US6093636A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Process for manufacture of integrated circuit device using a matrix comprising porous high temperature thermosets
Assignee: International Business Machines Corp
•
Filing: 1998-07-08
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Granted: 2000-07-25
•
Expires: 2018-07-08
Abstract
Abstract The invention relates to a process for forming an integrated circuit device comprising (i) a substrate; (ii) metallic circuit lines positioned on the substrate and (iii) a dielectric material positioned on the circuit lines. The dielectric material comprises porous organic polyarylene ether.
Inventors
- 👤 Kenneth Raymond Carter
- 👤 Daniel Joseph Dawson
- 👤 Craig Jon Hawker
- 👤 James Lupton Hedrick
- 👤 Jeffrey Curtis Hedrick
- 👤 Victor YeeWay Lee
- 👤 Robert Dennis Miller
- 👤 Willi Volksen
- 👤 Do Yeung Yoon
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-03 09:33
CPC Classifications
H; H10; H10P; H10P14/00; H10P14/60; H10P14/68; H10P14/683; H10P14/66; H10P14/665; H10W; H10W20/00; H10W20/01; H10W20/071; H10W20/072; H10W20/40; H10W20/45; H10W20/46; H10W20/48; H10W20/495; H10P14/63; H10P14/6326; H10P14/6342
Claims Analysis
Total Claims: 22
Claim 1
Independent Claim
66 words
A process for forming an integrated circuit comprising: (a) positioning on a substrate a layer of dielectric composition, the composition comprising decomposable polymer and thermosetting resin; (b) heating the composition to condense the thermosetting resin; (c) decomposing the decomposable polymer (d) lithographically patterning the dielectric layer; (e) depositing a metallic film onto the patterned dielectric layer; and (f) planarizing the film to form the integrated circuit.
Claim 2
Dependent Claim
66 words
A process for forming an integrated circuit comprising: (a) positioning on a substrate a layer of dielectric composition, the composition comprising decomposable polymer and thermosetting resin; (b) heating the composition to condense the thermosetting resin; (c) decomposing the decomposable polymer (d) lithographically patterning the dielectric layer; (e) depositing a metallic film onto the patterned dielectric layer; and (f) planarizing the film to form the integrated circuit.
Claim 3
Dependent Claim
17 words
The process of claim 1 wherein the decomposable polymer is decomposed by heating or exposure to radiation.
Claim 4
Dependent Claim
13 words
The process of claim 2 wherein the organic thermosetting resin comprises a polyarylene.
Claim 5
Dependent Claim
30 words
The process of claim 2 wherein the thermosetting resin is selected from the group consisting of a polyimide, a polyarylene, a polyarylene ether, a polybenzazole, a polyisocyanurate, and mixtures thereof.
Claim 6
Dependent Claim
21 words
The process of claim 2 wherein the decomposable polymer is a linear polymer selected from polyester, polystyrene, poly(a-methylstyrene), polyacrylate or polymethacrylate.
Claim 7
Dependent Claim
14 words
The process of claim 2 wherein the decomposable polymer is a cross-linked polymeric nanosphere.
Claim 8
Dependent Claim
12 words
The process of claim 2 wherein the decomposable polymer is hyperbranched polymer.
Claim 9
Dependent Claim
12 words
The process of claim 7 wherein the hyperbranched polymer is a polyester.
Claim 10
Dependent Claim
14 words
The process of claim 1 wherein the decomposable polymer is a star branched polymer.
Claim 11
Dependent Claim
45 words
The process of claim 1 wherein the decomposable polymer is selected from the group consisting of a block copolymer, a star block copolymer, a radial diblock polymer, a graft diblock copolymer, a comb grafted copolymer, a dendigraft copolymer, a tapered block copolymer, and mixtures thereof.
Claim 12
Dependent Claim
62 words
A process for forming an integrated circuit comprising: (a) depositing a metallic film on a substrate; (b) lithographically patterning the metallic film; (c) depositing on the patterned metallic film, a layer of a dielectric composition comprising decomposable polymer and organic thermosetting resin; (d) heating the composition to condense the organic thermosetting resin comprising a polyarylene ether; and (e) decomposing the decomposable polymer.
Claim 13
Dependent Claim
62 words
A process for forming an integrated circuit comprising: (a) depositing a metallic film on a substrate; (b) lithographically patterning the metallic film; (c) depositing on the patterned metallic film, a layer of a dielectric composition comprising decomposable polymer and organic thermosetting resin; (d) heating the composition to condense the organic thermosetting resin comprising a polyarylene ether; and (e) decomposing the decomposable polymer.
Claim 14
Dependent Claim
17 words
The process of claim 11 wherein the decomposable polymer is decomposed by heating or exposure to radiation.
Claim 15
Dependent Claim
13 words
The process of claim 11 wherein the organic thermosetting resin comprises a polyarylene.
Claim 16
Dependent Claim
29 words
The process of claim 11 wherein the thermosetting resin is selected from the group consisting of a polyimide, a polyarylene, a polyarylene ether, polybenzazoles, a polyisocyanurate, and mixtures thereof.
Claim 17
Dependent Claim
21 words
A process of claim 12 wherein the decomposable polymer is a linear polymer selected from polyester, polystyrene, poly(a-methylstyrene), polyacrylate or polymethacrylate.
Claim 18
Dependent Claim
14 words
The process of claim 12 wherein the decomposable polymer is a cross-linked polymeric nanosphere.
Claim 19
Dependent Claim
12 words
The process of claim 11 wherein the decomposable polymer is hyperbranched polymer.
Claim 20
Dependent Claim
12 words
The process of claim 17 wherein the hyperbranched polymer is a polyester.
Claim 21
Dependent Claim
14 words
The process of claim 1 wherein the decomposable polymer is a star branched polymer.
Claim 22
Dependent Claim
45 words
The process of claim 11 wherein the decomposable polymer is selected from the group consisting of a block copolymer, a star block copolymer, a radial diblock copolymer, a graft diblock copolymer, a comb grafted copolymer, a dendigraft copolymer, a tapered block copolymer, and mixtures thereof.
References Cited (Backward Citations)
US3547839A
Cited
US3732181A
Cited
US3900320A
Cited
US3917761A
Cited
US4141877A
Cited
GB2006643A
Cited
US5130025A
Cited
US4457972A
Cited
US4623463A
Cited
US4535099A
Cited
US4761233A
Cited
JPS63172741A
Cited
JPS63278943A
Cited
US4920402A
Cited
US5304515A
Cited
US5043369A
Cited
US5036145A
Cited
US5114826A
Cited
US5198203A
Cited
EP0524930B1
Cited
US5206337A
Cited
US5288842A
Cited
US5252654A
Cited
JPH05205526A
Cited
US5188777A
Cited
US5183607A
Cited
US5420232A
Cited
US5498689A
Cited
US5412016A
Cited
US5384376A
Cited
US5412160A
Cited
US5470801A
Cited
US5521424A
Cited
US5461003A
Cited
US5523615A
Cited
US5847443A
Cited
WO1997001593A1
Cited
EP0755957A1
Cited
US5658994A
Cited
WO1997010193A1
Cited
US5747381A
Cited
US5633034A
Cited
US5767014A
Cited
US5773197A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2003-07-25 | 2004-01-24 | 2004-07-25 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2007-07-25 | 2008-01-24 | 2008-07-25 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2011-07-25 | 2012-01-24 | 2012-07-25 | $7700.00 | Window Closed / Lapsed |