US4816896A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Compliant standoff for semiconductor packages
Assignee: Motorola Solutions Inc
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Filing: 1988-02-01
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Granted: 1989-03-28
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Expires: 2008-02-01
Abstract
Abstract Described herein is a standoff for use with semiconductor packages to prevent chipping. The standoff is designed to fit over a pin of the package and seat on the package surface with a portion extending over the corner of the package.
Inventors
- 👤 Norman L. Owens
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-08 19:41
CPC Classifications
H; H10; H10P; H10P72/00; H10P72/04; H10P72/0438; H04; H04N; H04N7/00; H04N7/01; H04N7/0125; H05; H05K; H05K7/00; H05K7/02
Claims Analysis
Total Claims: 23
Claim 1
Independent Claim
81 words
A standoff for use with a semiconductor package, said standoff comprising: a first portion being disposed about a pin of a first semiconductor package, said first portion having a first surface disposed partly against a first surface of said first semiconductor package and a second surface opposite said first surface; and a second portion being disposed partly about a side of said first semiconductor package, said second portion having a first surface coupled to said first surface of said first portion
Claim 2
Dependent Claim
81 words
A standoff for use with a semiconductor package, said standoff comprising: a first portion being disposed about a pin of a first semiconductor package, said first portion having a first surface disposed partly against a first surface of said first semiconductor package and a second surface opposite said first surface; and a second portion being disposed partly about a side of said first semiconductor package, said second portion having a first surface coupled to said first surface of said first portion
Claim 3
Dependent Claim
21 words
The standoff of claim 1 wherein said second portion is further disposed partly about a corner of said first semiconductor package.
Claim 4
Dependent Claim
88 words
The standoff of claim 1 further comprising; a third portion being disposed about a pin of a second semiconductor package, said third portion having a first surface disposed partly against a first surface of said second semiconductor package and a second surface opposite said first surface; a fourth portion being disposed partly about a side of said second semiconductor package, said fourth portion having a first surface coupled to said first surface of said third portion; and bridge means for coupling said second portion to said fourth portion.
Claim 5
Dependent Claim
88 words
The standoff of claim 1 further comprising; a third portion being disposed about a pin of a second semiconductor package, said third portion having a first surface disposed partly against a first surface of said second semiconductor package and a second surface opposite said first surface; a fourth portion being disposed partly about a side of said second semiconductor package, said fourth portion having a first surface coupled to said first surface of said third portion; and bridge means for coupling said first portion to said third portion.
Claim 6
Dependent Claim
13 words
The standoff of claim 1 wherein said standoff is further comprised of plastic.
Claim 7
Dependent Claim
13 words
The standoff of claim 1 wherein said standoff is further comprised of ceramic.
Claim 8
Dependent Claim
13 words
The standoff of claim 1 wherein said standoff is further comprised of silicone.
Claim 9
Dependent Claim
13 words
The standoff of claim 1 wherein said standoff is further comprised of glass.
Claim 10
Dependent Claim
83 words
A standoff for use on a semiconductor package, said standoff comprising: a first portion being disposed about a plurality of pins of a first semiconductor package, said first portion having a first surface disposed partly against a first surface of said first semiconductor package and a second surface opposite said first surface: and a second portion being disposed partly about a corner of said first semiconductor package, said second portion having a first surface coupled to said first surface of said first portion.
Claim 11
Dependent Claim
83 words
A standoff for use on a semiconductor package, said standoff comprising: a first portion being disposed about a plurality of pins of a first semiconductor package, said first portion having a first surface disposed partly against a first surface of said first semiconductor package and a second surface opposite said first surface: and a second portion being disposed partly about a corner of said first semiconductor package, said second portion having a first surface coupled to said first surface of said first portion.
Claim 12
Dependent Claim
90 words
The standoff of claim 9 further comprising; a third portion being disposed about a plurality of pins of a second semiconductor package, said third portion having a first surface disposed partly against a first surface of said second semiconductor package and a second surface opposite said first surface; a fourth portion being disposed partly about a corner of said second semiconductor package, said fourth portion having a first surface coupled to said first surface of said third portion; and bridge means for coupling said second portion to said fourth portion.
Claim 13
Dependent Claim
90 words
The standoff of claim 9 further comprising; a third portion being disposed about a plurality of pins of a second semiconductor package, said third portion having a first surface disposed partly against a first surface of said second semiconductor package and a second surface opposite said first surface; a fourth portion being disposed partly about a corner of said second semiconductor package, said fourth portion having a first surface coupled to said first surface of said third portion; and bridge means for coupling said first portion to said third portion.
Claim 14
Dependent Claim
13 words
The standoff of claim 9 wherein said standoff is further comprised of plastic.
Claim 15
Dependent Claim
13 words
The standoff of claim 9 wherein said standoff is further comprised of ceramic.
Claim 16
Dependent Claim
13 words
The standoff of claim 9 wherein said standoff is further comprised of silicone.
Claim 17
Dependent Claim
13 words
The standoff of claim 9 wherein said standoff is further comprised of glass.
Claim 18
Dependent Claim
177 words
A standoff for use on a semiconductor package, said standoff comprising: a first portion being disposed about a plurality of pins of a first semiconductor package, said first portion having a first surface disposed partly against a first surface of said first semiconductor package and a second surface opposite said first surface; a second portion being disposed partly about a corner of said first semiconductor package, said second portion having a first surface coupled to said first surface of said first portion; a third portion being disposed about a plurality of pins of a second semiconductor package, said third portion having a first surface disposed partly against a first surface of said second semiconductor package and a second surface opposite said first surface; a fourth portion being disposed partly about a corner of said second semiconductor package, said fourth portion having a first surface coupled to said first surface of said third portion; and bridge means for coupling at least one of said first or second portions to at least one of said third or fourth portions.
Claim 19
Dependent Claim
177 words
A standoff for use on a semiconductor package, said standoff comprising: a first portion being disposed about a plurality of pins of a first semiconductor package, said first portion having a first surface disposed partly against a first surface of said first semiconductor package and a second surface opposite said first surface; a second portion being disposed partly about a corner of said first semiconductor package, said second portion having a first surface coupled to said first surface of said first portion; a third portion being disposed about a plurality of pins of a second semiconductor package, said third portion having a first surface disposed partly against a first surface of said second semiconductor package and a second surface opposite said first surface; a fourth portion being disposed partly about a corner of said second semiconductor package, said fourth portion having a first surface coupled to said first surface of said third portion; and bridge means for coupling at least one of said first or second portions to at least one of said third or fourth portions.
Claim 20
Dependent Claim
13 words
The standoff of claim 16 wherein said standoff is further comprised of plastic.
Claim 21
Dependent Claim
13 words
The standoff of claim 16 wherein said standoff is further comprised of ceramic.
Claim 22
Dependent Claim
13 words
The standoff of claim 16 wherein said standoff is further comprised of silicone.
Claim 23
Dependent Claim
13 words
The standoff of claim 16 wherein said standoff is further comprised of glass.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1992-03-27 | 1992-09-26 | 1993-03-28 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1996-03-27 | 1996-09-26 | 1997-03-28 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2000-03-27 | 2000-09-26 | 2001-03-28 | $7700.00 | Window Closed / Lapsed |