EP0520515A2
Expired / Lapsed
EP
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Semiconductor wafer-securing adhesive tape
Assignee: Furukawa Electric Co Ltd
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Filing: 1992-06-29
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Granted: —
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Expires: 2012-06-29
Abstract
Abstract There is disclosed a semiconductor wafer-securing adhesive tape having a radiation-curable adhesive layer on one surface of a support film, wherein the support film is composed of a laminated film that comprises, as a center layer, a film comprising a specified styrene/ethylene/butene/styrene (SEBS) block-type copolymer or a specified styrene/ethylene/pentene/styrene (SEPS) block-type copolymer, and has a layer for adhesive coating laid, directly or through a bonding layer, on one surface of the center layer on the side where said radiation-curable adhesive layer is provided and has a transfer-preventing layer laid on the other surface of the center layer. There is also disclosed a semiconductor wafer-securing adhesive tape wherein the center layer of said semiconductor wafer-securing adhesive tape has a film comprising said SEBS block copolymer of SEPS block copolymer, ethylene/acrylate-type copolymer and/or amorphous poly α-olefin, and polyamide/polyether-type copolymer, in a specified composition ratio.
Inventors
- 👤 Koji Nakayama
- 👤 Kenji Mougi
- 👤 Eiji Shiramatsu
- 👤 Kazushige Iwamoto
- 👤 Shinichi Ishiwata
- 👤 Morikuni Hasebe
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-09 12:53
CPC Classifications
C; C08; C08L; C08L53/00; C08L53/02; C08L53/025; H; H10; H10P; H10P72/00; H10P72/70; H10P72/74; H10P72/7402; C09; C09J; C09J7/00; C09J7/20; C09J7/29; C09J2203/00; C09J2203/326; C09J2301/00; C09J2301/10; C09J2301/16; C09J2301/162; H10P72/7416
Claims Analysis
Total Claims: 10
Claim 1
Independent Claim
123 words
A semiconductor wafer-securing adhesive tape having a radiation-curable adhesive layer on one surface of a support film, wherein the support film is composed of a laminated film that comprises, as a center layer, a film comprising a styrene/ethylene/butene/styrene block-type copolymer having a styrene polymer block component (A) and an ethylene/butene copolymer block component (B), with the component (A) being 10 to 30 wt% of components (A) + (B), and having a weight-average molecular weight of 35,000 to 90,000; and has a layer for adhesive coating laid, directly or through a bonding layer, on one surface of the center layer on the side where said radiation-curable adhesive layer is provided and has a transfer-preventing layer laid on the other surface of the center layer.
Claim 2
Dependent Claim
123 words
A semiconductor wafer-securing adhesive tape having a radiation-curable adhesive layer on one surface of a support film, wherein the support film is composed of a laminated film that comprises, as a center layer, a film comprising a styrene/ethylene/pentene/styrene block-type copolymer having a styrene polymer block component (A) and an ethylene/pentene copolymer block component (C) with the component (A) being 10 to 30 wt% of components (A) + (C), and having a weight-average molecular weight of 150,000 to 500,000, and has a layer for adhesive coating laid, directly or through a bonding layer, on one surface of the center layer on the side where said radiation-curable adhesive layer is provided and has a transfer-preventing layer laid on the other surface of the center layer.
Claim 3
Dependent Claim
24 words
The semiconductor wafer-securing adhesive tape as claimed in claim 1, wherein the center layer is a film consisting essentially of said styrene/ethylene/butene/styrene block-type copolymer.
Claim 4
Dependent Claim
24 words
The semiconductor wafer-securing adhesive tape as claimed in claim 2, wherein the center layer is a film consisting essentially of said styrene/ethylene/pentene/styrene block-type copolymer.
Claim 5
Dependent Claim
40 words
The semiconductor wafer-securing adhesive tape as claimed in claim 1, wherein the center layer is a film that comprises said styrene/ethylene/butene/styrene block-type copolymer: 15 to 45 wt%, ethylene/acrylate-type copolymer: 15 to 80 wt%, and polyamide/polyether-type copolymer: 5 to 70 wt%.
Claim 6
Dependent Claim
40 words
The semiconductor wafer-securing adhesive tape as claimed in claim 2, wherein the center layer is a film that comprises said styrene/ethylene/pentene/styrene block-type copolymer: 15 to 45 wt%, ethylene/acrylate-type copolymer: 15 to 80 wt%, and polyamide/polyether-type copolymer: 5 to 70 wt%.
Claim 7
Dependent Claim
41 words
The semiconductor wafer-securing adhesive tape as claimed in claim 1, wherein the center layer is a film that comprises said styrene/ethylene/butene/styrene block-type copolymer: 15 to 45 wt%, amorphous poly α-olefin: 10 to 45 wt%, and polyamide/polyether-type copolymer: 20 to 70 wt%,
Claim 8
Dependent Claim
41 words
The semiconductor wafer-securing adhesive tape as claimed in claim 2, wherein the center layer is a film that comprises said styrene/ethylene/pentene/styrene block-type copolymer: 15 to 45 wt%, amorphous poly α-olefin: 10 to 45 wt%, and polyamide/polyether-type copolymer: 20 to 70 wt%.
Claim 9
Dependent Claim
47 words
The semiconductor wafer-securing adhesive tape as claimed in claim 1, wherein the center layer is a film that comprises said styrene/ethylene/butene/styrene block-type copolymer: 15 to 45 wt%, ethylene/acrylate-type copolymer: 15 to 50 wt%, amorphous poly α-olefin: 3 to 30 wt%, and polyamide/polyether-type copolymer: 20 to 70 wt%.
Claim 10
Dependent Claim
47 words
The semiconductor wafer-securing adhesive tape as claimed in claim 2, wherein the center layer is a film that comprises said styrene/ethylene/pentene/styrene block-type copolymer: 15 to 45 wt%, ethylene/acrylate-type copolymer: 15 to 50 wt%, amorphous poly α-olefin: 3 to 30 wt%, and polyamide/polyether-type copolymer: 20 to 70 wt%.
References Cited (Backward Citations)
No citation records indexed.
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