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JPH0722338A Expired / Lapsed JP ⏱️ 0.0 years remaining

Semiconductor device and manufacturing method thereof

Assignee: Sharp Corp
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Filing: 1993-07-05
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Granted: —
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Expires: 2013-07-05
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Abstract

Abstract Translated from Japanese (57)【要約】 【目的】 簡単にトランジスタのソース、ドレイン領域 に単結晶シリコン膜を積み上げる。 【構成】 LPCVD法により、大気中にさらさずに活 性領域107の酸化膜106を除去し、半導体基板10 1表面を露出し、酸化膜上でアモルファスシリコン膜が 成長する条件で単結晶シリコン膜108をエピタキシャ ル成長させる。 【効果】 比較的低温でかつ簡単にトランジスタのソー ス、ドレイン領域に単結晶シリコン膜を形成することが でき、トランジスタの短チャンネル効果を抑制すること ができる。 (57) [Abstract] [Purpose] A single crystal silicon film is simply stacked on the source and drain regions of a transistor. The oxide film 106 in the active region 107 is removed by the LPCVD method without exposing the semiconductor substrate 10 to the atmosphere. 1 The surface is exposed, and the single crystal silicon film 108 is epitaxially grown under the condition that the amorphous silicon film is grown on the oxide film. [Effects] A single crystal silicon film can be easily formed in the source and drain regions of a transistor at a relatively low temperature, and the short channel effect of the transistor can be suppressed.

Inventors

  • 👤 Hiroshi Kotaki
  • 👤 浩 小瀧
  • 👤 Seizo Kakimoto
  • 👤 誠三 柿本
  • 👤 Masayuki Nakano
  • 👤 雅行 中野

Bibliographic Details

Application Number —
Jurisdiction JP
Data Source google_patents
Last Synchronized 2026-11-09 04:30
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