Patent US6062133A successfully refreshed from Google Patents.
US6062133A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Global planarization method and apparatus
Assignee: Round Rock Research LLC
•
Filing: 1999-04-07
•
Granted: 2000-05-16
•
Expires: 2019-04-07
Abstract
Abstract An apparatus for performing a global planarization of a surface of a deformable layer of a wafer on a production scale. The apparatus includes a chamber having a pressing surface and containing a rigid plate and a flexible pressing member or "puck" disposed between the rigid plate and the pressing surface. A wafer having a deformable outermost layer is placed on the flexible pressing member so the deformable layer of the wafer is directly opposite and substantially parallel to the pressing surface. Force is applied to the rigid plate which propagates through the flexible pressing member to press the deformable layer of the wafer against the pressing surface. Preferably, a bellows arrangement is used to ensure a uniformly applied force to the rigid plate. The flexible puck serves to provide a self adjusting mode of uniformly distributing the applied force to the wafer, ensuring the formation of a high quality planar surface. The surface of the wafer assumes the shape of the pressing surface and is hardened in a suitable manner while under pressure to produce a globally planarized surface on the wafer. After the force is removed from the rigid plate, lift pins are slidably inserted through the rigid plate and the flexible pressing member to lift the wafer off of the surface of the flexible pressing member.
Inventors
- 👤 Guy Blalock
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-02 23:24
CPC Classifications
B; B29; B29C; B29C43/00; B29C43/32; B29C43/56; B30; B30B; B30B1/00; B30B1/003; B30B15/00; B30B15/06; B30B15/061; H; H10; H10P; H10P72/00; H10P72/70; H10P72/76; H10P72/7604; H10P72/7612; H10P72/7616; H10P72/7624; B29C2043/561
Claims Analysis
Total Claims: 63
Claim 1
Independent Claim
208 words
An apparatus for performing global planarization of a deformable surface of a wafer comprising: a chamber body having an interior surface and first and second ends; a base plate attached to and closing said first end of said chamber body, said base plate having an inner surface; a press plate attached to and closing said second end of said chamber body, said press plate having a pressing surface, said pressing surface, said inner surface and said interior surface defining a chamber; a rigid plate having a top surface and a bottom surface disposed within said chamber, said top surface being substantially parallel to said pressing surface, said rigid plate distributing an applied force to said wafer; a flexible pressing puck member having upper and lower surfaces, said lower surface of said flexible pressing puck member being seated on said top surface of said rigid plate, said upper surface of said flexible pressing puck member being directly opposite to said pressing surface, said flexible pressing puck member distributing an applied force thereto by said rigid plate to said wafer; and a drive for uniformly applying force to said bottom surface of said rigid plate to drive said rigid plate and said flexible pressing puck member toward said pressing surface.
Claim 2
Independent Claim
208 words
An apparatus for performing global planarization of a deformable surface of a wafer comprising: a chamber body having an interior surface and first and second ends; a base plate attached to and closing said first end of said chamber body, said base plate having an inner surface; a press plate attached to and closing said second end of said chamber body, said press plate having a pressing surface, said pressing surface, said inner surface and said interior surface defining a chamber; a rigid plate having a top surface and a bottom surface disposed within said chamber, said top surface being substantially parallel to said pressing surface, said rigid plate distributing an applied force to said wafer; a flexible pressing puck member having upper and lower surfaces, said lower surface of said flexible pressing puck member being seated on said top surface of said rigid plate, said upper surface of said flexible pressing puck member being directly opposite to said pressing surface, said flexible pressing puck member distributing an applied force thereto by said rigid plate to said wafer; and a drive for uniformly applying force to said bottom surface of said rigid plate to drive said rigid plate and said flexible pressing puck member toward said pressing surface.
Claim 3
Dependent Claim
39 words
The apparatus of claim 1, further comprising a stand off bracket attached to said inner surface of said base plate between said rigid plate and said base plate for restricting movement of said rigid plate toward said base plate.
Claim 4
Dependent Claim
15 words
The apparatus of claim 1, wherein said press plate comprises a highly polished pressing surface.
Claim 5
Dependent Claim
41 words
The apparatus of claim 1, wherein said drive comprises a pneumatic lift attached between said bottom surface of said rigid plate and said inner surface of said base plate, and means for supplying pneumatic fluid under pressure to said pneumatic lift.
Claim 6
Dependent Claim
23 words
The apparatus of claim 1, further comprising a lift for lifting said wafer off said upper surface of said flexible pressing puck member.
Claim 7
Dependent Claim
28 words
The apparatus of claim 1, wherein said flexible pressing puck member is formed from a material selected from the group consisting of silicone, silicone-based rubbers and combinations thereof.
Claim 8
Independent Claim
61 words
An apparatus for globally planarizing a surface of an object, comprising: a press plate having a pressing surface; a rigid plate having a top surface opposing said pressing surface; and a pressing puck member positioned on said top surface opposing said pressing surface to distribute a force applied to said pressing puck member using said press plate and said rigid plate.
Claim 9
Independent Claim
61 words
An apparatus for globally planarizing a surface of an object, comprising: a press plate having a pressing surface; a rigid plate having a top surface opposing said pressing surface; and a pressing puck member positioned on said top surface opposing said pressing surface to distribute a force applied to said pressing puck member using said press plate and said rigid plate.
Claim 10
Dependent Claim
25 words
The apparatus of claim 7, wherein the applied force is applied to said rigid plate to press said pressing puck member against said press plate.
Claim 11
Dependent Claim
16 words
The apparatus of claim 7, wherein said pressing puck member is deformable under the applied force.
Claim 12
Dependent Claim
15 words
The apparatus of claim 9, wherein said pressing puck member is comprised of silicone rubber.
Claim 13
Dependent Claim
19 words
The apparatus of claim 9, wherein said pressing puck member deforms under the applied force to apply the force.
Claim 14
Dependent Claim
64 words
The apparatus of claim 7, wherein: said rigid plate is substantially parallel to said pressing surface; and said pressing puck member has substantially parallel upper and lower surfaces, said lower surface of said pressing puck member being seated on said top surface of said rigid plate, said upper surface of said pressing puck member being directly opposite and substantially parallel to said pressing surface.
Claim 15
Dependent Claim
98 words
The apparatus of claim 7, further comprising: a chamber body having an interior surface and first and second ends; a base plate attached to and closing said first end of said chamber body, said base plate having an inner surface; and a drive for applying a force to be applied by said pressing puck member, and, wherein, said press plate is attached to said second end of said chamber body, said pressing surface, said inner surface and said interior surface defining a closed chamber, and said rigid plate and said pressing puck member are disposed within said chamber.
Claim 16
Dependent Claim
29 words
The apparatus of claim 13, wherein said drive is attached to said rigid plate opposite to said top surface to press said pressing puck member against said pressing surface.
Claim 17
Independent Claim
172 words
An apparatus for performing global planarization of a deformable surface of a wafer comprising: a chamber body having an interior surface and first and second ends; a base plate attached to and closing said first end of said chamber body, said base plate having an inner surface; a press plate attached to and closing said second end of said chamber body, said press plate having a pressing surface, said pressing surface, said inner surface and said interior surface defining a chamber; a rigid plate having a top surface and a bottom surface disposed within said chamber, said top surface being substantially parallel to said pressing surface; a pressing puck having upper and lower surfaces, said lower surface of said pressing puck being seated on said top surface of said rigid plate, said upper surface of said pressing puck being directly opposite said pressing surface; and a drive for uniformly applying force to said bottom surface of said rigid plate to drive said rigid plate and said pressing puck toward said pressing surface.
Claim 18
Independent Claim
172 words
An apparatus for performing global planarization of a deformable surface of a wafer comprising: a chamber body having an interior surface and first and second ends; a base plate attached to and closing said first end of said chamber body, said base plate having an inner surface; a press plate attached to and closing said second end of said chamber body, said press plate having a pressing surface, said pressing surface, said inner surface and said interior surface defining a chamber; a rigid plate having a top surface and a bottom surface disposed within said chamber, said top surface being substantially parallel to said pressing surface; a pressing puck having upper and lower surfaces, said lower surface of said pressing puck being seated on said top surface of said rigid plate, said upper surface of said pressing puck being directly opposite said pressing surface; and a drive for uniformly applying force to said bottom surface of said rigid plate to drive said rigid plate and said pressing puck toward said pressing surface.
Claim 19
Dependent Claim
15 words
The apparatus of claim 15, wherein said press plate comprises a highly polished pressing surface.
Claim 20
Dependent Claim
21 words
The apparatus of claim 15, further comprising: a lift for lifting said wafer off said upper surface of said pressing puck.
Claim 21
Dependent Claim
28 words
The apparatus of claim 15, wherein said pressing puck is formed from a material that will sufficiently deform upon application of said force applied to said rigid plate.
Claim 22
Dependent Claim
26 words
The apparatus of claim 18, wherein said pressing puck is formed from a material selected from the group consisting of silicone, silicone-based rubbers and combinations thereof.
Claim 23
Independent Claim
60 words
An apparatus for globally planarizing a surface, comprising: a press plate having a pressing surface; a rigid plate having a top surface opposing said pressing surface; and a puck member positioned on said top surface of said rigid plate opposing said pressing surface to apply a force applied to said puck member using said press plate and said rigid plate.
Claim 24
Independent Claim
60 words
An apparatus for globally planarizing a surface, comprising: a press plate having a pressing surface; a rigid plate having a top surface opposing said pressing surface; and a puck member positioned on said top surface of said rigid plate opposing said pressing surface to apply a force applied to said puck member using said press plate and said rigid plate.
Claim 25
Dependent Claim
28 words
The apparatus of claim 20, wherein the force applied to said puck member is applied to said rigid plate to press said puck member against said press plate.
Claim 26
Dependent Claim
16 words
The apparatus of claim 20, wherein said puck member is deformable under the force applied thereto.
Claim 27
Dependent Claim
12 words
The apparatus of claim 20, wherein said puck member comprises silicone rubber.
Claim 28
Dependent Claim
15 words
The apparatus of claim 20, wherein said puck member deforms under the force applied thereto.
Claim 29
Dependent Claim
61 words
The apparatus of claim 20, wherein: said rigid plate is substantially parallel to said pressing surface; and said puck member has substantially parallel upper and lower surfaces, said lower surface of said puck member being seated on said top surface of said rigid plate, said upper surface of said puck member being directly opposite and substantially parallel to said pressing surface.
Claim 30
Independent Claim
180 words
An apparatus for performing global planarization of a deformable surface of a wafer comprising: a chamber body having an interior surface and first and second ends; a base plate attached to and closing said first end of said chamber body, said base plate having an inner surface; a press plate attached to and closing said second end of said chamber body, said press plate having a pressing surface, said pressing surface, said inner surface and said interior surface defining a chamber; a rigid plate having a top surface and a bottom surface disposed within said chamber, said top surface being substantially parallel to said pressing surface; a force distribution puck having upper and lower surfaces, said lower surface of said force distribution puck being seated on said top surface of said rigid plate, said upper surface of said force distribution puck being directly opposite and substantially parallel to said pressing surface; and a drive for applying a force to said bottom surface of said rigid plate to drive said rigid plate and said force distribution puck toward said pressing surface.
Claim 31
Independent Claim
180 words
An apparatus for performing global planarization of a deformable surface of a wafer comprising: a chamber body having an interior surface and first and second ends; a base plate attached to and closing said first end of said chamber body, said base plate having an inner surface; a press plate attached to and closing said second end of said chamber body, said press plate having a pressing surface, said pressing surface, said inner surface and said interior surface defining a chamber; a rigid plate having a top surface and a bottom surface disposed within said chamber, said top surface being substantially parallel to said pressing surface; a force distribution puck having upper and lower surfaces, said lower surface of said force distribution puck being seated on said top surface of said rigid plate, said upper surface of said force distribution puck being directly opposite and substantially parallel to said pressing surface; and a drive for applying a force to said bottom surface of said rigid plate to drive said rigid plate and said force distribution puck toward said pressing surface.
Claim 32
Dependent Claim
15 words
The apparatus of claim 26, wherein said press plate comprises a highly polished pressing surface.
Claim 33
Dependent Claim
22 words
The apparatus of claim 26, further comprising: a lift for lifting said wafer off said upper surface of said force distribution puck.
Claim 34
Dependent Claim
24 words
The apparatus of claim 26, wherein said force distribution puck is formed from a material that will sufficiently deform upon applying a force thereto.
Claim 35
Dependent Claim
28 words
The apparatus of claim 26, wherein said force distribution puck is formed from a material selected from the group consisting of silicone, silicone based rubbers and combinations thereof.
Claim 36
Independent Claim
55 words
A method for globally planarizing a surface of a semiconductor wafer comprising: providing a pressing surface; placing said wafer on one side of a pressing puck; and applying a force to a rigid plate adjacent to another side of said pressing puck to cause said surface of said wafer to correspond to said pressing surface.
Claim 37
Independent Claim
55 words
A method for globally planarizing a surface of a semiconductor wafer comprising: providing a pressing surface; placing said wafer on one side of a pressing puck; and applying a force to a rigid plate adjacent to another side of said pressing puck to cause said surface of said wafer to correspond to said pressing surface.
Claim 38
Dependent Claim
22 words
The method of claim 31, further comprising: curing said surface of said wafer to maintain a shape corresponding to said pressing surface.
Claim 39
Dependent Claim
20 words
The method of claim 31, further comprising: providing said wafer, pressing puck, rigid plate and pressing surface in an apparatus.
Claim 40
Dependent Claim
20 words
The method of claim 31, further comprising: controlling the temperature of the wafer while applying said force to said wafer.
Claim 41
Independent Claim
103 words
A method for globally planarizing a surface of a wafer comprising: providing a pressing puck seated on a rigid plate, and a planar pressing surface directly opposable to the pressing puck, the pressing puck being deformable under a force to distribute the force between the rigid plate and the pressing surface; placing a wafer having a surface to be planarized on the pressing puck; and applying a force using the rigid plate and the planar pressing surface to deform the pressing puck which applies the force to the surface of the wafer to cause the surface to correspond to the planar pressing surface.
Claim 42
Independent Claim
103 words
A method for globally planarizing a surface of a wafer comprising: providing a pressing puck seated on a rigid plate, and a planar pressing surface directly opposable to the pressing puck, the pressing puck being deformable under a force to distribute the force between the rigid plate and the pressing surface; placing a wafer having a surface to be planarized on the pressing puck; and applying a force using the rigid plate and the planar pressing surface to deform the pressing puck which applies the force to the surface of the wafer to cause the surface to correspond to the planar pressing surface.
Claim 43
Dependent Claim
25 words
The method of claim 35, further comprising: the step of curing the surface of said wafer to maintain a shape corresponding to the pressing surface.
Claim 44
Dependent Claim
44 words
The method of claim 35, wherein: said step of providing a pressing surface further comprises providing a pressing surface having a highly polished surface; and said step of placing further comprises placing a wafer having an ultraviolet radiation curable surface on the pressing puck.
Claim 45
Dependent Claim
30 words
The method of claim 35, wherein said step of applying further comprises applying a force to the rigid plate to drive the surface of the wafer against the pressing surface.
Claim 46
Dependent Claim
24 words
The method of claim 35, wherein said step of providing a pressing puck further comprises providing a pressing puck comprised of a silicone rubber.
Claim 47
Dependent Claim
24 words
The method of claim 35, wherein said step of providing a pressing puck further comprises providing a pressing puck comprising a silicone rubber puck.
Claim 48
Dependent Claim
40 words
The method of claim 35, further comprising the steps of: releasing the applied force to retract the surface of the wafer from the pressing surface; lifting the wafer off the pressing puck; and removing the wafer from the pressing puck.
Claim 49
Dependent Claim
13 words
The method of claim 35, further comprising: controlling the temperature of the wafer.
Claim 50
Independent Claim
105 words
A method for globally planarizing a surface of a wafer comprising: providing a resilient puck seated on a rigid plate, and a planar pressing surface directly opposable to the resilient puck, the resilient puck being sufficiently deformable under an applied force to apply the force between the rigid plate and the pressing surface; placing a wafer having a surface to be planarized on the resilient puck; and applying a force using the rigid plate and the planar pressing surface to deform the resilient puck which applies the force to the surface of the wafer to cause the surface to correspond to the planar pressing surface.
Claim 51
Independent Claim
105 words
A method for globally planarizing a surface of a wafer comprising: providing a resilient puck seated on a rigid plate, and a planar pressing surface directly opposable to the resilient puck, the resilient puck being sufficiently deformable under an applied force to apply the force between the rigid plate and the pressing surface; placing a wafer having a surface to be planarized on the resilient puck; and applying a force using the rigid plate and the planar pressing surface to deform the resilient puck which applies the force to the surface of the wafer to cause the surface to correspond to the planar pressing surface.
Claim 52
Dependent Claim
25 words
The method of claim 43, further comprising: the step of curing the surface of said wafer to maintain a shape corresponding to the pressing surface.
Claim 53
Dependent Claim
44 words
The method of claim 43, wherein: said step of providing a pressing surface further comprises providing a pressing surface having a highly polished surface; and said step of placing further comprises placing a wafer having an ultraviolet radiation curable surface on the resilient puck.
Claim 54
Dependent Claim
30 words
The method of claim 43, wherein said step of applying further comprises applying a force to the rigid plate to drive the surface of the wafer against the pressing surface.
Claim 55
Dependent Claim
24 words
The method of claim 43, wherein said step of providing a resilient puck further comprises providing a resilient puck comprised of a silicone rubber.
Claim 56
Dependent Claim
24 words
The method of claim 43, wherein said step of providing a resilient puck further comprises providing a resilient puck comprising a silicone rubber puck.
Claim 57
Dependent Claim
40 words
The method of claim 43, further comprising the steps of: releasing the applied force to retract the surface of the wafer from the pressing surface; lifting the wafer off the resilient puck; and removing the wafer from the resilient puck.
Claim 58
Dependent Claim
13 words
The method of claim 43, further comprising: controlling the temperature of the wafer.
Claim 59
Independent Claim
55 words
A method for globally planarizing a surface of a semiconductor wafer comprising: providing a pressing surface; placing said wafer on one side of a flexible puck; and applying a force to a rigid plate adjacent to another side of said flexible puck to cause said surface of said wafer to correspond to said pressing surface.
Claim 60
Independent Claim
55 words
A method for globally planarizing a surface of a semiconductor wafer comprising: providing a pressing surface; placing said wafer on one side of a flexible puck; and applying a force to a rigid plate adjacent to another side of said flexible puck to cause said surface of said wafer to correspond to said pressing surface.
Claim 61
Dependent Claim
22 words
The method of claim 51, further comprising: curing said surface of said wafer to maintain a shape corresponding to said pressing surface.
Claim 62
Dependent Claim
20 words
The method of claim 51, further comprising: providing said wafer, flexible puck, rigid plate and pressing surface in an apparatus.
Claim 63
Dependent Claim
20 words
The method of claim 51, further comprising: controlling the temperature of the wafer while applying said force to said wafer.
References Cited (Backward Citations)
US1777310A
Cited
US2373770A
Cited
US2431943A
Cited
US4234373A
Cited
US3120205A
Cited
US3135998A
Cited
GB998210A
Cited
US3850559A
Cited
US4476780A
Cited
US4734155A
Cited
US4810672A
Cited
US4700474A
Cited
US5302343A
Cited
US5736424A
Cited
US4806195A
Cited
US5078820A
Cited
WO1990012683A1
Cited
US5049232A
Cited
US5261997A
Cited
US5122848A
Cited
US5250450A
Cited
US5618381A
Cited
US5286329A
Cited
US5300801A
Cited
US5238862A
Cited
US5314843A
Cited
US5643837A
Cited
US5624304A
Cited
US5624300A
Cited
US5232875A
Cited
US5300155A
Cited
US5302233A
Cited
US5624299A
Cited
US5558015A
Cited
US5434107A
Cited
US5643046A
Cited
EP0683511A2
Cited
US5533924A
Cited
US5575707A
Cited
US5679610A
Cited
US5554065A
Cited
US5643406A
Cited
US5569062A
Cited
US5624303A
Cited
US5639697A
Cited
US5643050A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2003-05-16 | 2003-11-15 | 2004-05-16 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2007-05-16 | 2007-11-15 | 2008-05-16 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2011-05-16 | 2011-11-15 | 2012-05-16 | $7700.00 | Window Closed / Lapsed |