US5633034A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Process for forming a circuit assembly
Assignee: International Business Machines Corp
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Filing: 1996-05-09
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Granted: 1997-05-27
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Expires: 2016-05-09
Abstract
Abstract The invention relates to a process for forming a circuit assembly comprising (i) coating onto a substrate a layer of polyamic ester selected from a unique class of polyamic esters; (ii) imidizing the polyamic ester to form a layer of polyimide having an even surface and (iii) forming circuit conductors on the even surface of the polyimide.
Inventors
- 👤 Kenneth R. Carter
- 👤 Richard A. DiPietro
- 👤 James L. Hedrick
- 👤 John P. Hummel
- 👤 Robert D. Miller
- 👤 Martha I. Sanchez
- 👤 Willi Volksen
- 👤 Do Y. Yoon
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-03 23:17
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/60; H10W70/67; H10W70/69; C; C08; C08G; C08G73/00; C08G73/06; C08G73/10; C08G73/1003; C08G73/1007; C08G73/1039; H10W20/00; H10W20/40; H10W20/45; H10W20/48; H05; H05K; H05K1/00; H05K1/02; H05K1/03; H05K1/0313; H05K1/032; H05K1/0346; H05K3/00; H05K3/46; H05K3/4644; H05K3/4673; H05K3/4676
Claims Analysis
Total Claims: 5
Claim 1
Independent Claim
84 words
A process for forming a circuit assembly comprising (i) coating a layer of polyamic ester onto a substrate, the polyamic ester having the repeat unit: ##STR4## wherein Q is selected from: ##STR5## where X is selected from oxygen, carbonyl or C(CF 3 ) 2 ; R" is: ##STR6## and R and R' are alkyl or haloalkyl; (ii) heating the layer to imidize the polyamic ester and form a layer of polyimide; and (iii) forming circuit lines on the surface of the layer of polyimide.
Claim 2
Dependent Claim
84 words
A process for forming a circuit assembly comprising (i) coating a layer of polyamic ester onto a substrate, the polyamic ester having the repeat unit: ##STR4## wherein Q is selected from: ##STR5## where X is selected from oxygen, carbonyl or C(CF 3 ) 2 ; R" is: ##STR6## and R and R' are alkyl or haloalkyl; (ii) heating the layer to imidize the polyamic ester and form a layer of polyimide; and (iii) forming circuit lines on the surface of the layer of polyimide.
Claim 3
Dependent Claim
72 words
A process for forming a circuit assembly comprising (i) coating a layer of polyamic ester onto a substrate, the polyamic ester having the repeat unit: ##STR7## wherein Q is selected from ##STR8## R" is: ##STR9## and R and R' are lower alkyl or haloalkyl; (ii) heating the layer to imidize the polyamic ester and form a layer of polyimide; and (iii) forming circuit lines on the surface of the layer of polyimide.
Claim 4
Dependent Claim
72 words
A process for forming a circuit assembly comprising (i) coating a layer of polyamic ester onto a substrate, the polyamic ester having the repeat unit: ##STR7## wherein Q is selected from ##STR8## R" is: ##STR9## and R and R' are lower alkyl or haloalkyl; (ii) heating the layer to imidize the polyamic ester and form a layer of polyimide; and (iii) forming circuit lines on the surface of the layer of polyimide.
Claim 5
Dependent Claim
14 words
The process of claim 2 wherein the circuit assembly is a circuit packaging structure.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2000-05-26 | 2000-11-25 | 2001-05-27 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2004-05-26 | 2004-11-25 | 2005-05-27 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2008-05-26 | 2008-11-25 | 2009-05-27 | $7700.00 | Window Closed / Lapsed |