Patent US6126428A successfully refreshed from Google Patents.
US6126428A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Vacuum dispense apparatus for dispensing an encapsulant
Assignee: Adeia Semiconductor Solutions LLC
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Filing: 1999-01-08
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Granted: 2000-10-03
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Expires: 2019-01-08
Abstract
Abstract A microelectronic assembly such as an assembly of a semiconductor chip and mounting substrate is encapsulated by applying an encapsulant to the assembly while maintaining the assembly under a subatmospheric pressure to minimize gas entrapment in the encapsulant. After the encapsulant flow around the assembly, a higher pressure is applied, causing collapse of any voids in the encapsulant. The encapsulant is then cured. The apparatus used for such encapsulation may include a chamber and a dispenser having a nozzle disposed within the chamber, and may also include a device for moving the nozzle or the assembly relative to the chamber.
Inventors
- 👤 Craig S. Mitchell
- 👤 Thomas H. DiStefano
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-08 19:31
CPC Classifications
H; H10; H10W; H10W74/00; H10W74/01; H10W70/00; H10W70/60; H10W70/62; H10W70/63; H10W70/635; H10W70/67; H10W70/688; H10W72/00; H10W74/012; H10W74/10; H10W74/15; H10W90/00; H10W90/701; H05; H05K; H05K2201/00; H05K2201/01; H05K2201/0104; H05K2201/0133; H10W70/65; H10W70/654; H10W70/655; H10W72/071; H10W72/0711; H10W72/07141; H10W72/07173; H10W72/072; H10W72/07231; H10W72/07236; H10W72/07251; H10W72/073; H10W72/07321; H10W72/07327; H10W72/07331; H10W72/07337; H10W72/07338; H10W72/075; H10W72/20; H10W72/851; H10W72/853; H10W72/856; H10W72/90; H10W72/941; H10W72/9415; H10W72/951; H10W90/721; H10W90/724; H10W90/731; H10W90/734; H10W90/751; H10W90/754
Claims Analysis
Total Claims: 10
Claim 1
Independent Claim
60 words
Apparatus for encapsulating microelectronic elements comprising: (a) a chamber; (b) a dispenser including a source of an encapsulant and a nozzle disposed within the chamber so that the dispenser can apply encapsulant to one or more semiconductor assemblies disposed within the chamber; (c) means for maintaining the chamber under a subatmospheric pressure while the dispenser applies encapsulant to semiconductor assemblies.
Claim 2
Dependent Claim
60 words
Apparatus for encapsulating microelectronic elements comprising: (a) a chamber; (b) a dispenser including a source of an encapsulant and a nozzle disposed within the chamber so that the dispenser can apply encapsulant to one or more semiconductor assemblies disposed within the chamber; (c) means for maintaining the chamber under a subatmospheric pressure while the dispenser applies encapsulant to semiconductor assemblies.
Claim 3
Dependent Claim
24 words
Apparatus as claimed in claim 1 further comprising means for moving the nozzle relative to one or more microelectronic assemblies disposed within the chamber.
Claim 4
Dependent Claim
21 words
Apparatus as claimed in claim 2 wherein said means for moving includes means for moving the nozzle relative to the chamber.
Claim 5
Dependent Claim
22 words
Apparatus as claimed in claim 2 wherein said means for moving includes means for moving the microelectronic assemblies relative to the chamber.
Claim 6
Dependent Claim
30 words
Apparatus as claimed in claim 2 wherein said means for moving is operative to move the nozzle along edges of microelectronic elements incorporated in said one or more microelectronic assemblies.
Claim 7
Dependent Claim
66 words
Apparatus as claimed in claim 1 further comprising a vacuum chuck for holding microelectronic assemblies, said vacuum chuck having a holding surface and suction passages opening to said holding surface, the apparatus further comprising suction source for maintaining a holding pressure less than said subatmospheric pressure in said suction passages to thereby hold microelectronic elements against said holding surface under the influence of said subatmospheric pressure.
Claim 8
Dependent Claim
23 words
Apparatus as claimed in claim 1 further comprising means for advancing microelectronic assemblies into said chamber and removing microelectronic assemblies from said chamber.
Claim 9
Dependent Claim
23 words
Apparatus as claimed in claim 1 further comprising means for applying a superatmospheric pressure in said chamber after application of said subatmospheric pressure.
Claim 10
Dependent Claim
34 words
Apparatus as claimed in claim 1 further comprising a pressure vessel, means for applying a superatmospheric pressure in said pressure vessel and means for transferring microelectronic assemblies from said chamber to said pressure vessel.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2003-10-03 | 2004-04-03 | 2004-10-03 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2007-10-03 | 2008-04-03 | 2008-10-03 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2011-10-03 | 2012-04-03 | 2012-10-03 | $7700.00 | Window Closed / Lapsed |