US5864174A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Semiconductor device having a die pad structure for preventing cracks in a molding resin
Assignee: Lapis Semiconductor Co Ltd
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Filing: 1996-10-24
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Granted: 1999-01-26
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Expires: 2016-10-24
Abstract
Abstract According to a typical invention of the inventions disclosed in the present application, a semiconductor chip with an electronic circuit formed therein is fixed to a die pad for a lead frame having projections formed on the back thereof, with an organic dies bonding agent. Pads on the semiconductor chip, and inner leads are respectively electrically connected to one another by metal thin lines. These portions are sealed with a molding resin. Further, each inner lead extends to the outside of the molding resin and is processed into gull-wing form for substrate mounting. Moreover, the inner lead is processed by soldering so that an external terminal is formed. Thus, since the projections are provided on the back of the die pad, the back of a packing material is brought into point contact with that of the die pad as compared with the conventional face-to-face contact. It is therefore possible to minimize the transfer of organic substances from the packing material. Further, since such transfer that a reduction in adhesive property occurs in the back of the die pad, is greatly reduced, the adhesiveness between the upper surface of the die pad and the molding resin is improved, whereby the resistance of SMD to the reflow is enhanced.
Inventors
- 👤 Shigeru Yamada
- 👤 Yasufumi Uchida
- 👤 Noriko Murakami
- 👤 Yoshinori Shizuno
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 13:49
CPC Classifications
H; H10; H10W; H10W40/00; H10W40/20; H10W40/22; H10W40/226; H10W40/228; H10W70/00; H10W70/40; H10W70/411; H10W70/464; H10W70/468; H10W70/60; H10W70/62; H10W70/63; H10W70/635; H10W74/00; H10W74/10; H10W74/111; H10W74/114; H10W76/00; H10W76/10; H10W76/12; H10W76/15; H10W76/153; H10W90/00; H10W90/701; H10W99/00; H10W72/00; H10W72/01; H10W72/012; H10W72/01221; H10W72/01225; H10W72/015; H10W72/01515; H10W72/071; H10W72/0711; H10W72/07141; H10W72/072; H10W72/07231; H10W72/07236; H10W72/07251; H10W72/073; H10W72/075; H10W72/07531; H10W72/07532; H10W72/07533; H10W72/20; H10W72/221; H10W72/225; H10W72/251; H10W72/253; H10W72/29; H10W72/50; H10W72/531; H10W72/536; H10W72/5363; H10W72/551; H10W72/552; H10W72/5522; H10W72/59; H10W72/851; H10W72/874; H10W72/884; H10W72/90; H10W72/931; H10W72/934; H10W90/731; H10W90/736; H10W90/751; H10W90/756
Claims Analysis
Total Claims: 11
Claim 1
Independent Claim
94 words
A semiconductor device, comprising: a lead frame having a die pad, said die pad having a first surface, and a second surface opposite to said first surface; a semiconductor chip mounted on said first surface of said die pad; a plurality of concave portions formed on said first surface of said die pad, and being formed in portions other than a mounting area of said semiconductor chip; a plurality of projections formed on said second surface of said die pad; and a molding resin for completely encapsulating said semiconductor chip and said die pad.
Claim 2
Dependent Claim
94 words
A semiconductor device, comprising: a lead frame having a die pad, said die pad having a first surface, and a second surface opposite to said first surface; a semiconductor chip mounted on said first surface of said die pad; a plurality of concave portions formed on said first surface of said die pad, and being formed in portions other than a mounting area of said semiconductor chip; a plurality of projections formed on said second surface of said die pad; and a molding resin for completely encapsulating said semiconductor chip and said die pad.
Claim 3
Dependent Claim
90 words
A semiconductor devices, comprising: a lead frame having a die pad, said die pad having a first surface, and a second surface opposite to said first surface; a semiconductor chip mounted on said first surface of said die pad; a groove formed on said first surface of said die pad; a convex, elongated ridge formed on said second surface of said die pad, wherein an apex of a cross section of said convex ridge is V-shaped; and a molding resin for completely encapsulating said semiconductor chip and said die pad.
Claim 4
Dependent Claim
90 words
A semiconductor devices, comprising: a lead frame having a die pad, said die pad having a first surface, and a second surface opposite to said first surface; a semiconductor chip mounted on said first surface of said die pad; a groove formed on said first surface of said die pad; a convex, elongated ridge formed on said second surface of said die pad, wherein an apex of a cross section of said convex ridge is V-shaped; and a molding resin for completely encapsulating said semiconductor chip and said die pad.
Claim 5
Dependent Claim
31 words
A semiconductor device as claimed in claim 3, wherein said groove is formed in portions other than a mounting area of said semiconductor chip along a side of said die pad.
Claim 6
Dependent Claim
50 words
A lead frame having a semiconductor chip mounted thereon, characterized in that a die pad has a cross section partially or wholly shaped in the form of a wave, wherein an apex of said form of a wave, corresponding at least to an upper surface of said die-pad, is V-shaped.
Claim 7
Dependent Claim
50 words
A lead frame having a semiconductor chip mounted thereon, characterized in that a die pad has a cross section partially or wholly shaped in the form of a wave, wherein an apex of said form of a wave, corresponding at least to an upper surface of said die-pad, is V-shaped.
Claim 8
Dependent Claim
89 words
A semiconductor device, comprising: a lead frame having a die pad wherein said die pad has a first surface, and a second surface opposite to said first surface, said die pad further having a cross section in a form of a wave at least partially on said first and second surfaces of said die pad, wherein an apex of said cross section is V-shaped; a semiconductor chip mounted on said first surface of said die pad; and a molding resin for encapsulating said semiconductor chip and said die pad.
Claim 9
Dependent Claim
89 words
A semiconductor device, comprising: a lead frame having a die pad wherein said die pad has a first surface, and a second surface opposite to said first surface, said die pad further having a cross section in a form of a wave at least partially on said first and second surfaces of said die pad, wherein an apex of said cross section is V-shaped; a semiconductor chip mounted on said first surface of said die pad; and a molding resin for encapsulating said semiconductor chip and said die pad.
Claim 10
Dependent Claim
103 words
A semiconductor device, comprising: a lead frame having a die pad, said die pad having a first surface, and a second surface opposite to said first surface; a semiconductor chip mounted on said first surface of said die pad; a groove formed only on portions of said first surface of said die pad, said portions being other than a mounting area of said semiconductor chip; a convex ridge formed on said second surface of said die pad and corresponding to said groove, and being along a side of said die pad; and a molding resin for encapsulating said semiconductor chip and said pad.
Claim 11
Dependent Claim
103 words
A semiconductor device, comprising: a lead frame having a die pad, said die pad having a first surface, and a second surface opposite to said first surface; a semiconductor chip mounted on said first surface of said die pad; a groove formed only on portions of said first surface of said die pad, said portions being other than a mounting area of said semiconductor chip; a convex ridge formed on said second surface of said die pad and corresponding to said groove, and being along a side of said die pad; and a molding resin for encapsulating said semiconductor chip and said pad.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2002-01-25 | 2002-07-27 | 2003-01-26 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2006-01-25 | 2006-07-27 | 2007-01-26 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2010-01-25 | 2010-07-27 | 2011-01-26 | $7700.00 | Window Closed / Lapsed |