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US6137149A Expired / Lapsed US ⏱️ 0.0 years remaining

Semiconductor device having raised source-drains and method of fabricating the same

Assignee: NEC Electronics Corp
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Filing: 1997-06-27
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Granted: 2000-10-24
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Expires: 2017-06-27
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Abstract

Abstract There is provided a semiconductor device including (a) a semiconductor substrate, (b) a gate insulating film formed on the semiconductor substrate, (c) a gate electrode formed on the gate insulating film, (d) L-shaped insulating films each comprising a first portion vertically extending on a sidewall of the gate electrode, and a second portion horizontally extending on the semiconductor substrate, and (e) raised source and drain layers formed on the semiconductor substrate in selected areas so that the raised source and drain layers make contact only with an end surface of the second portion. In the semiconductor device, since the insulating films are formed L-shaped, it is possible to reduce an area at which the insulating films make contact with the raised source and drain layers when the raised source and drain layers are formed by selective epitaxial growth. This prevents formation of facets, resulting in improving fabrication yield of a semiconductor device.

Inventors

  • 👤 Noriyuki Kodama

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-11-09 06:31
CPC Classifications
H; H10; H10D; H10D30/00; H10D30/01; H10D30/021; H10D30/0223; H10D30/027; H10D30/0275; H10D64/00; H10D64/01; H10D64/021; H10D64/20; H10D64/23; H10D64/251; H10D64/258; H10D64/259

Claims Analysis

Total Claims: 10
Claim 1
Independent Claim 150 words
A semiconductor device comprising: (a) a semiconductor substrate; (b) a gate insulating film formed on said semiconductor substrate; (c) a gate electrode formed on said gate insulating film; (d) insulating films formed on a sidewall of said gate electrode, each of said insulating films being L-shaped wherein said L-shaped insulating film makes contact with an end facet of said gate insulating film; (e) raised source and drain layers formed on said semiconductor substrate in selected areas so that said raised source and drain layers make contact with a part of said insulating films, said raised source and drain layers having a side surface and a top surface; and (f) a second insulating film formed on said insulating film, said second insulating film being in contact with said side surface of said raised source and drain layers, wherein said side surface is one of a (110) plane and a (111) plane.
Claim 2
Dependent Claim 150 words
A semiconductor device comprising: (a) a semiconductor substrate; (b) a gate insulating film formed on said semiconductor substrate; (c) a gate electrode formed on said gate insulating film; (d) insulating films formed on a sidewall of said gate electrode, each of said insulating films being L-shaped wherein said L-shaped insulating film makes contact with an end facet of said gate insulating film; (e) raised source and drain layers formed on said semiconductor substrate in selected areas so that said raised source and drain layers make contact with a part of said insulating films, said raised source and drain layers having a side surface and a top surface; and (f) a second insulating film formed on said insulating film, said second insulating film being in contact with said side surface of said raised source and drain layers, wherein said side surface is one of a (110) plane and a (111) plane.
Claim 3
Dependent Claim 19 words
The semiconductor device as set forth in claim 1, wherein said sidewall insulating films are made of silicon nitride.
Claim 4
Dependent Claim 163 words
A semiconductor device comprising: (a) a semiconductor substrate; (b) a gate insulating film formed on said semiconductor substrate; (c) a gate electrode formed on said gate insulating film; (d) L-shaped insulating films each comprising a first portion vertically extending on a sidewall of said gate electrode, and a second portion horizontally extending on said semiconductor substrate wherein said L-shaped insulating film makes contact with an end facet of said gate insulating film; (e) raised source and drain layers formed on said semiconductor substrate in selected areas so that said raised source and drain layers make contact only with an end surface of said second portion, said raised source and drain layers having a side surface and a top surface; and (f) a second insulating film formed on said L-shaped insulating film, said second insulating film being in contact with said side surface of said raised source and drain layers, wherein said side surface is one of a (110) plane and a (111) plane.
Claim 5
Dependent Claim 163 words
A semiconductor device comprising: (a) a semiconductor substrate; (b) a gate insulating film formed on said semiconductor substrate; (c) a gate electrode formed on said gate insulating film; (d) L-shaped insulating films each comprising a first portion vertically extending on a sidewall of said gate electrode, and a second portion horizontally extending on said semiconductor substrate wherein said L-shaped insulating film makes contact with an end facet of said gate insulating film; (e) raised source and drain layers formed on said semiconductor substrate in selected areas so that said raised source and drain layers make contact only with an end surface of said second portion, said raised source and drain layers having a side surface and a top surface; and (f) a second insulating film formed on said L-shaped insulating film, said second insulating film being in contact with said side surface of said raised source and drain layers, wherein said side surface is one of a (110) plane and a (111) plane.
Claim 6
Dependent Claim 19 words
The semiconductor device as set forth in claim 3, wherein said sidewall insulating films are made of silicon nitride.
Claim 7
Dependent Claim 22 words
The semiconductor device as set forth in claim 3, wherein said second portion has a thickness of not more than 5 nm.
Claim 8
Dependent Claim 139 words
A semiconductor device comprising: (a) a semiconductor substrate; (b) a gate insulating film formed on said semiconductor substrate; (c) a gate electrode formed on said gate insulating film; (d) L-shaped insulating films each comprising a first portion vertically extending on a sidewall of said gate electrode, and a second portion horizontally extending on said semiconductor substrate; (e) raised source and drain layers formed on said semiconductor substrate in selected areas so that said raised source and drain layers make contact with an upper surface and an end surface of said second portion, said raised source and drain layers having an obliquely slanted side surface and a horizontal top surface; and (f) a second insulating film formed on said L-shaped insulating film, said second insulating film being in contact with said side surface of said raised source and drain layers.
Claim 9
Dependent Claim 139 words
A semiconductor device comprising: (a) a semiconductor substrate; (b) a gate insulating film formed on said semiconductor substrate; (c) a gate electrode formed on said gate insulating film; (d) L-shaped insulating films each comprising a first portion vertically extending on a sidewall of said gate electrode, and a second portion horizontally extending on said semiconductor substrate; (e) raised source and drain layers formed on said semiconductor substrate in selected areas so that said raised source and drain layers make contact with an upper surface and an end surface of said second portion, said raised source and drain layers having an obliquely slanted side surface and a horizontal top surface; and (f) a second insulating film formed on said L-shaped insulating film, said second insulating film being in contact with said side surface of said raised source and drain layers.
Claim 10
Dependent Claim 30 words
The semiconductor device as set forth in claim 6, wherein said raised source and drain layers make contact with only a part of said upper surface of said second portion.

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 2003-10-24 2004-04-24 2004-10-24 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 2007-10-24 2008-04-24 2008-10-24 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 2011-10-24 2012-04-24 2012-10-24 $7700.00 Window Closed / Lapsed

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