependent Claim
20 words
A semiconductor wafer processing tape according to claim 1 wherein the thermoplastic elastomer block copolymer is a styrene-ethylene/propylene-styrene block copolymer.
Claim 6
Dependent Claim
20 words
A semiconductor wafer processing tape according to claim 1 wherein the thermoplastic elastomer block copolymer is a styrene-ethylene/propylene-styrene-ethylene/propylene block copolymer.
Claim 7
Dependent Claim
17 words
A semiconductor wafer processing tape according to claim 1 wherein the adhesive further comprises a tackifying resin.
Claim 8
Dependent Claim
38 words
A semiconductor wafer processing tape according to claim 6 wherein the tackifing resin is present in an amount of less than 10% by weight, based on the combined weight of the thermoplastic elastomer block copolymer and tackifying resin.
Claim 9
Dependent Claim
39 words
A semiconductor wafer processing tape according to claim 7 wherein the tackifying resin is present in an amount of about 3 to 8% by weight, based on the combined weight of the thermoplastic elastomer block copolymer and tackifying resin.
Claim 10
Dependent Claim
17 words
A semiconductor wafer processing tape according to claim 1 wherein the adhesive further comprises a liquid rubber.
Claim 11
Dependent Claim
39 words
A semiconductor wafer processing tape according to claim 9 wherein the liquid rubber is present in an amount of less than 20% by weight, based on the combined weight of the thermoplastic elastomer block copolymer and the liquid rubber.
Claim 12
Dependent Claim
42 words
A semiconductor wafer processing tape according to claim 10 wherein the liquid rubber is present in an amount of about 5% to less than 20% by weight, based on the combined weight of the thermoplastic elastomer block copolymer and the liquid rubber.
Claim 13
Dependent Claim
21 words
A semiconductor wafer processing tape according to claim 1 further comprising a primer for bonding the adhesive to the permanent backing.
Claim 14
Dependent Claim
23 words
A semiconductor wafer processing tape according to claim 1 further comprising a temporary and removable protective liner on the exposed layer of adhesive.
Claim 15
Dependent Claim
27 words
A semiconductor wafer processing tape according to claim 13 wherein the temporary and removable protective liner is a polyester film that does not include a release agent.
Claim 16
Dependent Claim
20 words
A semiconductor wafer processing tape according to claim 1 further comprising a semiconductor wafer on the exposed layer of adhesive.
Claim 17
Dependent Claim
44 words
A semiconductor wafer processing tape according to claim 1 wherein the tape exhibits a peel adhesion of about 20 to 500 grams per linear inch width to a substrate selected from the group consisting of silicon, polyimide, silicon oxynitride passivation layer, and photoresist coatings.
Claim 18
Dependent Claim
48 words
A semiconductor wafer processing tape according to claim 16 wherein the tape exhibits a peel adhesion of about 20 to 200 grams per linear inch width to a substrate selected from the group consisting of silicon, integrated circuit polyimide passivation layer, silicon oxynitride passivation layer, and photoresist coatings.
Claim 19
Dependent Claim
41 words
A semiconductor wafer processing tape according to claim 16 wherein the tape exhibits a peel adhesion of about 20 to 500 grams per linear inch width after dwelling in contact with said substrate for at least 7 days under ambient conditions.
Claim 20
Dependent Claim
41 words
A semiconductor wafer processing tape according to claim 17 wherein the tape exhibits a peel adhesion of about 20 to 200 grams per linear inch width after dwelling in contact with said substrate for at least 7 days under ambient conditions.
Claim 21
Dependent Claim
79 words
A semiconductor wafer processing tape comprising a permanent backing and a layer of a non-pressure sensitive adhesive on the permanent backing, wherein the adhesive comprises a hydrogenated thermoplastic elastomer block copolymer, and an adhesion modifier selected from the group consisting of tackifying resin, liquid rubber, and a photocrosslinking agent, wherein the adhesive has a storage modulus at room temperature greater than 3×10 5 Pascals and wherein the tape attaches to a surface of a semiconductor wafer under ambient conditions.
Claim 22
Dependent Claim
79 words
A semiconductor wafer processing tape comprising a permanent backing and a layer of a non-pressure sensitive adhesive on the permanent backing, wherein the adhesive comprises a hydrogenated thermoplastic elastomer block copolymer, and an adhesion modifier selected from the group consisting of tackifying resin, liquid rubber, and a photocrosslinking agent, wherein the adhesive has a storage modulus at room temperature greater than 3×10 5 Pascals and wherein the tape attaches to a surface of a semiconductor wafer under ambient conditions.
Claim 23
Dependent Claim
44 words
A semiconductor wafer processing tape according to claim 20 wherein the adhesion modifier is a tackifying resin present in an amount of about 3 to 8% by weight, based on the combined weight of the hydrogenated thermoplastic elastomer block copolymer and the tackifying resin.
Claim 24
Dependent Claim
46 words
A semiconductor wafer processing tape according to claim 20 wherein the adhesion modifier is a liquid rubber present in an amount of about 5% to less than 20% by weight, based on the combined weight of the hydrogenated thermoplastic elastomer block copolymer and the liquid rubber.
Claim 25
Dependent Claim
48 words
A semiconductor wafer processing tape according to claim 20 wherein the tape exhibits a peel adhesion of about 20 to 200 grams per linear inch width to a substrate selected from the group consisting of silicon, integrated circuit polyimide passivation layer, silicon oxynitride passivation layer, and photoresist coatings.
Claim 26
Dependent Claim
41 words
A semiconductor wafer processing tape according to claim 23 wherein the tape exhibits a peel adhesion of about 20 to 200 grams per linear inch width after dwelling in contact with said substrate for at least 7 days under ambient conditions.
Claim 27
Dependent Claim
64 words
A semiconductor wafer processing tape comprising a permanent backing and a layer of a non-pressure sensitive adhesive on the permanent backing, wherein the adhesive comprises a thermoplastic elastomer block copolymer and a photocrosslinking agent, wherein the adhesive has a storage modulus at room temperature greater than 3×10 5 Pascals, and wherein the tape attaches to a surface of a semiconductor wafer under ambient conditions.
Claim 28
Dependent Claim
64 words
A semiconductor wafer processing tape comprising a permanent backing and a layer of a non-pressure sensitive adhesive on the permanent backing, wherein the adhesive comprises a thermoplastic elastomer block copolymer and a photocrosslinking agent, wherein the adhesive has a storage modulus at room temperature greater than 3×10 5 Pascals, and wherein the tape attaches to a surface of a semiconductor wafer under ambient conditions.
Claim 29
Dependent Claim
48 words
A semiconductor wafer processing tape according to claim 25 wherein the tape exhibits a peel adhesion of about 20 to 200 grams per linear inch width to a substrate selected from the group consisting of silicon, integrated circuit polyimide passivation layer, silicon oxynitride passivation layer, and photoresist coatings.
Claim 30
Dependent Claim
41 words
A semiconductor wafer processing tape according to claim 26 wherein the tape exhibits a peel adhesion of about 20 to 200 grams per linear inch width after dwelling in contact with said substrate for at least 7 days under ambient conditions.
Claim 31
Dependent Claim
61 words
A semiconductor wafer processing tape comprising a permanent backing and a layer of a non-pressure sensitive on a permanent backing, wherein the adhesive comprises a hydrogenated thermoplastic elastomer block copolymer that displays a storage modulus at 20 C. of 2.7×10 6 Pascals to 4.0×10 6 Pascals and wherein the tape attaches to a surface of a semiconductor wafer under ambient conditions.
Claim 32
Dependent Claim
61 words
A semiconductor wafer processing tape comprising a permanent backing and a layer of a non-pressure sensitive on a permanent backing, wherein the adhesive comprises a hydrogenated thermoplastic elastomer block copolymer that displays a storage modulus at 20 C. of 2.7×10 6 Pascals to 4.0×10 6 Pascals and wherein the tape attaches to a surface of a semiconductor wafer under ambient conditions.
Claim 33
Dependent Claim
21 words
A semiconductor wafer processing tape according to claim 28 wherein the hydrogenated thermoplastic elastomer block copolymer is a styrene-ethylene/propylene-styrene block copolymer.
Claim 34
Dependent Claim
21 words
A semiconductor wafer processing tape according to claim 28 wherein the hydrogenated thermoplastic elastomer block copolymer is a styrene-ethylene/propylene-styrene-ethylene/propylene block copolymer.
Claim 35
Dependent Claim
107 words
A semiconductor wafer processing tape comprising a permanent backing and a layer of a non-pressure sensitive adhesive on the permanent backing, wherein the adhesive has a storage modulus at room temperature greater than 1×10 6 Pascals and comprises a thermoplastic elastomer block copolymer, and further wherein the tape exhibits a peel adhesion of about 20 to 500 grams per linear inch width to a substrate selected from the group consisting of silicon, polyimide, silicon oxynitride passivation layer, and photoresist coatings both at the time of applying the tape to the substrate and after dwelling in contact with the substrate for at least 7 days under ambient conditions.
Claim 36
Dependent Claim
107 words
A semiconductor wafer processing tape comprising a permanent backing and a layer of a non-pressure sensitive adhesive on the permanent backing, wherein the adhesive has a storage modulus at room temperature greater than 1×10 6 Pascals and comprises a thermoplastic elastomer block copolymer, and further wherein the tape exhibits a peel adhesion of about 20 to 500 grams per linear inch width to a substrate selected from the group consisting of silicon, polyimide, silicon oxynitride passivation layer, and photoresist coatings both at the time of applying the tape to the substrate and after dwelling in contact with the substrate for at least 7 days under ambient conditions.
Claim 37
Dependent Claim
27 words
A semiconductor wafer processing tape according to claim 31 further comprising an adhesion modifier selected from the group consisting of tackifying resin, liquid rubber and photocrosslinking agent.
Claim 38
Dependent Claim
21 words
A semiconductor wafer processing tape according to claim 31 wherein the thermoplastic elastomner block copolymer comprises blocks of styrene and ethylene/propylene.
Claim 39
Dependent Claim
94 words
A semiconductor wafer dicing tape comprising a permanent backing and a layer of a non-pressure sensitive adhesive on the permanent backing, wherein the adhesive has a storage modulus at room temperature greater than 1×10 6 Pascals and comprises a thermoplastic elastomer block copolymer, and further wherein the tape exhibits a peel adhesion of about 20 to 200 grams per linear inch width to the silicon surface of a semiconductor wafer both at the time of applying the tape and after dwelling in contact with the substrate for at least 7 days under ambient conditions.
Claim 40
Dependent Claim
94 words
A semiconductor wafer dicing tape comprising a permanent backing and a layer of a non-pressure sensitive adhesive on the permanent backing, wherein the adhesive has a storage modulus at room temperature greater than 1×10 6 Pascals and comprises a thermoplastic elastomer block copolymer, and further wherein the tape exhibits a peel adhesion of about 20 to 200 grams per linear inch width to the silicon surface of a semiconductor wafer both at the time of applying the tape and after dwelling in contact with the substrate for at least 7 days under ambient conditions.
Claim 41
Dependent Claim
49 words
A semiconductor wafer dicing tape according to claim 34 wherein the peel adhesion at the time of applying the tape to the substrate and after dwelling in contact with the substrate for at least 15 days under ambient conditions is about 20 to 200 grams per linear inch width.
Claim 42
Dependent Claim
22 words
A semiconductor wafer dicing tape according to claim 26 wherein the permanent backing has a thickness of about 12 to 25 μm.
Claim 43
Dependent Claim
27 words
A semiconductor wafer dicing tape according to claim 26 wherein the permanent backing has an elongation at break of about 120 to 165% in the machine direction.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2001-12-21 | 2002-06-22 | 2002-12-22 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2005-12-21 | 2006-06-22 | 2006-12-22 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2009-12-21 | 2010-06-22 | 2010-12-22 | $7700.00 | Window Closed / Lapsed |