Patent US4524292A successfully refreshed from Google Patents.
Patent US6117705A successfully refreshed from Google Patents.
US6117705A
Expired / Lapsed
US
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Method of making integrated circuit package having adhesive bead supporting planar lid above planar substrate
Assignee: Amkor Technology Singapore Holding Pte Ltd
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Filing: 1998-03-30
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Granted: 2000-09-12
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Expires: 2018-03-30
Abstract
Abstract A package for an integrated circuit is described, as are methods of making the package. The package includes a substrate having a generally planar first surface on which a metal die pad is formed. An integrated circuit die is attached to the metal die pad. An adhesive head surrounds the integrated circuit die and covers the exposed periphery of the metal die pad. A generally planar lid is in a press-fitted interconnection with the bead. An adhesive material covers conductive structures on the die, such as bonding pads, to prevent corrosion. Optionally, the package has vertical peripheral sides. The methods of making the package include methods for making packages individually, or making a plurality of packages simultaneously. Where a plurality of packages are made simultaneously, integrated circuit die are placed on each of a plurality of physically-joined package substrates on a generally planar sheet of substrate material. An adhesive bead is applied around each die. In cross-section, the bead has a central peak and a shorter peak on each side of the central peak. A sheet of lid material is placed onto the beads. After the bead is hardened, individual packages are formed by cutting the substrate sheet, lid sheet, and beads.
Inventors
- 👤 Thomas P. Glenn
- 👤 Roy D. Hollaway
- 👤 Anthony E. Panczak
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 18:24
CPC Classifications
G; G11; G11C; G11C16/00; G11C16/02; G11C16/06; G11C16/10; G11C16/18; H; H10; H10F; H10F77/00; H10F77/50; H10W; H10W76/00; H10W76/10; H10W76/12; H10W76/15; H10W76/153; H10W76/60; H10W40/00; H10W40/20; H10W40/22; H10W40/226; H10W40/228; H10W70/00; H10W70/60; H10W70/611; H10W72/00; H10W72/01; H10W72/015; H10W72/01515; H10W72/0198; H10W72/071; H10W72/075; H10W72/07531; H10W72/07532; H10W72/07533; H10W72/50; H10W72/531; H10W72/536; H10W72/541; H10W72/5449; H10W72/551; H10W72/552; H10W72/5522; H10W72/59; H10W72/851; H10W72/874; H10W72/884; H10W72/90; H10W72/951; H10W72/952; H10W90/00; H10W90/701; H10W90/731; H10W90/734; H10W90/751; H10W90/754
Claims Analysis
Total Claims: 41
Claim 1
Independent Claim
187 words
A method of making a package containing an integrated circuit die, the method comprising: providing an integrated circuit die having a perimeter; providing a planar substrate having a planar first surface, a metal die pad having a perimeter on the first surface of the substrate, and an electrically conductive path through the substrate; placing the integrated circuit die on the metal die pad, wherein the metal die pad extends laterally beyond the entire perimeter of the integrated circuit die; electrically connecting the integrated circuit die to the electrically conductive path through the substrate; applying a bead of a viscous first adhesive material onto the first surface of the substrate around the integrated circuit die, said adhesive bead covering a peripheral portion of the metal die pad around the metal die pad; providing a planar lid with a planar first surface; placing the planar first surface of said lid onto the bead around the die such that the planar first surface of the lid is supported above the planar first surface of the substrate and the integrated circuit die by the adhesive bead; and hardening the adhesive bead.
Claim 2
Independent Claim
187 words
A method of making a package containing an integrated circuit die, the method comprising: providing an integrated circuit die having a perimeter; providing a planar substrate having a planar first surface, a metal die pad having a perimeter on the first surface of the substrate, and an electrically conductive path through the substrate; placing the integrated circuit die on the metal die pad, wherein the metal die pad extends laterally beyond the entire perimeter of the integrated circuit die; electrically connecting the integrated circuit die to the electrically conductive path through the substrate; applying a bead of a viscous first adhesive material onto the first surface of the substrate around the integrated circuit die, said adhesive bead covering a peripheral portion of the metal die pad around the metal die pad; providing a planar lid with a planar first surface; placing the planar first surface of said lid onto the bead around the die such that the planar first surface of the lid is supported above the planar first surface of the substrate and the integrated circuit die by the adhesive bead; and hardening the adhesive bead.
Claim 3
Dependent Claim
68 words
The method of claim 1, wherein the integrated circuit has a first surface facing the planar first surface of the lid, and a first conductive structure on the first surface of the integrated circuit, said first conductive structure being electrically connected to the electrically conductive path; and the method further includes covering the first conductive structure with a viscous second adhesive material and hardening the second adhesive material.
Claim 4
Dependent Claim
57 words
The method of claim 1, wherein the lid includes a planar second surface opposite the planar first surface of the lid, and a peripheral edge between the first and second surfaces of the lid around the entire lid, and the method further includes pressing the lid and at least part of the edge into the adhesive bead.
Claim 5
Dependent Claim
64 words
The method of claim 1, wherein the integrated circuit has a first surface facing the planar first surface of the lid, and a first conductive structure on the first surface of the integrated circuit; and applying the bead of viscous adhesive material includes covering the first conductive structure and a peripheral portion of the first surface of the integrated circuit die with the bead.
Claim 6
Independent Claim
230 words
A method of making a plurality of integrated circuit packages each containing an integrated circuit die, the method comprising: providing a planar first sheet of an insulating material, said first sheet including a plurality of physically-joined package substrates, wherein each package substrate has a planar first surface in a common plane; placing an integrated circuit die on the planar first surface of each package substrate; electrically connecting each integrated circuit die to an electrically conductive path through the die's respective package substrate; applying a bead of an adhesive material onto the planar first surface of each package substrate of the first sheet around each integrated circuit die; providing a planar second sheet of a material for forming a lid for each package, said second sheet having a planar first surface and an area which is at least sufficient to cover the adhesive beads around the integrated circuit dies; placing the planar first surface of said second sheet onto the adhesive beads around the dies such that the planar first surface of the second sheet is supported above all of the planar first surfaces of the package substrates of the first sheet and all of the integrated circuit dies by the adhesive beads; hardening the adhesive beads around all of the integrated circuit dies; and separating individual packages each having a package substrate, an enclosed integrated circuit die, and a lid.
Claim 7
Independent Claim
230 words
A method of making a plurality of integrated circuit packages each containing an integrated circuit die, the method comprising: providing a planar first sheet of an insulating material, said first sheet including a plurality of physically-joined package substrates, wherein each package substrate has a planar first surface in a common plane; placing an integrated circuit die on the planar first surface of each package substrate; electrically connecting each integrated circuit die to an electrically conductive path through the die's respective package substrate; applying a bead of an adhesive material onto the planar first surface of each package substrate of the first sheet around each integrated circuit die; providing a planar second sheet of a material for forming a lid for each package, said second sheet having a planar first surface and an area which is at least sufficient to cover the adhesive beads around the integrated circuit dies; placing the planar first surface of said second sheet onto the adhesive beads around the dies such that the planar first surface of the second sheet is supported above all of the planar first surfaces of the package substrates of the first sheet and all of the integrated circuit dies by the adhesive beads; hardening the adhesive beads around all of the integrated circuit dies; and separating individual packages each having a package substrate, an enclosed integrated circuit die, and a lid.
Claim 8
Dependent Claim
49 words
The method of claim 5, wherein applying the bead of a viscous adhesive material includes applying a single bead of the viscous adhesive material between adjacent integrated circuit die of adjacent package substrates of the first sheet, and separating individual packages includes splitting the single bead between two packages.
Claim 9
Dependent Claim
17 words
The method of claim 6, wherein each package formed has vertical peripheral sides around the entire package.
Claim 10
Dependent Claim
28 words
The method of claim 7, wherein applying the bead of a viscous adhesive material includes forming a bead having a central first peak and two shorter second peaks.
Claim 11
Dependent Claim
28 words
The method of claim 1, wherein applying the bead of a viscous first adhesive material includes contacting a peripheral portion of the integrated circuit die with the bead.
Claim 12
Dependent Claim
32 words
The method of claim 1, wherein electrically connecting the integrated circuit die to the electrically conductive path includes connecting a bond wire to a first conductive structure on the integrated circuit die.
Claim 13
Dependent Claim
14 words
The method of claim 10, further comprising covering the bond wire with said bead.
Claim 14
Dependent Claim
23 words
The method of claim 10, further comprising covering the first conductive structure with a second adhesive material and hardening the second adhesive material.
Claim 15
Dependent Claim
15 words
The method of claim 11, further comprising forming vertical peripheral sides around the entire package.
Claim 16
Dependent Claim
27 words
The method of claim 1, wherein the lid is a one-piece structure and is formed of a material selected from the group of plastic, ceramic, and metal.
Claim 17
Dependent Claim
15 words
The method of claim 14, further comprising forming vertical peripheral sides around the entire package.
Claim 18
Dependent Claim
12 words
The method of claim 1, wherein the lid is a one-piece structure.
Claim 19
Dependent Claim
12 words
The method of claim 16, wherein the lid is transparent to light.
Claim 20
Dependent Claim
26 words
The method of claim 1, wherein said bead contacts the planar first surface of the lid, and does not cover a peripheral edge of the lid.
Claim 21
Dependent Claim
26 words
The method of claim 15, wherein said bead contacts the planar first surface of the lid, and does not cover a peripheral edge of the lid.
Claim 22
Dependent Claim
26 words
The method of claim 17, wherein said bead contacts the planar first surface of the lid, and does not cover a peripheral edge of the lid.
Claim 23
Dependent Claim
34 words
The method of claim 5, wherein applying the bead of adhesive material includes applying criss-crossing rows and columns of beads so that each integrated circuit die is surrounded by beads of the adhesive material.
Claim 24
Dependent Claim
14 words
The method of claim 5, wherein separating individual packages includes cutting with a saw.
Claim 25
Dependent Claim
17 words
The method of claim 5, wherein each package formed has vertical peripheral sides around the entire package.
Claim 26
Dependent Claim
23 words
The method of claim 5, wherein the second sheet is formed of a material selected from the group of plastic, ceramic, and metal.
Claim 27
Dependent Claim
15 words
The method of claim 5, wherein the lid of each package is a one-piece structure.
Claim 28
Dependent Claim
13 words
The method of claim 5, wherein the second sheet is transparent to light.
Claim 29
Dependent Claim
33 words
The method of claim 5, wherein the integrated circuit die has a perimeter, and applying said bead around each integrated circuit die includes contacting a peripheral portion of each die with said bead.
Claim 30
Dependent Claim
36 words
The method of claim 5, wherein the first surface of each package substrate includes a planar metal die pad, and further comprising placing each integrated circuit die on the die pad of the respective package substrate.
Claim 31
Dependent Claim
43 words
The method of claim 28, wherein each die pad has a perimeter that extends beyond a perimeter of the integrated circuit die on the die pad, and further comprising applying said bead so as to cover a peripheral portion of said die pad.
Claim 32
Dependent Claim
23 words
The method of claim 29, further comprising applying said bead so as to contact a peripheral portion of each die with said bead.
Claim 33
Dependent Claim
32 words
The method of claim 29, wherein electrically connecting each integrated circuit die to the electrically conductive path includes connecting a bond wire to a first conductive structure on the integrated circuit die.
Claim 34
Dependent Claim
19 words
The method of claim 31, further comprising covering the bond wire and the first conductive structure with said bead.
Claim 35
Dependent Claim
23 words
The method of claim 31, further comprising covering the first conductive structure with a second adhesive material and hardening the second adhesive material.
Claim 36
Dependent Claim
32 words
The method of claim 5, wherein electrically connecting the integrated circuit die to the electrically conductive path includes connecting a bond wire to a first conductive structure on the integrated circuit die.
Claim 37
Dependent Claim
14 words
The method of claim 34, further comprising covering the bond wire with said bead.
Claim 38
Independent Claim
138 words
A method of making a package containing an integrated circuit die, the method comprising: providing an integrated circuit die; providing a planar substrate having a planar first surface and an electrically conductive path through the substrate; placing the integrated circuit die on the planar first surface of the substrate; electrically connecting a bond wire to a conductive pad on the integrated circuit, said bond wire being electrically connected to the electrically conductive path; applying a bead of an adhesive material on the planar first surface of the substrate around the integrated circuit die, said bead covering the bond wire; providing a planar lid having a planar first surface; placing the planar first surface of the lid onto the bead so that the planar first surface of the lid is above the integrated circuit die; and hardening the bead.
Claim 39
Independent Claim
138 words
A method of making a package containing an integrated circuit die, the method comprising: providing an integrated circuit die; providing a planar substrate having a planar first surface and an electrically conductive path through the substrate; placing the integrated circuit die on the planar first surface of the substrate; electrically connecting a bond wire to a conductive pad on the integrated circuit, said bond wire being electrically connected to the electrically conductive path; applying a bead of an adhesive material on the planar first surface of the substrate around the integrated circuit die, said bead covering the bond wire; providing a planar lid having a planar first surface; placing the planar first surface of the lid onto the bead so that the planar first surface of the lid is above the integrated circuit die; and hardening the bead.
Claim 40
Dependent Claim
15 words
The method of claim 36, further comprising forming vertical peripheral sides around the entire package.
Claim 41
Dependent Claim
27 words
The method of claim 37, wherein applying the bead of viscous first adhesive material includes contacting a peripheral portion of the integrated circuit die with the bead.
References Cited (Backward Citations)
US4159221A
Cited
US4530152A
Cited
JPS629639A
Cited
JPS6297355A
Cited
US5126818A
Cited
US4890383A
Cited
US5230759A
Cited
US5105260A
Cited
US5278429A
Cited
US5250470A
Cited
US5001829A
Cited
US5043004A
Cited
US5192681A
Cited
US5241133A
Cited
US5102829A
Cited
US5422615A
Cited
US5336931A
Cited
US5593926A
Cited
US5414300A
Cited
US5578525A
Cited
US5474957A
Cited
US5436203A
Cited
JPH08213498A
Cited
US5641713A
Cited
US5801074A
Cited
US5742007A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2003-09-12 | 2004-03-13 | 2004-09-12 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2007-09-12 | 2008-03-13 | 2008-09-12 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2011-09-12 | 2012-03-13 | 2012-09-12 | $7700.00 | Window Closed / Lapsed |