Resin-sealed semiconductor device

Abstract

Abstract PURPOSE:To prevent unnecessary sealing resin from flowing into the bottom of a resin substrate by forming resist on the bottom side of said resin substrate so that a contact electrode and an outer periphery of the bottom side of the resist alone may be exposed and controlling the flow of the sealing resin which molds the bottom side of the resin substrate by the outer periphery of the resist. CONSTITUTION:A lead electrode 33 is electrically connected with an electrode 32 on the rear side by way of a through hole electrode 34 which penetrates a resin substrate 31. A sheet-like resist 38 is mounted on the rear side of the resin substrate 31 so that only a part of the electrode 32 may be exposed. The exposed part of the electrode 32 is used as a contact electrode. A soldering ball is placed into the contact electrode 32 and arranged to reflow so that an electrode 37 maybe formed. Sealing resin 36 seals the top and the sides of the resin substrate 31 including an IC chip 35. The sealing resin is further filled up from the top of the resin substrate 31 into the through hole electrode 34, which enhances the adhesion between the sealing resin 36 and the resin substrate 31.

Inventors

• 👤 Masayuki Oi
• 👤 大井　政幸
• 👤 Isao Yabe
• 👤 功 矢部
• 👤 Hiroyuki Kaneko
• 👤 金子　博幸

Bibliographic Details